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公开(公告)号：US5556553A
公开(公告)日：1996-09-17
申请号：US447752
申请日：1995-05-23
CPC分类号： C23F1/46
摘要： A process for control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts, by controlling the temperature and mixture rate of the removal process. The very rapid reaction can be controlled by using a diluent of copper-free etchant, heating to process temperature, then adding spent, copper containing etchant at a controlled rate while actively cooling the system to control the temperature. The copper concentration can be monitored by colorimetry while maintaining the pH above pH 8. The separated metallic copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 用于控制氨铜腐蚀剂的再循环的方法，其通过控制除去过程的温度和混合速率，其使用金属铝去除铜而基本上不加入不需要的副产物。 可以通过使用无铜蚀刻剂的稀释剂，加热至加工温度，然后以有控制的速率加入废铜的蚀刻剂，同时主动冷却系统以控制温度，来控制非常快的反应。 可以通过比色法监测铜浓度，同时保持pH高于pH8。分离的金属铜和氢氧化铝污泥容易从蚀刻剂中过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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公开(公告)号：US5512201A
公开(公告)日：1996-04-30
申请号：US388444
申请日：1995-02-13
申请人： Rajwant Singh , Nenad Mandich , Gerald A. Krulik
发明人： Rajwant Singh , Nenad Mandich , Gerald A. Krulik
CPC分类号： C23F1/44
摘要： A metal dissolving liquid and method for stripping tin and solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve tin-copper alloy, a source of halide ions in an amount sufficient to solubilize tin, an effective amount of methylsulfonic acid as promoter for complete stripping, and a source of an organic, water soluble amine. The combination of ingredients will substantially eliminate sludge formation, reduce attack on the copper substrate and provide a bright copper finish after solder removal. A liquid further including organic triazoles including benzotriazole in amounts not more than about 5% by weight and sulfamic ions in amounts not more than about 2.5% by weight.
摘要翻译： 一种金属溶解液以及从印刷电路板的铜基底上剥离锡和焊料涂层（包括下面的锡 - 铜合金）的方法。 该液体包括硝酸水溶液，其量足以溶解锡和锡，铁离子源的量足以溶解锡 - 铜合金，卤素源的量足以溶解锡，有效 甲基磺酸的量作为完全汽提的促进剂，以及有机水溶性胺的来源。 成分的组合将基本上消除污泥形成，减少对铜基材的侵蚀并且在去除焊料后提供亮的铜表面。 进一步包括含量不超过约5重量％的有机三唑（包括苯并三唑）和不超过约2.5重量％的氨基磺酸根离子的液体。
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公开(公告)号：US5524780A
公开(公告)日：1996-06-11
申请号：US381510
申请日：1995-01-31
IPC分类号： C23F1/46
CPC分类号： C23F1/46
摘要： A method of improved control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts. The very rapid reaction can be controlled by using a diluent of copper-free etchant, eliminating overheating. The separated copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 一种改进控制氨铜腐蚀剂的方法，其使用金属铝去除铜而基本上不增加不期望的副产物。 通过使用无铜蚀刻剂的稀释剂可以控制非常快的反应，从而消除过热。 分离的铜和氢氧化铝污泥容易从蚀刻剂过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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公开(公告)号：US5853963A
公开(公告)日：1998-12-29
申请号：US909168
申请日：1997-08-11
申请人： Rajwant Singh , Gerald A. Krulik
发明人： Rajwant Singh , Gerald A. Krulik
CPC分类号： G03F7/322
摘要： This invention relates to a method for increasing the effective process life and chemical efficiency of use of aqueous-based developer solutions used for chemical development of photoresists such as are used in the printed circuit industry. The activity is maintained by regenerating some of byproducts during the process to active carbonate, by controlled additions of alkaline hydroxide instead if conventional carbonate solution. The pH and thus the development speed can automatically be controlled at any desired constant value. This invention allows simple automation of printed circuit photoresist development, with reduced chemical costs and increased chemical usage efficiency and thus reducing the industrial waste volume.
摘要翻译： 本发明涉及一种增加使用用于印刷电路工业中使用的光致抗蚀剂化学发光的水性显影剂溶液的有效工艺寿命和化学效率的方法。 通过在过程中将一些副产物再生成活性碳酸酯，通过控制添加碱性氢氧化物代替传统的碳酸盐溶液来维持活性。 pH和因此显影速度可以自动控制在任何所需的恒定值。 本发明允许印刷电路光刻胶显影的简单自动化，具有降低的化学成本和增加的化学品使用效率，从而减少工业废物体积。
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公开(公告)号：US5322553A
公开(公告)日：1994-06-21
申请号：US20618
申请日：1993-02-22
CPC分类号： C23C18/44 , Y10T428/12944
摘要： An electroless silver plating solution comprises a silver(I) complex, a thiosulfate salt, and a sulfite salt. This electroless silver plating solution uses a novel reducing agent combination of thiosulfate and sulfite. It shows a plating rate and a plating solution stability far superior to those of conventional silver plating solutions containing formaldehyde, reducing sugars, borohydride, hydrazine, and other reducing agents.
