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公开(公告)号:US20220327083A1
公开(公告)日:2022-10-13
申请号:US17844366
申请日:2022-06-20
Applicant: Intel Corporation
Inventor: Debendra Das Sharma , Swadesh Choudhary , Narasimha Lanka , Zuoguo Wu , Gerald Pasdast , Lakshmipriya Seshan
IPC: G06F13/42 , H01L23/538 , G06F13/40
Abstract: In one embodiment, a first die comprises: a first die-to-die adapter to communicate with first protocol layer circuitry via a flit-aware die-to-die interface (FDI) and first physical layer circuitry via a raw die-to-die interface (RDI), where the first die-to-die adapter is to receive message information comprising first information of a first interconnect protocol; and the first physical layer circuitry coupled to the first die-to-die adapter. The first physical layer circuitry may be configured to receive and output the first information to a second die via an interconnect, the first physical layer circuitry comprising a plurality of modules, each of the plurality of modules comprising an analog front end having transmitter circuitry and receiver circuitry. Other embodiments are described and claimed.
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公开(公告)号:US20210344354A1
公开(公告)日:2021-11-04
申请号:US17359517
申请日:2021-06-26
Applicant: Intel Corporation
Inventor: Narasimha Lanka , Lakshmipriya Seshan , Debendra Das Sharma , Zuoguo Wu , Gerald S. Pasdast
Abstract: In one embodiment, an apparatus includes PHY circuitry to implement a PHY-based retry technique, e.g., in die-to-die interfaces. The PHY circuitry includes a retry buffer to buffer data provided by the interface controller and error detection code generation circuitry to generate error detection codes based on input data. The PHY circuitry is to implement the retry technique by detecting a stall signal asserted by another apparatus across the channel, causing the error detection code generation circuitry to generate error detection codes based on data in the retry buffer, and transmitting the data from the retry buffer and its corresponding error detection codes across the channel to the other apparatus.
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公开(公告)号:US20200251159A1
公开(公告)日:2020-08-06
申请号:US16854280
申请日:2020-04-21
Applicant: Intel Corporation
Inventor: Narasimha Lanka , Kuljit Bains , Lakshmipriya Seshan
IPC: G11C11/4063 , H01L27/108 , H01L27/06 , H01L23/538 , G11C5/06
Abstract: An embodiment of a memory apparatus may include a memory core, a plurality of through-silicon vias (TSVs), and data bus inversion logic coupled between the memory core and the TSVs to encode and decode a data signal on a signal path through the TSVs in accordance with a data bus inversion of the data signal. Other embodiments are disclosed and claimed.
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公开(公告)号:US20180253398A1
公开(公告)日:2018-09-06
申请号:US15636738
申请日:2017-06-29
Applicant: Intel Corporation
Inventor: Zuoguo Wu , Debendra Das Sharma , Mohiuddin M. Mazumder , Jong-Ru Guo , Anupriya Sriramulu , Narasimha Lanka , Timothy Wig , Jeff Morriss
IPC: G06F15/173 , H01L23/522 , H03K19/177 , G06F15/16 , H01L21/768 , G06F9/28
Abstract: A device includes a receiver to receive one or more training sequences during a training of a link, where the link connects two devices. The device may include agent logic to determine, from the one or more training sequences, a number of extension devices on the link between the two devices, and determine that the number of extension devices exceeds a threshold number. The device may include a transmitter to send a plurality of clock compensation ordered sets on the link based on determining that the number of extension devices exceeds a threshold number.
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公开(公告)号:US20230258716A1
公开(公告)日:2023-08-17
申请号:US18129315
申请日:2023-03-31
Applicant: Intel Corporation
Inventor: Swadesh Choudhary , Debendra Das Sharma , Gerald Pasdast , Zuogo Wu , Narasimha Lanka , Lakshmipriya Seshan
IPC: G01R31/3183 , G01R31/317
CPC classification number: G01R31/318314 , G01R31/31712 , G01R31/31718
Abstract: Techniques to perform semiconductor testing are described. Test equipment may test a chiplet for compliance with a semiconductor specification. A test device may connect to a test package with a model chiplet and a device under test (DUT) chiplet. The model chiplet may comprise a known good model (KGM) of the semiconductor specification. The test device may use the model chiplet to test the DUT chiplet. Other embodiments are described and claimed.
