公开(公告)号：US07348665B2

公开(公告)日：2008-03-25

申请号：US10917702

申请日：2004-08-13

申请人： Ioan Sauciuc ,  Gregory M. Chrysler

发明人： Ioan Sauciuc ,  Gregory M. Chrysler

IPC分类号： H01L23/46 ,  H01L23/473

CPC分类号： H01L23/42 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.

摘要翻译： 用于集成电路管芯的液态金属热接口。 液态金属热界面可以设置在模具和另一传热元件之间，例如散热器或散热器。 液体金属热界面包括与模具表面流体连通的液态金属，并且在模具表面上移动的液态金属将热量从模具传递到传热元件。 传热元件的表面也可以与液态金属流体连通。 描述和要求保护其他实施例。

公开(公告)号：US07259965B2

公开(公告)日：2007-08-21

申请号：US11101061

申请日：2005-04-07

申请人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory M. Chrysler ,  Ravi S. Prasher ,  Rajiv K. Mongia ,  Himanshu Pokharna ,  Eric DiStefano

发明人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory M. Chrysler ,  Ravi S. Prasher ,  Rajiv K. Mongia ,  Himanshu Pokharna ,  Eric DiStefano

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

摘要翻译： 微通道结构中形成有微通道。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。 微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。 每个子通道具有大于第一宽高比的相应的第二宽高比。

公开(公告)号：US07243705B2

公开(公告)日：2007-07-17

申请号：US11069540

申请日：2005-03-01

申请人： Alan M. Myers ,  Je-Young Chang ,  Ravi Prasher ,  Ioan Sauciuc ,  Gregory M. Chrysler ,  Patrick D. Boyd ,  Chia-pin Chiu

发明人： Alan M. Myers ,  Je-Young Chang ,  Ravi Prasher ,  Ioan Sauciuc ,  Gregory M. Chrysler ,  Patrick D. Boyd ,  Chia-pin Chiu

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

摘要翻译： 一种装置包括其中形成有微通道的微通道结构。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 该装置还包括位于微通道结构上的盖，以限定每个微通道的相应的上壁。 盖子提供微通道的柔顺表面。

公开(公告)号：US06845622B2

公开(公告)日：2005-01-25

申请号：US10401376

申请日：2003-03-27

申请人： Ioan Sauciuc ,  Gregory M. Chrysler

发明人： Ioan Sauciuc ,  Gregory M. Chrysler

IPC分类号： F25B21/02 ,  F28D15/02 ,  H01L35/00 ,  H01L35/30

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F28D15/0266 ,  F28D15/0275 ,  H01L35/00 ,  H01L35/30

摘要： A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor chamber and increases the temperature of the fins for improved efficiency. The vapor chamber is defined between concentrically positioned tubes, and a tunnel region is located within the inner tube. Additional TEC elements within the tunnel region further dissipate heat. In two-phase natural convection embodiments, TEC elements may further cool liquid returning to the heat source. Parallel heat dissipation paths may also be provided. In a two-phase forced convection embodiment, a TEC element may further cool liquid returning to the heat source, and additional TEC elements may be provided on the condenser. In some embodiments, active feedback controls the amount of energy transferred by a TEC element.

摘要翻译： 传热装置具有其中具有相变流体的密封蒸气室，以及具有与蒸气室热接触的冷却侧的热电冷却（TEC）元件和与散热翅片接触的加热侧。 TEC元件降低蒸气室的温度，并提高翅片的温度以提高效率。 蒸汽室被定义在同心定位的管之间，隧道区位于内管内。 隧道区域内的额外TEC元件进一步散热。 在两相自然对流实施例中，TEC元件可以进一步冷却返回到热源的液体。 还可以提供平行散热路径。 在两相强制对流实施例中，TEC元件可以进一步冷却返回到热源的液体，并且可以在冷凝器上提供额外的TEC元件。 在一些实施例中，主动反馈控制由TEC元件传送的能量的量。

公开(公告)号：US06609561B2

公开(公告)日：2003-08-26

申请号：US10023989

申请日：2001-12-21

申请人： Ioan Sauciuc ,  Gregory M. Chrysler

发明人： Ioan Sauciuc ,  Gregory M. Chrysler

IPC分类号： F28D1500

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F3/025 ,  H01L2924/0002 ,  H01L2924/00

摘要： A phase change heat exchanger and method for cooling a heat dissipating electronic component, such as an electronics package, transfers heat from the electronic component by way of a heatsink including a base in heat conducting relation with the electronic component and fins arranged in heat conducting relation at one end thereof with the base. The efficiency of the fins is increased by also transferring heat from the base to the fins at a location spaced from the one end thereof using a phase change fluid separated from the fins. A chamber containing the phase change fluid is defined between two telescoping tubes which extend peripherally about the fins to form a tunnel or duct through which a cooling fluid such as air can be flowed in contact with the fins. A further increase in cooling efficiency is obtained using an additional remote heat exchangers attached to the surface of the chamber.

摘要翻译： 相变换热器和电子封装等散热电子部件的冷却方法，通过散热器从电子部件传递热量，该散热器包括与导电关系的电子部件和导热关系的散热基板 在其一端与基部。 通过使用从散热片分离的相变流体，在与其一端间隔开的位置处也将热量从基底转移到散热片，从而提高散热片的效率。 包含相变流体的室被限定在两个伸缩管之间，这两个伸缩管围绕翅片周向延伸以形成隧道或管道，诸如空气的冷却流体可以通过该通道或管道与翅片接触。 使用附加到室的表面的另外的远程热交换器来获得冷却效率的进一步提高。

公开(公告)号：US07795711B2

公开(公告)日：2010-09-14

申请号：US11255678

申请日：2005-10-20

申请人： Ioan Sauciuc ,  Gregory M. Chrysler

发明人： Ioan Sauciuc ,  Gregory M. Chrysler

IPC分类号： H01L23/495

CPC分类号： H01L23/38 ,  H01L35/16 ,  H01L2224/73253 ,  H01L2924/12044 ,  H01L2924/16152

摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.