摘要翻译： 无电镀银溶液包含银（I）络合物，硫代硫酸盐和亚硫酸盐。 该无电镀银溶液使用硫代硫酸盐和亚硫酸盐的新型还原剂组合。 其显示电镀速率和电镀液稳定性远优于含有甲醛，还原糖，硼氢化物，肼和其它还原剂的常规镀银溶液的电镀速率和镀液稳定性。
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公开(公告)号：US5318621A
公开(公告)日：1994-06-07
申请号：US104723
申请日：1993-08-11
CPC分类号： C23C18/42
摘要： An electroless silver or gold plating solution comprising a noncyanide metal complex, a thiosulfate, a sulfite, and at least one amino acid. These electroless plating solutions containing an amino acid exhibit an accelerated plating rate compared to identical solutions lacking amino acids.
摘要翻译： 包含非氰化物金属络合物，硫代硫酸盐，亚硫酸盐和至少一种氨基酸的无电镀银或金镀液。 与不含氨基酸的相同溶液相比，含有氨基酸的这些化学镀溶液显示出加速镀覆速率。
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公开(公告)号：US5505872A
公开(公告)日：1996-04-09
申请号：US447811
申请日：1995-05-23
摘要： This invention relates to the removal of lead from spent ferric nitrate based solder strippers, the regeneration of the spent ferric nitrate based solder strippers, and the reuse of these solutions at least one time. It comprises a method and process for precipitating lead salts from used acidic solder strippers which are employed to strip solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The method includes the use of sulfate ions which are directly added to an aqueous solution of spent solder stripper, without neutralization of the spent solder stripper, optionally in combination with nitric or methylsulfonic acid addition. After precipitation and removal of the lead salts, additional components of the solder stripper composition may be added to substantially restore the initial functioning of the solder stripper.
摘要翻译： 本发明涉及从废硝酸铁基焊料剥离器中去除铅，再生废硝酸铁基焊料剥离剂，以及至少一次这些溶液的再利用。 它包括用于从使用的酸性焊料剥离剂中沉淀铅盐的方法和方法，其用于从印刷电路板的铜基板剥离包括下面的锡 - 铜合金的焊料涂层。 该方法包括使用硫酸根离子，其直接添加到废焊料剥离剂的水溶液中，而不中和废焊料剥离剂，任选地与硝酸或甲基磺酸添加组合。 在沉淀和除去铅盐之后，可以加入焊料剥离剂组合物的附加组分以基本上恢复焊料剥离器的初始功能。
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8.发明授权Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly 失效使用双极电极组件同时进行非接触电化学电镀和半导体晶片平面化的方法
公开(公告)号：US6143155A
公开(公告)日：2000-11-07
申请号：US96131
申请日：1998-06-11
IPC分类号： C25D5/04 , C25D7/12 , H01L21/288 , H01L21/321 , H01L21/768 , C25D5/00
CPC分类号： C25D7/001 , C25D5/04 , C25D7/123 , H01L21/2885 , H01L21/32115 , H01L21/7684
摘要： Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
摘要翻译： 通过提供双极电极和半导体晶片的金属化表面之间的相对运动，而不需要与晶片的物理接触或与其直接电连接，来实现半导体晶片制造中的铜互连的同时非接触电镀和平坦化。
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9.发明授权
公开(公告)号：US3940270A
公开(公告)日：1976-02-24
申请号：US467391
申请日：1974-05-06
申请人： Gerald A. Krulik , Harvey J. Sable
发明人： Gerald A. Krulik , Harvey J. Sable
CPC分类号： G03G15/167 , G03G15/051 , G03G5/02
摘要： An electrophotographic system is described in which a photoconductive ion modulator screen is used in conjunction with an anodized aluminum dielectric imaging surface. This combination enables the steps of image transfer and fixing to be carried out simultaneously without destroying the latent image produced on the dielectric imaging surface.A duplex anodized aluminum coating is prepared by forming a porous aluminum oxide layer by electrolytically oxidizing an aluminum surface and thereafter continuing the electrolytic oxidation under conditions which produce a barrier type aluminum oxide layer. The resulting duplex anodized aluminum coating containing both porous type aluminum oxide and barrier type aluminum oxide is used as the dielectric imaging surface in this electrophotographic system.
摘要翻译： 描述了一种电子照相系统，其中光电离离子调制器屏幕与阳极氧化铝电介质成像表面结合使用。 这种组合使得能够同时执行图像转印和定影的步骤，而不会破坏在电介质成像表面上产生的潜像。
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10.发明授权
公开(公告)号：US3937571A
公开(公告)日：1976-02-10
申请号：US531462
申请日：1974-12-11
申请人： Gerald A. Krulik , Harvey J. Sable
发明人： Gerald A. Krulik , Harvey J. Sable
CPC分类号： G03G15/167 , G03G15/051 , G03G5/02
摘要： An electrophotographic system is described in which a photoconductive ion modulator screen is used in conjunction with an anodized aluminum dielectric imaging surface. This combination enables the steps of image transfer and fixing to be carried out simultaneously without destroying the latent image produced on the dielectric imaging surface.A duplex anodized aluminum coating is prepared by forming a porous aluminum oxide layer by electrolytically oxidizing an aluminum surface and thereafter continuing the electrolytic oxidation under conditions which produce a barrier type aluminum oxide layer. The resulting duplex anodized aluminum coating containing both porous type aluminum oxide and barrier type aluminum oxide is used as the dielectric imaging surface in this electrophotographic system.
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