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    Spread-Spectrum Clock-Signal Adjustment for Image Sensors
    11.
    发明申请
    Spread-Spectrum Clock-Signal Adjustment for Image Sensors 审中-公开

    公开(公告)号：US20190288019A1

    公开(公告)日：2019-09-19

    申请号：US16297534

    申请日：2019-03-08

    Applicant: KLA-Tencor Corporation

    Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

    IPC: H01L27/146 ,  H04N5/376 ,  G06F1/10 ,  H03L7/081

    Abstract: An image sensor is provided that includes a pixel array divided into a plurality of pixel groups. Each pixel group is clocked by a respective plurality of horizontal-register clocks. Clock signals for the image sensor are adjusted. Adjusting the clock signals includes phase-shifting each plurality of horizontal-register clocks by a respective phase delay of a plurality of phase delays. The phase delays are evenly spaced and are spaced symmetrically about zero. With the clock signals adjusted, a target is imaged using the image sensor.

    Dark-Field Inspection Using A Low-Noise Sensor
    13.
    发明申请
    Dark-Field Inspection Using A Low-Noise Sensor 审中-公开
    使用低噪声传感器进行暗场检测

    公开(公告)号：US20170048467A1

    公开(公告)日：2017-02-16

    申请号：US15210056

    申请日：2016-07-14

    Applicant: KLA-Tencor Corporation

    Inventor： Yung-Ho Alex Chuang ,  David L. Brown ,  Devis Contarato ,  John Fielden ,  Daniel I. Kavaldjiev ,  Guoheng Zhao ,  Jehn-Huar Chern ,  Guowu Zheng ,  Donald W. Pettibone ,  Stephen Biellak

    IPC: H04N5/335 ,  G01N21/95 ,  G06T7/00

    CPC classification number: H04N5/335 ,  G01N21/9501 ,  G01N2021/95676 ,  H04N5/2256 ,  H04N5/347 ,  H04N5/3745 ,  H04N5/3765 ,  H04N5/378

    Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.

    Abstract translation: 一种检查系统和方法，其中由图像传感器捕获的模拟图像数据值（电荷）在作为图像传感器的输出感测节点（浮动扩散）之间的输出信号被发送之前或同时被分组（组合），并且其中ADC是 被控制以在输出感测节点的每个复位之间顺序地生成多个对应的数字图像数据值。 根据输出合并方法，驱动图像传感器以在每个复位之间顺序地将多个电荷传送到输出感测节点上，并且在每个电荷被传送到输出感测节点之后，控制ADC转换递增增加的输出信号。 根据多采样方法，在转移到输出感测节点之前，将多个电荷垂直或水平分类（相加/组合），并且ADC对每个对应的输出信号进行多次采样。 可以组合输出合并和多采样方法。

    Back-illuminated sensor with boron layer
    14.
    发明授权
    Back-illuminated sensor with boron layer 有权
    带有硼层的背照式传感器

    公开(公告)号：US09496425B2

    公开(公告)日：2016-11-15

    申请号：US13792166

    申请日：2013-03-10

    Applicant: KLA-Tencor Corporation

    Inventor： Jehn-Huar Chern ,  Ali R. Ehsani ,  Gildardo Delgado ,  David L. Brown ,  Yung-Ho Alex Chuang ,  John Fielden

    IPC: G01N21/88 ,  H01L31/0216 ,  G01N21/95 ,  G01N21/956 ,  H01L27/146

    CPC classification number: H01L31/0216 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95676 ,  H01L27/1462 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14689 ,  H01L27/14806

    Abstract: An image sensor for short-wavelength light and charged particles includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.

    Abstract translation: 用于短波长光和带电粒子的图像传感器包括半导体膜，形成在半导体膜的一个表面上的电路元件和在半导体膜的另一个表面上的纯硼层。 该图像传感器具有高效率和良好的稳定性，即使在高通量下连续使用多年。 图像传感器可以使用CCD（电荷耦合器件）或CMOS（互补金属氧化物半导体）技术来制造。 图像传感器可以是二维区域传感器或一维阵列传感器。 图像传感器可以包括在电子轰击的图像传感器和/或检查系统中。

    Back-illuminated sensor with boron layer
    16.
    发明授权
    Back-illuminated sensor with boron layer 有权

    公开(公告)号：US10121914B2

    公开(公告)日：2018-11-06

    申请号：US15797970

    申请日：2017-10-30

    Applicant: KLA-Tencor Corporation

    Inventor： Jehn-Huar Chern ,  Ali R. Ehsani ,  Gildardo Delgado ,  David L. Brown ,  Yung-Ho Alex Chuang ,  John Fielden

    IPC: G01N21/88 ,  H01L31/0216 ,  G01N21/95 ,  G01N21/956 ,  H01L27/146 ,  H01L27/148

    Abstract: An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer having opposing surfaces, with circuit elements formed on one surface of the epitaxial layer, and a pure boron layer on the other surface of the epitaxial layer. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.

    TDI Imaging System With Variable Voltage Readout Clock Signals
    19.
    发明申请
    TDI Imaging System With Variable Voltage Readout Clock Signals 有权
    具有可变电压读出时钟信号的TDI成像系统

    公开(公告)号：US20150002655A1

    公开(公告)日：2015-01-01

    申请号：US14308383

    申请日：2014-06-18

    Applicant: KLA-Tencor Corporation

    Inventor： Guowu Zheng ,  Jehn-Huar Chern ,  Binu Balakrishnan Sathy

    IPC: G01N21/95 ,  H04N5/378 ,  H04N5/372

    CPC classification number: G01N21/9501 ,  H04N5/37206 ,  H04N5/378

    Abstract: A Time Delay and Integration (TDI) imaging system utilizing variable voltage readout clock signals having progressively increasing amplitudes defined as a function of pixel row location, where pixel rows positioned to receive/collect/transfer image-related charges at the start of the TDI imaging process are controlled using lower amplitude readout clock signals than pixel rows positioned to receive/collect/transfer image-related charges near the end of the TDI process. The clock signal amplitude for each pixel row is determined by the expected maximum amplitude needed to hold and transfer image charges by the pixels of that row. Multiple (e.g., three) primary phase signals are generated that are passed through splitters to provide multiple identical secondary phase signals, and then drivers having gain control circuitry are utilized to produce voltage readout clock signals having the same phases as the primary phase signals, but having two or more different voltage amplitudes.

    Abstract translation: 时间延迟和积分（TDI）成像系统利用具有逐渐增加的幅度的可变电压读出时钟信号，该幅度被定义为像素行位置的函数，其中像素行被定位为在TDI成像开始时接收/传送图像相关电荷 使用较低幅度读出时钟信号控制处理，该像素行位于与TDI处理结束附近接收/传送/传送图像相关电荷的像素行。 每个像素行的时钟信号幅度由通过该行的像素保持和传送图像电荷所需的预期最大幅度确定。 产生多个（例如三个）主相位信号，其通过分离器传递以提供多个相同的次级相位信号，然后利用具有增益控制电路的驱动器产生具有与主相位信号相同相位的电压读出时钟信号，但是 具有两个或更多个不同的电压幅度。

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