公开(公告)号：US20240135846A1

公开(公告)日：2024-04-25

申请号：US18468752

申请日：2023-09-17

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Fang-Ying Lin ,  Ming-Chang Lin ,  Tsau-Hua Hsieh

IPC: G09G3/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L25/0753 ,  H01L33/62 ,  G09G2330/12

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following. A substrate is provided. A plurality of electronic units are transferred to the substrate. The electronic units are inspected to obtain M first defect maps. The M first defect maps are integrated into N second defect maps, where N

公开(公告)号：US20240014063A1

公开(公告)日：2024-01-11

申请号：US17861258

申请日：2022-07-11

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Fang-Ying Lin ,  Tsau-Hua Hsieh

IPC: H01L21/677 ,  H01L21/304 ,  H01L21/67

CPC classification number: H01L21/6779 ,  H01L21/3043 ,  H01L21/67103

Abstract: A method of manufacturing a semiconductor device including the following steps is provided herein. A semiconductor substrate is provided. The semiconductor substrate is transferred to a carrier. The semiconductor substrate on the carrier is diced into a plurality of semiconductor 5 components. A target substrate is provided. At least one of the semiconductor components is transferred onto the target substrate.

公开(公告)号：US11616166B2

公开(公告)日：2023-03-28

申请号：US17103971

申请日：2020-11-25

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075

Abstract: A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.

公开(公告)号：US11616165B2

公开(公告)日：2023-03-28

申请号：US16808303

申请日：2020-03-03

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L21/687 ,  H01L25/075

Abstract: The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.

公开(公告)号：US20170358604A1

公开(公告)日：2017-12-14

申请号：US15598327

申请日：2017-05-18

Applicant: Innolux Corporation

Inventor： Kuan-Feng Lee ,  Jui-Jen Yueh ,  Yi-An Chen ,  Kai Cheng ,  Fang-Ying Lin ,  Tsau-Hua Hsieh

IPC: H01L27/12 ,  H01L33/44 ,  G06F3/044 ,  H01L33/58

CPC classification number: H01L27/124 ,  G06F3/044 ,  H01L33/44 ,  H01L33/58

Abstract: A display apparatus includes an array substrate, a light emitting element, and a light shielding layer. The light emitting element is disposed on the array substrate and includes a first upper surface. The light shielding layer is disposed on a periphery of the light emitting element and includes a second upper surface. A distance between the first upper surface and the second upper surface in a direction perpendicular to the array substrate is between 0 and 5 μm.

公开(公告)号：US20250089178A1

公开(公告)日：2025-03-13

申请号：US18959682

申请日：2024-11-26

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Fang-Ying Lin ,  Tsau-Hua Hsieh

IPC: H05K3/30 ,  H05K1/18

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.

公开(公告)号：US12193167B2

公开(公告)日：2025-01-07

申请号：US18495763

申请日：2023-10-27

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Fang-Ying Lin ,  Tsau-Hua Hsieh

IPC: H10K71/00 ,  H01L21/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/48 ,  H01L23/544 ,  H01L25/18 ,  H01L27/12 ,  H01L33/12 ,  H01L33/16 ,  H01L33/30 ,  H01L33/32 ,  H01L33/38 ,  H01L33/62 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  H10K71/70

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

公开(公告)号：US20240339559A1

公开(公告)日：2024-10-10

申请号：US18743090

申请日：2024-06-13

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L21/687 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L21/68714 ,  H01L25/0753 ,  H01L2933/0016

Abstract: A method for manufacturing an electronic device and a transferring head are provided. The method includes providing a plurality of microcomponents on a first substrate; providing a transferring head, wherein the transferring head includes a substrate and a head unit disposed on a side of the substrate, the head unit includes a layer, and the layer has a first portion and a second portion, wherein a thickness of the first portion is greater than a thickness of the second portion, and a difference between the thickness of the first portion and the thickness of the second portion is greater than or equal to 20 μm and less than or equal to 70 μm; contacting at least one microcomponent by a picking surface of the first portion; and transferring the microcomponent from the first substrate to a second substrate by the transferring head.

公开(公告)号：US11876081B2

公开(公告)日：2024-01-16

申请号：US18321004

申请日：2023-05-22

Applicant: Innolux Corporation

Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

IPC: H01L25/075 ,  H01L21/66 ,  H01L25/16

CPC classification number: H01L25/0753 ,  H01L22/22 ,  H01L25/167

Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. A spacer is disposed on the substrate and has a first opening, a second opening and a third opening arranged in a first direction. The second opening is located between the first opening and the third opening. A distance between the first opening and the second opening is less than a distance between the second opening and the third opening in the first direction. A first element is located in at least one of the first opening and the second opening. A second element is located in the third opening.

公开(公告)号：US20230389191A1

公开(公告)日：2023-11-30

申请号：US17752868

申请日：2022-05-25

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Fang-Ying Lin ,  Tsau-Hua Hsieh

IPC: H05K3/30 ,  H05K1/18

CPC classification number: H05K3/301 ,  H05K1/183 ,  H05K2203/16

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.