公开(公告)号：US20060292132A1

公开(公告)日：2006-12-28

申请号：US11473494

申请日：2006-06-23

申请人： Kwan Lee ,  Dug Lee ,  Youngsuk Yi ,  Moon Noh ,  Hyoung Kim

发明人： Kwan Lee ,  Dug Lee ,  Youngsuk Yi ,  Moon Noh ,  Hyoung Kim

IPC分类号： A61K48/00 ,  C12N5/08

CPC分类号： A61K48/005 ,  A61K38/1875

摘要： The present application discloses a method of preventing degeneration of nerve, which includes: a) generating a recombinant viral or plasmid vector comprising a DNA sequence encoding a member of a transforming growth factor superfamily or neurotrophic factor proteins operatively linked to a promoter; b) transfecting in vitro a population of cultured cells with the recombinant vector, resulting in a population of the cultured cells; and c) transplanting the transfected cells to an area near an injured nerve, such that expression of the DNA sequence within the area near the injured nerve causes prevention of degeneration of the nerve.

摘要翻译： 本申请公开了一种预防神经变性的方法，其包括：a）产生重组病毒或质粒载体，其包含编码与启动子有效连接的转化生长因子超家族或神经营养因子蛋白成员的DNA序列; b）用重组载体体外转染培养的细胞群，导致培养细胞群; 和c）将转染的细胞移植到受伤的神经附近的区域，使得DNA序列在损伤的神经附近的区域内的表达导致预防神经变性。

公开(公告)号：US20060270078A1

公开(公告)日：2006-11-30

申请号：US11439189

申请日：2006-05-24

申请人： Yong Kim ,  Seog Choi ,  Hyoung Kim ,  Yong Kim

发明人： Yong Kim ,  Seog Choi ,  Hyoung Kim ,  Yong Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10S438/974 ,  H01L2924/00014

摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

摘要翻译： 本发明涉及一种LED封装，并提出了一种制造LED封装的方法，包括以下步骤：提供具有LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图形电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

公开(公告)号：US20060040181A1

公开(公告)日：2006-02-23

申请号：US11191018

申请日：2005-07-28

申请人： Jong Kim ,  Hyoung Kim

发明人： Jong Kim ,  Hyoung Kim

IPC分类号： H01M2/26 ,  H01M2/02

CPC分类号： H01M10/48 ,  H01M2/30 ,  H01M4/13 ,  H01M4/64 ,  H01M4/70 ,  H01M4/742 ,  H01M10/04 ,  H01M10/052 ,  Y10T29/49108

摘要： An electrode assembly comprising an electrode tab or an electrode plate substrate which has an identification mark formed thereon and a lithium rechargeable battery using the same are disclosed. This identification mark makes it possible to easily check the record of the manufacturing processes of the battery, including production equipment, production date, line operators, and production lines when a battery malfunctions. This identification mark may prevent a replica of the defective component from being manufactured.

摘要翻译： 公开了一种电极组件，其包括具有形成在其上的识别标记的电极片或电极板基板和使用其的锂可再充电电池。 该识别标记使得当电池发生故障时，可以容易地检查包括生产设备，生产日期，生产线和生产线在内的电池的制造过程的记录。 该识别标记可以防止制造缺陷部件的副本。

公开(公告)号：US20070251066A1

公开(公告)日：2007-11-01

申请号：US11822189

申请日：2007-07-03

申请人： Hyoung Kim ,  Hyo Shin ,  Ho Choo

发明人： Hyoung Kim ,  Hyo Shin ,  Ho Choo

IPC分类号： H01G9/00

CPC分类号： H01G4/232 ,  H01G4/012 ,  Y10T29/413 ,  Y10T29/417 ,  Y10T29/435

摘要： A multilayer chip capacitor, and a method for manufacturing the same are Provided. The capacitor comprises a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.

