公开(公告)号：US11551994B2

公开(公告)日：2023-01-10

申请号：US16139401

申请日：2018-09-24

Applicant: Intel Corporation

Inventor： Kelly Lofgreen ,  Chia-Pin Chiu ,  Joseph Petrini ,  Edvin Cetegen ,  Betsegaw Gebrehiwot ,  Feras Eid

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00

Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.

公开(公告)号：US20220397726A1

公开(公告)日：2022-12-15

申请号：US17344213

申请日：2021-06-10

Applicant: Intel Corporation

Inventor： Omkar Karhade ,  Tolga Acikalin ,  Sushrutha Gujjula ,  Kelly Lofgreen ,  Ravindranath Mahajan ,  Chia-pin Chiu

IPC: G02B6/42 ,  F21V8/00

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.

公开(公告)号：US11464139B2

公开(公告)日：2022-10-04

申请号：US16180499

申请日：2018-11-05

Applicant: Intel Corporation

Inventor： Kelly Lofgreen ,  Joseph Petrini ,  Todd Coons ,  Christopher Wade Ackerman ,  Edvin Cetegen ,  Yang Jiao ,  Michael Rutigliano ,  Kuang Liu

IPC: H05K7/20

Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

公开(公告)号：US20210134698A1

公开(公告)日：2021-05-06

申请号：US16672858

申请日：2019-11-04

Applicant: Intel Corporation

Inventor： Kyle J. Arrington ,  Aaron McCann ,  Kelly Lofgreen ,  Elah Bozorg-Grayeli ,  Aravindha Antoniswamy ,  Joseph B. Petrini

IPC: H01L23/373 ,  H01L23/00 ,  H01L25/00

Abstract: A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate. The thermal interface structure may be used in an integrated circuit assembly or package between at least one integrated circuit device and a heat dissipation device.

公开(公告)号：US20200294884A1

公开(公告)日：2020-09-17

申请号：US16355596

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Je-Young Chang ,  Kelly Lofgreen ,  Weihua Tang ,  Aastha Uppal

IPC: H01L23/38 ,  H01L35/10 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30

Abstract: An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.