摘要翻译： 通常描述了向微电子器件提供局部冷却的装置和相关方法。 在这方面，根据一个示例性实施例，包括散热器和热耦合到散热器的一个或多个热电冷却器的冷却装置向微电子器件的一个或多个热点提供冷却，一个 或多个具有单个材料的单个热交换元件的热电冷却器。

公开(公告)号：US07538476B2

公开(公告)日：2009-05-26

申请号：US11694762

申请日：2007-03-30

申请人： Gregory M. Chrysler ,  Ioan Sauciuc

发明人： Gregory M. Chrysler ,  Ioan Sauciuc

IPC分类号： H01L41/047 ,  H01L41/083 ,  H01L41/187

CPC分类号： F04D33/00 ,  H01L41/083 ,  H01L41/193

摘要： A multi-layer piezoelectric actuator with conductive polymer electrodes is described. The piezoelectric actuator comprises a stack of alternating conductive electrode layers and piezoelectric layers. The conductive electrode layers are comprised of a polymeric electrically conductive material. A device for cooling by forced-air convection may comprise the piezoelectric actuator, a fan blade and an alternating current supply. The piezoelectric actuator coupled with the fan blade and the alternating current supply, which is provided for vibrating the fan blade. A method of cooling by forced-air convection comprises supplying an alternating current to the piezoelectric actuator, wherein the alternating current has a frequency and causes the fan blade to vibrate with the same frequency.

摘要翻译： 描述了具有导电聚合物电极的多层压电致动器。 压电致动器包括交替的导电电极层和压电层的堆叠。 导电电极层由聚合物导电材料构成。 用于通过强制空气对流冷却的装置可以包括压电致动器，风扇叶片和交流电源。 与风扇叶片和用于使风扇叶片振动的交流电源相连接的压电致动器。 通过强制空气对流冷却的方法包括向压电致动器提供交流电流，其中交流电具有频率并使风扇叶片以相同的频率振动。

公开(公告)号：US20080238248A1

公开(公告)日：2008-10-02

申请号：US11694762

申请日：2007-03-30

申请人： Gregory M. Chrysler ,  Ioan Sauciuc

发明人： Gregory M. Chrysler ,  Ioan Sauciuc

IPC分类号： H02N2/04 ,  H01L41/09 ,  H01L41/18 ,  H01L41/187

CPC分类号： F04D33/00 ,  H01L41/083 ,  H01L41/193

摘要： A multi-layer piezoelectric actuator with conductive polymer electrodes is described. The piezoelectric actuator comprises a stack of alternating conductive electrode layers and piezoelectric layers. The conductive electrode layers are comprised of a polymeric electrically conductive material. A device for cooling by forced-air convection may comprise the piezoelectric actuator, a fan blade and an alternating current supply. The piezoelectric actuator coupled with the fan blade and the alternating current supply, which is provided for vibrating the fan blade. A method of cooling by forced-air convection comprises supplying an alternating current to the piezoelectric actuator, wherein the alternating current has a frequency and causes the fan blade to vibrate with the same frequency.

摘要翻译： 描述了具有导电聚合物电极的多层压电致动器。 压电致动器包括交替的导电电极层和压电层的堆叠。 导电电极层由聚合物导电材料构成。 用于通过强制空气对流冷却的装置可以包括压电致动器，风扇叶片和交流电源。 与风扇叶片和用于使风扇叶片振动的交流电源相连接的压电致动器。 通过强制空气对流冷却的方法包括向压电致动器提供交流电流，其中交流电具有频率并使风扇叶片以相同的频率振动。

公开(公告)号：US20080158812A1

公开(公告)日：2008-07-03

申请号：US11646065

申请日：2006-12-27

申请人： Hakan Erturk ,  Gregory M. Chrysler ,  Ioan Sauciuc

发明人： Hakan Erturk ,  Gregory M. Chrysler ,  Ioan Sauciuc

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

公开(公告)号：US07031155B2

公开(公告)日：2006-04-18

申请号：US10337909

申请日：2003-01-06

申请人： Ioan Sauciuc ,  Gregory M. Chrysler

发明人： Ioan Sauciuc ,  Gregory M. Chrysler

IPC分类号： H05K7/20 ,  H01L23/467

CPC分类号： F04D33/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins of a heat sink, the condenser of the heat pipe, and to the thermal mass of a heat spreader or block. The high amplitude resonant vibration of the fan blade causes formation of a high velocity unidirectional flow stream. Maximum airflow occurs on axes of the piezoelectric fan's centerline, relative to both width and height dimensions. Air intake is above and below the swept out plane of the fan blade. The air flow provides forced convection for the fan blade and, secondarily, for the heat source.

摘要翻译： 根据本发明的实施例，提供压电风扇组件以为空间有限的电子设备提供传导路径和强制对流。 压电风扇的风扇叶片热耦合到热源，例如但不限于散热器的散热片，热管的冷凝器，以及散热器或块的热质。 风扇叶片的高振幅共振振动导致高速单向流动流的形成。 相对于宽度和高度尺寸，压电风扇中心线的轴线最大气流都会发生。 进风口位于风扇叶片的扫出面的上方和下方。 气流为风扇叶片提供强制对流，二次为热源提供强制对流。