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公开(公告)号:US20220327276A1
公开(公告)日:2022-10-13
申请号:US17844356
申请日:2022-06-20
Applicant: Intel Corporation
Inventor: Lakshmipriya Seshan , Gerald Pasdast , Peipei Wang , Narasimha Lanka , Swadesh Choudhary , Zuoguo Wu , Debendra Das Sharma
IPC: G06F30/398 , G06F30/347 , G06F30/392
Abstract: In one embodiment, an apparatus includes a first die comprising: a die-to-die adapter to communicate with protocol layer circuitry and physical layer circuitry, where the die-to-die adapter is to receive first information of a first interconnect protocol; and the physical layer circuitry coupled to the die-to-die adapter. The physical layer circuitry is configured to receive and output the first information to a second die via an interconnect and comprises: a first plurality of transmitters to transmit data via a first plurality of data lanes; and at least one redundant transmitter. The physical layer circuitry may be configured to remap a first data lane of the first plurality of data lanes to the at least one redundant transmitter. Other embodiments are described and claimed.
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公开(公告)号:US20220318111A1
公开(公告)日:2022-10-06
申请号:US17844348
申请日:2022-06-20
Applicant: Intel Corporation
Inventor: Swadesh Choudhary , Narasimha Lanka , Debendra Das Sharma , Lakshmipriya Seshan , Zuoguo Wu , Gerald Pasdast
IPC: G06F11/263 , G06F13/42
Abstract: In one embodiment, an apparatus comprises a first die that includes: a die-to-die adapter comprising a plurality of first registers, the die-to-die adapter to communicate with protocol layer circuitry via a flit-aware die-to-die interface (FDI) and physical layer circuitry via a raw die-to-die interface (RDI), wherein the die-to-die adapter is to receive message information of a first interconnect protocol; and the physical layer circuitry coupled to the die-to-die adapter, the physical layer circuity comprising a plurality of second registers, where the physical layer circuitry is to receive and output the message information to a second die via an interconnect having a mainband and a sideband. During a test of the apparatus, the sideband is to enable access to information in at least one of the plurality of first registers or at least one of the plurality of second registers. Other embodiments are described and claimed.
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公开(公告)号:US20210004347A1
公开(公告)日:2021-01-07
申请号:US17029288
申请日:2020-09-23
Applicant: Intel Corporation
Inventor: Narasimha Lanka , Lakshmipriya Seshan , Gerald S. Pasdast , Zuoguo Wu
Abstract: Systems, methods, and apparatuses associated with an approximate majority based data bus inversion technique are disclosed. A method comprises obtaining, at a first device connected by a plurality of lanes to a second device, original data comprising first bits and second bits, where the first bits are to be transmitted in a new clock cycle via first lanes of the plurality of lanes, and the second bits are to be transmitted in the new clock cycle via second lanes of the plurality of lanes. The method further includes determining whether a first criterion associated with the first bits is met, determining whether a second criterion associated with the second bits is met, and transmitting an inverted version of the original data via the plurality of lanes based, at least in part, on determining that the first criterion and the second criterion are met.
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公开(公告)号:US10789201B2
公开(公告)日:2020-09-29
申请号:US15636738
申请日:2017-06-29
Applicant: Intel Corporation
Inventor: Zuoguo Wu , Debendra Das Sharma , Mohiuddin M. Mazumder , Jong-Ru Guo , Anupriya Sriramulu , Narasimha Lanka , Timothy Wig , Jeff Morriss
IPC: G06F15/173 , H01L23/522 , H03K19/17736 , G06F15/16 , H01L21/768 , G06F9/28
Abstract: A device includes a receiver to receive one or more training sequences during a training of a link, where the link connects two devices. The device may include agent logic to determine, from the one or more training sequences, a number of extension devices on the link between the two devices, and determine that the number of extension devices exceeds a threshold number. The device may include a transmitter to send a plurality of clock compensation ordered sets on the link based on determining that the number of extension devices exceeds a threshold number.
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