摘要翻译： 提供了一种多层片状电容器及其制造方法。 所述电容器包括电容体，所述电容体具有堆叠的多个电介质层，形成在所述电介质层上的多个第一和第二内部电极，每个所述内部电极包括主电极部分和引线部分，形成芯片保护侧部件 在电容器本体的两侧接触第一和第二内部电极的两侧，以及形成在电容器本体的外表面上的一对外部电极。 主电极部的宽度与电介质层的宽度相同，引线部的宽度小于电介质层的宽度。

公开(公告)号：US20070122936A1

公开(公告)日：2007-05-31

申请号：US11598447

申请日：2006-11-13

申请人： Wang Park ,  Jung Kim ,  Young Ahn ,  Hyoung Kim ,  Dong Shin

发明人： Wang Park ,  Jung Kim ,  Young Ahn ,  Hyoung Kim ,  Dong Shin

IPC分类号： H01L21/00 ,  H01L21/82

CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67236

摘要： Disclosed is a heat treatment system for semiconductor devices. The heat treatment system is used in a heat treatment process for semiconductor devices, such as a crystallization process for an amorphous silicon thin film or a dopant activation process for a poly-crystalline silicon thin film formed on a surface of a glass substrate of a flat display panel including a liquid crystal display (LCD) or an organic light emitting device (OLED). The heat treatment system transfers a semiconductor device after uniformly preheating the semiconductor device in order to prevent deformation of the semiconductor device during the heat treatment process, rapidly performs the heat treatment process under the high temperature condition by heating the semiconductor device using a lamp heater and induction heat derived from induced electromotive force, and unloads the semiconductor device after uniformly cooling the semiconductor device such that the semiconductor device is prevented from being deformed when the heat treatment process has been finished. The heat treatment system rapidly performs the heat treatment process while preventing deformation of the semiconductor device by gradually heating or cooling the semiconductor device.

摘要翻译： 公开了一种用于半导体器件的热处理系统。 热处理系统用于半导体器件的热处理工艺，例如非晶硅薄膜的结晶工艺或形成在平坦的玻璃基板的表面上的多晶硅薄膜的掺杂剂活化工艺 显示面板包括液晶显示器（LCD）或有机发光器件（OLED）。 热处理系统在对半导体器件进行均匀预热之后传递半导体器件，以防止在热处理过程中半导体器件的变形，通过使用灯加热器加热半导体器件，在高温条件下快速地执行热处理工艺，以及 由感应电动势产生的感应热，并且在均匀冷却半导体器件之后卸载半导体器件，使得当热处理过程结束时，防止半导体器件变形。 热处理系统通过逐渐加热或冷却半导体器件来快速地执行热处理过程，同时防止半导体器件的变形。

公开(公告)号：US20070113724A1

公开(公告)日：2007-05-24

申请号：US11521320

申请日：2006-09-15

申请人： Hyoung Kim ,  Ji Kim ,  Ki Eom

发明人： Hyoung Kim ,  Ji Kim ,  Ki Eom

IPC分类号： G10H7/00 ,  A63H5/00 ,  G04B13/00

CPC分类号： G10H1/0025 ,  G10H2210/076 ,  G10H2210/081 ,  G10H2210/131

摘要： Embodiments of the present invention relate to a method, medium, and system for summarizing music. The method includes summarizing a music content by extracting an audio feature value from a compressed segment of music data, tracking change points of the music content using the extracted audio feature value and re-configuring segments, selecting a fixed length fragment from each of the reconfigured segments and clustering the selected fragment so as to measure similarity and redundancy between the respective segments, and generating a summary of the music content using a segment selected based on the measured similarity and redundancy between the respective segments.

摘要翻译： 本发明的实施例涉及用于汇总音乐的方法，媒介和系统。 该方法包括通过从音乐数据的压缩段中提取音频特征值来总结音乐内容，使用所提取的音频特征值跟踪音乐内容的变化点并重新配置片段，从每个重新配置的片段中选择固定长度片段 并且对所选择的片段进行聚类，以便测量各个片段之间的相似性和冗余度，以及使用基于所测量的各个片段之间的相似度和冗余度选择的片段来生成音乐内容的概要。

