Abstract:
A substrate treatment method includes: overlaying a film on a surface of a substrate which includes a first region including a metal atom in a surface layer thereof, using a directed self-assembling material which contains a compound having no less than 6 carbon atoms and including at least one cyano group. After the overlaying, the film on a region other than the first region is removed. After the removing, a pattern principally containing a metal oxide is formed by an Atomic Layer Deposition process or a Chemical Vapor Deposition process on the region other than the first region, of the surface of the substrate.
Abstract:
A composition includes a first polymer and a solvent. The first polymer includes a first structural unit including a fluorine atom, and a group including a first functional group at an end of a main chain or a side chain of the first polymer. The first functional group is capable of forming a bond with a metal or a metalloid. The first structural unit preferably includes a fluorinated hydrocarbon group. The first structural unit is preferably derived from a (meth)acrylic ester containing a fluorine atom, or a styrene compound containing a fluorine atom. The first structural unit preferably contains 6 or more fluorine atoms.
Abstract:
A pattern-forming method enables a resist pattern having a favorable shape with a desired size to be conveniently formed while generation of defects is inhibited, and by using such a superior resist pattern as a mask, a pattern having a favorable shape and arrangement can be formed. The pattern-forming method including: overlaying a base pattern on a front face side of a substrate directly or via other layer; applying a first composition on at least a lateral face of the base pattern; forming a polymer layer by graft polymerization on a surface of the coating film formed after the applying; and etching the substrate by one or a plurality of etching operations by using a resist pattern that includes the base pattern, the coating film and the polymer layer.
Abstract:
A radiation-sensitive resin composition includes (A) a block copolymer, and (B) an acid-generating agent. The block copolymer (A) includes a polymer block (I), a polymer block (II), and a moiety contained in the polymer block (I), the polymer block (2), or both thereof. The polymer block (I) includes an acid-dissociable group. The polymer block (II) includes an alkali-dissociable group. The moiety provides water repellency.