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公开(公告)号：US5722875A
公开(公告)日：1998-03-03
申请号：US655672
申请日：1996-05-30
申请人： Mitsuaki Iwashita , Nobuo Konishi , Gerald A. Krulik , Gary Cohrt
发明人： Mitsuaki Iwashita , Nobuo Konishi , Gerald A. Krulik , Gary Cohrt
IPC分类号： B24B37/015 , B24B49/02 , B24B49/14 , B24B49/00 , B24B51/00
CPC分类号： B24B37/015 , B24B49/02
摘要： The invention relates to a method and an apparatus for polishing an object by CMP with use of a polishing liquid. A change point of the temperature of a surface-to-be-polished of the object at the time of polishing is detected on the basis of information on the temperature of the surface-to-be-polished of the object, which information is obtained in advance at the time of polishing. An end point of the polishing of the object is detected on the basis of information on the change point. The object and a reference object are interlocked and simultaneously polished by a common polishing body, the degree-of-polishing of the reference object is monitored, and the degree-of-polishing of the object is detected on the basis of the degree-of-polishing of the reference object.
摘要翻译： 本发明涉及一种使用抛光液体通过CMP抛光物体的方法和装置。 基于对象的被研磨面的温度的信息来检测抛光时的被研磨面的温度的变化点，获得该信息 提前抛光。 基于关于变化点的信息来检测物体的抛光的终点。 物体和参考对象被共同的抛光体互锁并同时抛光，监视参考对象的抛光度，并且基于目标的程度来检测物体的抛光度 抛光参考对象。
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2.发明授权Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly 失效使用双极电极组件同时进行非接触电化学电镀和半导体晶片平面化的方法
公开(公告)号：US6143155A
公开(公告)日：2000-11-07
申请号：US96131
申请日：1998-06-11
IPC分类号： C25D5/04 , C25D7/12 , H01L21/288 , H01L21/321 , H01L21/768 , C25D5/00
CPC分类号： C25D7/001 , C25D5/04 , C25D7/123 , H01L21/2885 , H01L21/32115 , H01L21/7684
摘要： Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
摘要翻译： 通过提供双极电极和半导体晶片的金属化表面之间的相对运动，而不需要与晶片的物理接触或与其直接电连接，来实现半导体晶片制造中的铜互连的同时非接触电镀和平坦化。
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公开(公告)号：US5556553A
公开(公告)日：1996-09-17
申请号：US447752
申请日：1995-05-23
CPC分类号： C23F1/46
摘要： A process for control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts, by controlling the temperature and mixture rate of the removal process. The very rapid reaction can be controlled by using a diluent of copper-free etchant, heating to process temperature, then adding spent, copper containing etchant at a controlled rate while actively cooling the system to control the temperature. The copper concentration can be monitored by colorimetry while maintaining the pH above pH 8. The separated metallic copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 用于控制氨铜腐蚀剂的再循环的方法，其通过控制除去过程的温度和混合速率，其使用金属铝去除铜而基本上不加入不需要的副产物。 可以通过使用无铜蚀刻剂的稀释剂，加热至加工温度，然后以有控制的速率加入废铜的蚀刻剂，同时主动冷却系统以控制温度，来控制非常快的反应。 可以通过比色法监测铜浓度，同时保持pH高于pH8。分离的金属铜和氢氧化铝污泥容易从蚀刻剂中过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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公开(公告)号：US5512201A
公开(公告)日：1996-04-30
申请号：US388444
申请日：1995-02-13
申请人： Rajwant Singh , Nenad Mandich , Gerald A. Krulik
发明人： Rajwant Singh , Nenad Mandich , Gerald A. Krulik
CPC分类号： C23F1/44
摘要： A metal dissolving liquid and method for stripping tin and solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve tin-copper alloy, a source of halide ions in an amount sufficient to solubilize tin, an effective amount of methylsulfonic acid as promoter for complete stripping, and a source of an organic, water soluble amine. The combination of ingredients will substantially eliminate sludge formation, reduce attack on the copper substrate and provide a bright copper finish after solder removal. A liquid further including organic triazoles including benzotriazole in amounts not more than about 5% by weight and sulfamic ions in amounts not more than about 2.5% by weight.
摘要翻译： 一种金属溶解液以及从印刷电路板的铜基底上剥离锡和焊料涂层（包括下面的锡 - 铜合金）的方法。 该液体包括硝酸水溶液，其量足以溶解锡和锡，铁离子源的量足以溶解锡 - 铜合金，卤素源的量足以溶解锡，有效 甲基磺酸的量作为完全汽提的促进剂，以及有机水溶性胺的来源。 成分的组合将基本上消除污泥形成，减少对铜基材的侵蚀并且在去除焊料后提供亮的铜表面。 进一步包括含量不超过约5重量％的有机三唑（包括苯并三唑）和不超过约2.5重量％的氨基磺酸根离子的液体。
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5.发明授权
公开(公告)号：US3940270A
公开(公告)日：1976-02-24
申请号：US467391
申请日：1974-05-06
申请人： Gerald A. Krulik , Harvey J. Sable
发明人： Gerald A. Krulik , Harvey J. Sable
CPC分类号： G03G15/167 , G03G15/051 , G03G5/02
摘要： An electrophotographic system is described in which a photoconductive ion modulator screen is used in conjunction with an anodized aluminum dielectric imaging surface. This combination enables the steps of image transfer and fixing to be carried out simultaneously without destroying the latent image produced on the dielectric imaging surface.A duplex anodized aluminum coating is prepared by forming a porous aluminum oxide layer by electrolytically oxidizing an aluminum surface and thereafter continuing the electrolytic oxidation under conditions which produce a barrier type aluminum oxide layer. The resulting duplex anodized aluminum coating containing both porous type aluminum oxide and barrier type aluminum oxide is used as the dielectric imaging surface in this electrophotographic system.
