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11.发明授权
公开(公告)号：US3940270A
公开(公告)日：1976-02-24
申请号：US467391
申请日：1974-05-06
申请人： Gerald A. Krulik , Harvey J. Sable
发明人： Gerald A. Krulik , Harvey J. Sable
CPC分类号： G03G15/167 , G03G15/051 , G03G5/02
摘要： An electrophotographic system is described in which a photoconductive ion modulator screen is used in conjunction with an anodized aluminum dielectric imaging surface. This combination enables the steps of image transfer and fixing to be carried out simultaneously without destroying the latent image produced on the dielectric imaging surface.A duplex anodized aluminum coating is prepared by forming a porous aluminum oxide layer by electrolytically oxidizing an aluminum surface and thereafter continuing the electrolytic oxidation under conditions which produce a barrier type aluminum oxide layer. The resulting duplex anodized aluminum coating containing both porous type aluminum oxide and barrier type aluminum oxide is used as the dielectric imaging surface in this electrophotographic system.
摘要翻译： 描述了一种电子照相系统，其中光电离离子调制器屏幕与阳极氧化铝电介质成像表面结合使用。 这种组合使得能够同时执行图像转印和定影的步骤，而不会破坏在电介质成像表面上产生的潜像。
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12.发明授权
公开(公告)号：US3937571A
公开(公告)日：1976-02-10
申请号：US531462
申请日：1974-12-11
申请人： Gerald A. Krulik , Harvey J. Sable
发明人： Gerald A. Krulik , Harvey J. Sable
CPC分类号： G03G15/167 , G03G15/051 , G03G5/02
摘要： An electrophotographic system is described in which a photoconductive ion modulator screen is used in conjunction with an anodized aluminum dielectric imaging surface. This combination enables the steps of image transfer and fixing to be carried out simultaneously without destroying the latent image produced on the dielectric imaging surface.A duplex anodized aluminum coating is prepared by forming a porous aluminum oxide layer by electrolytically oxidizing an aluminum surface and thereafter continuing the electrolytic oxidation under conditions which produce a barrier type aluminum oxide layer. The resulting duplex anodized aluminum coating containing both porous type aluminum oxide and barrier type aluminum oxide is used as the dielectric imaging surface in this electrophotographic system.
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公开(公告)号：US5524780A
公开(公告)日：1996-06-11
申请号：US381510
申请日：1995-01-31
IPC分类号： C23F1/46
CPC分类号： C23F1/46
摘要： A method of improved control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts. The very rapid reaction can be controlled by using a diluent of copper-free etchant, eliminating overheating. The separated copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 一种改进控制氨铜腐蚀剂的方法，其使用金属铝去除铜而基本上不增加不期望的副产物。 通过使用无铜蚀刻剂的稀释剂可以控制非常快的反应，从而消除过热。 分离的铜和氢氧化铝污泥容易从蚀刻剂过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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14.发明授权Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating 失效含有铵离子的低腐蚀性催化剂用于化学镀镍的铜活化
公开(公告)号：US5219815A
公开(公告)日：1993-06-15
申请号：US763634
申请日：1991-09-23
申请人： Gerald A. Krulik , Nenad V. Mandich
发明人： Gerald A. Krulik , Nenad V. Mandich
CPC分类号： H05K3/244 , C23C18/1831 , C23C18/31 , C23C18/32 , C23C18/54
摘要： This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, such as for production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises ammonium halide salt solutions of a palladium salt with another Group VIII precious metal salt and acid and optionally an alkali halide salt for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.
摘要翻译： 本发明涉及通常用于非电解镍引发的非催化剂的金属的无电镀镍。 它在电子工业中特别有用，例如在印刷电路板上生产化学镀镍/无电镀金片或表面安装焊盘，以及用于铜上的无电镀镍以用于射频干扰屏蔽。 更具体地，它包括钯盐与另一种VIII族贵金属盐的卤化铵盐溶液和酸以及任选的卤化碱盐，用于有效和完全地催化在铜基底上开始化学镀镍。
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15.发明授权Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid 失效在含有羟基取代的有机酸的水溶液中使用钯/锡催化剂在非导电基材上进行无电镀的方法
公开(公告)号：US4182784A
公开(公告)日：1980-01-08
申请号：US861385
申请日：1977-12-16
申请人： Gerald A. Krulik
发明人： Gerald A. Krulik
CPC分类号： C23C18/28
摘要： A tin-palladium catalyst useful for electroless deposition of metals, such as copper or nickel, onto a nonconductive substrate, said catalyst containing a much lower concentration of halide ions than similar compositions presently known, or being completely free of halide ions. The tin-palladium catalyst can be prepared from nonhalide salts using a hydroxy substituted organic acid to stabilize the system.
摘要翻译： 可用于将金属如铜或镍无电沉积到非导电基材上的锡 - 钯催化剂，所述催化剂含有比目前已知的相似组合物低得多的卤离子浓度或完全不含卤离子。 锡 - 钯催化剂可以使用羟基取代的有机酸由非卤化物盐制备以稳定体系。
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公开(公告)号：US4180480A
公开(公告)日：1979-12-25
申请号：US971683
申请日：1978-12-21
摘要： An electroless plating catalyst prepared by reacting a tin salt in the molten state with a precious metal complex. The final catalyst may be a solid or a liquid at room temperature, depending upon the reaction conditions, and it can be reconstituted by dilution with an appropriate aqueous solution to prepare or replenish catalytic working baths for electroless plating. Examples include the molten salt reaction of precious metal complexes with anhydrous stannous chloride or stannous chloride dihydrate.