公开(公告)号：US20070107584A1

公开(公告)日：2007-05-17

申请号：US11519028

申请日：2006-09-12

申请人： Hyoung Kim ,  Ki Eom ,  Ji Kim ,  Yuan Shi ,  Xuan Zhu

发明人： Hyoung Kim ,  Ki Eom ,  Ji Kim ,  Yuan Shi ,  Xuan Zhu

IPC分类号： G10H7/00

CPC分类号： G10H1/0008 ,  G10H2210/076 ,  G10H2240/085 ,  G10H2250/225 ,  G11B27/105 ,  G11B27/28

摘要： A method and apparatus for classifying mood of music at high speed. The method includes: extracting a Modified Discrete Cosine Transformation-based timbre feature from a compressed domain of a music file; extracting a Modified Discrete Cosine Transformation-based tempo feature from the compressed domain of the music file; and classifying the mood of the music file based on the extracted timbre feature and the extracted tempo feature.

摘要翻译： 一种用于高速分类音乐心情的方法和装置。 该方法包括：从音乐文件的压缩域中提取基于改进的离散余弦变换的音色特征; 从音乐文件的压缩域提取基于修改的离散余弦变换的速度特征; 并基于提取的音色特征和所提取的速度特征对音乐文件的心情进行分类。

公开(公告)号：US20070018190A1

公开(公告)日：2007-01-25

申请号：US11489578

申请日：2006-07-20

申请人： Yong Kim ,  Young Oh ,  Hyoung Kim ,  Taek Lee ,  Seog Choi

发明人： Yong Kim ,  Young Oh ,  Hyoung Kim ,  Taek Lee ,  Seog Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

公开(公告)号：US20060230130A1

公开(公告)日：2006-10-12

申请号：US11440967

申请日：2006-05-24

申请人： Chunglae Cho ,  Kwang Park ,  Yeon Oh ,  Kyung Lim ,  Dong Kim ,  Kyung Chae ,  Hyoung Kim

发明人： Chunglae Cho ,  Kwang Park ,  Yeon Oh ,  Kyung Lim ,  Dong Kim ,  Kyung Chae ,  Hyoung Kim

IPC分类号： G06F15/173

CPC分类号： H04L12/2818 ,  H04L29/06 ,  H04L67/26 ,  H04L67/2823 ,  H04L67/2842 ,  H04L67/2871 ,  H04L67/289 ,  H04L69/329 ,  H04L2012/2849

摘要： An apparatus and method for managing and controlling UPnP devices in a home network over an external Internet network. The apparatus comprises a client connected to the external Internet network, and a UPnP proxy server for controlling and managing the UPnP devices in the home network. The client includes a stub for providing the same application program interface (API) as a UPnP API to a user, managing information of the UPnP devices and processing a device control command from the user, and a push client for transferring the device control command processed by the stub to the UPnP proxy server and an event message from the UPnP proxy server to the stub, respectively. The UPnP proxy server includes a bridge for managing the UPnP devices in the home network and controlling a specific one of the UPnP devices in response to the device control command from the client, and an agent for transferring the device control command from the client to the bridge and a result of execution of the device control command and the event message from the bridge to the client, respectively.

公开(公告)号：US20060138666A1

公开(公告)日：2006-06-29

申请号：US11317365

申请日：2005-12-23

申请人： Hyoung Kim

发明人： Hyoung Kim

IPC分类号： H01L23/52 ,  H01L21/469

CPC分类号： H01L23/485 ,  H01L21/76801 ,  H01L21/76837 ,  H01L23/5222 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed are: (i) a method for forming an intermetal dielectric layer between metal wirings using a low-k dielectric material, and (ii) a semiconductor device with an intermetal dielectric layer comprising a low-k dielectric material. The method comprises the steps of: (a) forming a metal layer on a semiconductor substrate; (b) forming a plurality of metal wiring patterns by etching the metal layer selectively; (c) forming a first dielectric layer on the substrate and the plurality of metal wiring patterns; (d) forming a low-k dielectric layer on the first dielectric layer, the low-k dielectric layer having a lower dielectric constant than the first dielectric layer; and (e) forming a second dielectric layer on the low-k dielectric layer.