摘要翻译： 描述了一种电子照相系统，其中光电离离子调制器屏幕与阳极氧化铝电介质成像表面结合使用。 这种组合使得能够同时执行图像转印和定影的步骤，而不会破坏在电介质成像表面上产生的潜像。
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6.发明授权
公开(公告)号：US3937571A
公开(公告)日：1976-02-10
申请号：US531462
申请日：1974-12-11
申请人： Gerald A. Krulik , Harvey J. Sable
发明人： Gerald A. Krulik , Harvey J. Sable
CPC分类号： G03G15/167 , G03G15/051 , G03G5/02
摘要： An electrophotographic system is described in which a photoconductive ion modulator screen is used in conjunction with an anodized aluminum dielectric imaging surface. This combination enables the steps of image transfer and fixing to be carried out simultaneously without destroying the latent image produced on the dielectric imaging surface.A duplex anodized aluminum coating is prepared by forming a porous aluminum oxide layer by electrolytically oxidizing an aluminum surface and thereafter continuing the electrolytic oxidation under conditions which produce a barrier type aluminum oxide layer. The resulting duplex anodized aluminum coating containing both porous type aluminum oxide and barrier type aluminum oxide is used as the dielectric imaging surface in this electrophotographic system.
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公开(公告)号：US5755614A
公开(公告)日：1998-05-26
申请号：US819533
申请日：1997-03-17
CPC分类号： B24B57/02 , B24B37/04 , B24B55/03 , Y10S134/902
摘要： Recycled slurry is continuously blended with the slurry in use to provide a consistent polishing rate while consuming or discarding a small fraction of the slurry flowing continuously across the polishing pad. The slurry is recovered in a catch ring and fed to a recycle loop to blend the recovered slurry with fresh slurry, rejuvenating chemicals, or water; test the blend; filter the blend; and return the blend to the polishing pad. The volume returned to the pad slightly exceeds the volume recovered, causing the catch ring to overflow. Rinse water is recycled in the same fashion to keep the polishing pad wet between polishing cycles.
摘要翻译： 再循环浆料与浆料在使用中连续混合以提供一致的抛光速率，同时消耗或丢弃连续流过抛光垫的少量浆料。 将浆料回收到捕获环中并进料到循环回路中以将回收的浆料与新鲜浆料，再生化学品或水混合; 测试混合物; 过滤混合物; 并将混合物返回到抛光垫。 返回到垫的体积稍微超过恢复的体积，导致卡环溢出。 冲洗水以相同的方式回收，以保持抛光垫在抛光周期之间变湿。
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公开(公告)号：US5524780A
公开(公告)日：1996-06-11
申请号：US381510
申请日：1995-01-31
IPC分类号： C23F1/46
CPC分类号： C23F1/46
摘要： A method of improved control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts. The very rapid reaction can be controlled by using a diluent of copper-free etchant, eliminating overheating. The separated copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
摘要翻译： 一种改进控制氨铜腐蚀剂的方法，其使用金属铝去除铜而基本上不增加不期望的副产物。 通过使用无铜蚀刻剂的稀释剂可以控制非常快的反应，从而消除过热。 分离的铜和氢氧化铝污泥容易从蚀刻剂过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
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9.发明授权Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating 失效含有铵离子的低腐蚀性催化剂用于化学镀镍的铜活化
公开(公告)号：US5219815A
公开(公告)日：1993-06-15
申请号：US763634
申请日：1991-09-23
申请人： Gerald A. Krulik , Nenad V. Mandich
发明人： Gerald A. Krulik , Nenad V. Mandich
CPC分类号： H05K3/244 , C23C18/1831 , C23C18/31 , C23C18/32 , C23C18/54
摘要： This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, such as for production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises ammonium halide salt solutions of a palladium salt with another Group VIII precious metal salt and acid and optionally an alkali halide salt for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.
摘要翻译： 本发明涉及通常用于非电解镍引发的非催化剂的金属的无电镀镍。 它在电子工业中特别有用，例如在印刷电路板上生产化学镀镍/无电镀金片或表面安装焊盘，以及用于铜上的无电镀镍以用于射频干扰屏蔽。 更具体地，它包括钯盐与另一种VIII族贵金属盐的卤化铵盐溶液和酸以及任选的卤化碱盐，用于有效和完全地催化在铜基底上开始化学镀镍。
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10.发明授权Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid 失效在含有羟基取代的有机酸的水溶液中使用钯/锡催化剂在非导电基材上进行无电镀的方法
公开(公告)号：US4182784A
公开(公告)日：1980-01-08
申请号：US861385
申请日：1977-12-16
申请人： Gerald A. Krulik
发明人： Gerald A. Krulik
CPC分类号： C23C18/28
摘要： A tin-palladium catalyst useful for electroless deposition of metals, such as copper or nickel, onto a nonconductive substrate, said catalyst containing a much lower concentration of halide ions than similar compositions presently known, or being completely free of halide ions. The tin-palladium catalyst can be prepared from nonhalide salts using a hydroxy substituted organic acid to stabilize the system.
摘要翻译： 可用于将金属如铜或镍无电沉积到非导电基材上的锡 - 钯催化剂，所述催化剂含有比目前已知的相似组合物低得多的卤离子浓度或完全不含卤离子。 锡 - 钯催化剂可以使用羟基取代的有机酸由非卤化物盐制备以稳定体系。
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