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公开(公告)号：US20210083187A1
公开(公告)日：2021-03-18
申请号：US17106818
申请日：2020-11-30
Applicant: Japan Display Inc.
Inventor： Hiroshi KAWANAGO , Kazufumi WATABE
Abstract: A method of manufacturing a display device, including: a stacking step of stacking, on a glass substrate, a sacrificial resin layer, a metal layer, a transparent metal oxide layer, a base material resin layer, and a functional layer including at least one of a pixel circuit-constituting layer driving a plurality of pixels and a color filter layer, in this order; a radiating step of radiating a pulsed light of a xenon flash lamp to the metal layer through the glass substrate and the sacrificial resin layer; and a detaching step of reducing a force of adhesion between the sacrificial resin layer and the metal layer with the pulsed light radiated in the radiating step, and detaching the sacrificial resin layer from the metal layer.
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公开(公告)号：US20210011536A1
公开(公告)日：2021-01-14
申请号：US17034722
申请日：2020-09-28
Applicant: Japan Display Inc.
Inventor： Akihiro HANADA , Hajime WATAKABE , Kazufumi WATABE
IPC: G06F1/26 , H01L27/12 , H04L12/24 , H04L12/853 , H04L29/08
Abstract: According to one embodiment, a semiconductor device includes an insulating substrate, a first semiconductor layer formed of silicon and positioned above the insulating substrate, a second semiconductor layer formed of a metal oxide and positioned above the first semiconductor layer, a first insulating film formed of a silicon nitride and positioned between the first semiconductor layer and the second semiconductor layer, and a block layer positioned between the first semiconductor film and the second semiconductor layer, the block layer hydrogen diffusion of which is lower than that of the first insulating film.
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公开(公告)号：US20190214589A1
公开(公告)日：2019-07-11
申请号：US16357885
申请日：2019-03-19
Applicant: Japan Display Inc.
Inventor： Kazufumi WATABE , Toshihiro SATO
CPC classification number: H01L51/0097 , H01L27/3276 , H01L51/0024 , H01L51/003 , H01L51/5246 , H01L51/5253 , H01L51/56 , H01L2227/326 , H01L2251/566 , Y02E10/549
Abstract: Simple and high-precision processing, and narrowing of the frame are to be facilitated at the time of preparing display panels by multiple formation. After bonding a first substrate layer in which a plurality of element substrates is formed on a support plate and a second substrate layer in which a plurality of counter substrates is formed on a support plate, these substrate layers are divided into a plurality of display panels. Ridge-like ribs of a covalently or ionically bonding inorganic material are formed along edges of the element substrate and the counter substrate. The dividing includes scribing the support plates along the ribs, and flexing and breaking the support plates.
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公开(公告)号：US20180040645A1
公开(公告)日：2018-02-08
申请号：US15661086
申请日：2017-07-27
Applicant: Japan Display Inc.
Inventor： Yoshinori ISHII , Kazufumi WATABE , Hidekazu MIYAKE
IPC: H01L27/12
Abstract: An organic EL display device has a semiconductor circuit substrate comprising a TFT and an organic passivation layer thereon. An AlO layer is formed over the organic passivation layer, and an electrode layer is formed on the AlO layer. The electrode layer connects with TFT via a through hole formed in the AlO layer and in the organic passivation layer.
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公开(公告)号：US20170179386A1
公开(公告)日：2017-06-22
申请号：US15377128
申请日：2016-12-13
Applicant: Japan Display Inc.
Inventor： Kazufumi WATABE , Hiroshi KAWANAGO
CPC classification number: H01L51/003 , H01L27/3244 , H01L27/3293 , H01L51/0024 , H01L51/0097 , H01L51/5253 , Y02E10/549
Abstract: A glass substrate that corresponds to a plurality of product regions and a first grid region that surrounds each of the plurality of product regions and is grid-like is prepared. A protective film that is harder than the glass substrate is formed in the first grid region. A resin layer is formed so as to cover the protective film and the glass substrate. A part of the resin layer is removed by blast processing in a second grid region that avoids the plurality of product regions, overlaps with the first grid region and surrounds each of the plurality of product regions. A circuit layer is formed on the resin layer. The glass substrate is cut along lines that pass through the second grid region where the part of the resin layer is removed. The glass substrate is peeled off from the resin layer.
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Patent Agency Ranking
公开(公告)号：US20170040569A1
公开(公告)日：2017-02-09
申请号：US15229629
申请日：2016-08-05
Applicant: Japan Display Inc.
Inventor： Kazufumi WATABE , Hiroshi KAWANAGO , Manabu YAMASHITA , Hideaki ISHIGE
CPC classification number: H01L51/5253 , H01L27/3244 , H01L51/003 , H01L51/5203 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/566
Abstract: First rib layers made of an inorganic material are formed in first frame regions of a first glass substrate. First resin layers are formed in first product regions after the first rib layers are formed. First functional layers which include light emitting element layers as a result of luminance of each of unit pixels forming an image being controlled and sealing layers covering the light emitting element layers are formed on the first rib layers and the first resin layers. The first rib layers and the first functional layers are cut along lines passing through the first frame regions while avoiding the first product regions in order to separate the first product regions from each other. In the step of cutting the first rib layers and the first functional layers, the first rib layers and the sealing layers are cut.