摘要翻译： 通过使熔融状态的锡盐与贵金属络合物反应制备的化学镀催化剂。 根据反应条件，最终催化剂可以在室温下为固体或液体，并且可以通过用合适的水溶液稀释来重构，以制备或补充用于化学镀的催化工作浴。 贵金属络合物与无水氯化亚锡或二水合氯化钠的熔融盐反应的实例包括。
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公开(公告)号：US5853963A
公开(公告)日：1998-12-29
申请号：US909168
申请日：1997-08-11
申请人： Rajwant Singh , Gerald A. Krulik
发明人： Rajwant Singh , Gerald A. Krulik
CPC分类号： G03F7/322
摘要： This invention relates to a method for increasing the effective process life and chemical efficiency of use of aqueous-based developer solutions used for chemical development of photoresists such as are used in the printed circuit industry. The activity is maintained by regenerating some of byproducts during the process to active carbonate, by controlled additions of alkaline hydroxide instead if conventional carbonate solution. The pH and thus the development speed can automatically be controlled at any desired constant value. This invention allows simple automation of printed circuit photoresist development, with reduced chemical costs and increased chemical usage efficiency and thus reducing the industrial waste volume.
摘要翻译： 本发明涉及一种增加使用用于印刷电路工业中使用的光致抗蚀剂化学发光的水性显影剂溶液的有效工艺寿命和化学效率的方法。 通过在过程中将一些副产物再生成活性碳酸酯，通过控制添加碱性氢氧化物代替传统的碳酸盐溶液来维持活性。 pH和因此显影速度可以自动控制在任何所需的恒定值。 本发明允许印刷电路光刻胶显影的简单自动化，具有降低的化学成本和增加的化学品使用效率，从而减少工业废物体积。
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公开(公告)号：US5722875A
公开(公告)日：1998-03-03
申请号：US655672
申请日：1996-05-30
申请人： Mitsuaki Iwashita , Nobuo Konishi , Gerald A. Krulik , Gary Cohrt
发明人： Mitsuaki Iwashita , Nobuo Konishi , Gerald A. Krulik , Gary Cohrt
IPC分类号： B24B37/015 , B24B49/02 , B24B49/14 , B24B49/00 , B24B51/00
CPC分类号： B24B37/015 , B24B49/02
摘要： The invention relates to a method and an apparatus for polishing an object by CMP with use of a polishing liquid. A change point of the temperature of a surface-to-be-polished of the object at the time of polishing is detected on the basis of information on the temperature of the surface-to-be-polished of the object, which information is obtained in advance at the time of polishing. An end point of the polishing of the object is detected on the basis of information on the change point. The object and a reference object are interlocked and simultaneously polished by a common polishing body, the degree-of-polishing of the reference object is monitored, and the degree-of-polishing of the object is detected on the basis of the degree-of-polishing of the reference object.
摘要翻译： 本发明涉及一种使用抛光液体通过CMP抛光物体的方法和装置。 基于对象的被研磨面的温度的信息来检测抛光时的被研磨面的温度的变化点，获得该信息 提前抛光。 基于关于变化点的信息来检测物体的抛光的终点。 物体和参考对象被共同的抛光体互锁并同时抛光，监视参考对象的抛光度，并且基于目标的程度来检测物体的抛光度 抛光参考对象。
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公开(公告)号：US5322553A
公开(公告)日：1994-06-21
申请号：US20618
申请日：1993-02-22
CPC分类号： C23C18/44 , Y10T428/12944
摘要： An electroless silver plating solution comprises a silver(I) complex, a thiosulfate salt, and a sulfite salt. This electroless silver plating solution uses a novel reducing agent combination of thiosulfate and sulfite. It shows a plating rate and a plating solution stability far superior to those of conventional silver plating solutions containing formaldehyde, reducing sugars, borohydride, hydrazine, and other reducing agents.
摘要翻译： 无电镀银溶液包含银（I）络合物，硫代硫酸盐和亚硫酸盐。 该无电镀银溶液使用硫代硫酸盐和亚硫酸盐的新型还原剂组合。 其显示电镀速率和电镀液稳定性远优于含有甲醛，还原糖，硼氢化物，肼和其它还原剂的常规镀银溶液的电镀速率和镀液稳定性。
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公开(公告)号：US5318621A
公开(公告)日：1994-06-07
申请号：US104723
申请日：1993-08-11
CPC分类号： C23C18/42
摘要： An electroless silver or gold plating solution comprising a noncyanide metal complex, a thiosulfate, a sulfite, and at least one amino acid. These electroless plating solutions containing an amino acid exhibit an accelerated plating rate compared to identical solutions lacking amino acids.
摘要翻译： 包含非氰化物金属络合物，硫代硫酸盐，亚硫酸盐和至少一种氨基酸的无电镀银或金镀液。 与不含氨基酸的相同溶液相比，含有氨基酸的这些化学镀溶液显示出加速镀覆速率。
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