Abstract translation: 在第一玻璃基板的第一框架区域中形成由无机材料制成的第一肋层。 在形成第一肋层之后，在第一产品区域中形成第一树脂层。 作为形成被控制的图像的单位像素的亮度和覆盖发光元件层的密封层的发光元件层的第一功能层形成在第一肋层和第一树脂层上。 沿着穿过第一框架区域的线切割第一肋层和第一功能层，同时避免第一产品区域以将第一产品区域彼此分离。 在切割第一肋层和第一功能层的步骤中，切割第一肋层和密封层。
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公开(公告)号：US20230361220A1
公开(公告)日：2023-11-09
申请号：US18346927
申请日：2023-07-05
Applicant: Japan Display Inc.
Inventor： Yohei YAMAGUCHI , Kazufumi WATABE , Tomoyuki ARIYOSHI , Osamu KARIKOME , Ryohei TAKAYA
IPC: H01L29/786 , H01L27/12 , H01L29/423 , H01L29/49 , H01L29/40 , H01L29/45
CPC classification number: H01L29/7869 , H01L27/1225 , H01L27/1248 , H01L27/1214 , H01L29/42384 , H01L29/4908 , H01L29/401 , H01L27/124 , H01L29/45
Abstract: The invention allows stable fabrication of a TFT circuit board used in a display device and having thereon an oxide semiconductor TFT. A TFT circuit board includes a TFT that includes an oxide semiconductor. The TFT has a gate insulating film formed on part of the oxide semiconductor and a gate electrode formed on the gate insulating film. A portion of the oxide semiconductor that is covered with the gate electrode 104 and a portion of the oxide semiconductor that is not covered with the gate electrode are both covered with a first interlayer insulating film. The first interlayer insulating film is covered with a first film 106, and the first film is covered with a first AlO film.
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公开(公告)号：US20210305434A1
公开(公告)日：2021-09-30
申请号：US17347630
申请日：2021-06-15
Applicant: Japan Display Inc.
Inventor： Yohei YAMAGUCHI , Kazufumi WATABE , Tmoyuki ARIYOSHI , Osamu KARIKOME , Ryohei TAKAYA
IPC: H01L29/786 , H01L27/12 , H01L29/45 , H01L29/49 , H01L29/423 , H01L29/40
Abstract: The invention allows stable fabrication of a TFT circuit board used in a display device and having thereon an oxide semiconductor TFT. A TFT circuit board includes a TFT that includes an oxide semiconductor. The TFT has a gate insulating film formed on part of the oxide semiconductor and a gate electrode formed on the gate insulating film. A portion of the oxide semiconductor that is covered with the gate electrode 104 and a portion of the oxide semiconductor that is not covered with the gate electrode are both covered with a first interlayer insulating film. The first interlayer insulating film is covered with a first film 106, and the first film is covered with a first AlO film.
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公开(公告)号：US20210098502A1
公开(公告)日：2021-04-01
申请号：US17119077
申请日：2020-12-11
Applicant: Japan Display Inc.
Inventor： Hiroshi KAWANAGO , Kazufumi WATABE
IPC: H01L27/12
Abstract: The purpose of the present invention is to prevent forming of soot like black substance on the back of the TFT substrate of resin during laser ablation to separate the glass substrate from the TFT substrate. The present invention takes the following structure to counter measure the above problem. A display device having pixels formed on a first surface of the resin substrate including: a first layer, formed from nitride, being formed on a second surface of the resin substrate, the second surface being an opposite surface to the first surface, in which a second layer, which is a separation layer, is formed on the first layer.
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公开(公告)号：US20200152668A1
公开(公告)日：2020-05-14
申请号：US16743080
申请日：2020-01-15
Applicant: Japan Display Inc.
Inventor： Isao SUZUMURA , Kazufumi WATABE , Yoshinori ISHII , Hidekazu MIYAKE , Yohei YAMAGUCHI
IPC: H01L27/12 , H01L29/49 , H01L29/423 , H01L29/417 , G02F1/1362 , G02F1/133 , G02F1/1368 , H01L29/786 , H01L29/24 , H01L29/51
Abstract: The object of the present invention is to make it possible to form an LTPS TFT and an oxide semiconductor TFT on the same substrate. A display device includes a substrate having a display region in which pixels are formed. The pixel includes a first TFT using an oxide semiconductor 109. An oxide film 110 as an insulating material is formed on the oxide semiconductor 109. A gate electrode 111 is formed on the oxide film 110. A first electrode 115 is connected to a drain of the first TFT via a first through hole formed in the oxide film 110. A second electrode 116 is connected to a source of the first TFT via a second through hole formed in the oxide film 110.
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