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公开(公告)号：US10267748B2
公开(公告)日：2019-04-23
申请号：US15782820
申请日：2017-10-12
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Sarath Shekkizhar , Prasanti Uppaluri
Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.
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公开(公告)号：US20190067060A1
公开(公告)日：2019-02-28
申请号：US16113930
申请日：2018-08-27
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Brian Duffy , Mike VonDenHoff , Andrew Cross , Kaushik Sah , Antonio Mani
Abstract: Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects.
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公开(公告)号：US20180277337A1
公开(公告)日：2018-09-27
申请号：US15639311
申请日：2017-06-30
Applicant: KLA-Tencor Corporation
Inventor： Vidyasagar Anantha , Arpit Yati , Saravanan Paramasivam , Martin Plihal , Jincheng Lin
IPC: H01J37/244 , H01J37/28 , H01J37/20
Abstract: Use of care areas in scanning electron microscopes or other review tools can provide improved sensitivity and throughput. A care area is received at a controller of a scanning electron microscope from, for example, an inspector tool. The inspector tool may be a broad band plasma tool. The care area is applied to a field of view of a scanning electron microscope image to identify at least one area of interest. Defects are detected only within the area of interest using the scanning electron microscope. The care areas can be design-based or some other type of care area. Use of care areas in SEM tools can provide improved sensitivity and throughput.
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公开(公告)号：US09714905B1
公开(公告)日：2017-07-25
申请号：US14311270
申请日：2014-06-21
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Deepak Gupta , Vidyasagar Anantha , Premkumar Vijayaraman , Lakshman Deenadayalan
IPC: G01N21/95
CPC classification number: G05B19/41875 , G01N21/956 , G05B2219/37224 , H01L22/12 , H01L22/20 , Y02P90/20 , Y02P90/22
Abstract: Methods and systems for setting up a wafer inspection recipe are provided. Inspection results produced by complete wafer inspection recipe candidates, each of which includes one or more optical mode candidates with at least one set of defect detection parameters, are compared to determine which of the complete wafer inspection recipe candidates is the best for use as the wafer inspection recipe. The method does not involve making any decisions regarding performance of the complete wafer inspection recipe candidates until after the inspection results have been compared. In other words, the method does not involve selecting optical mode(s) that will be used in the wafer inspection recipe followed by selecting the defect detection parameters for the selected optical mode(s). In this manner, a greater number of optical mode and defect detection parameters can be considered in an efficient manner to determine the best wafer inspection recipe for any given wafer.
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公开(公告)号：US20160377552A1
公开(公告)日：2016-12-29
申请号：US15166819
申请日：2016-05-27
Applicant: KLA-Tencor Corporation
Inventor： Saravanan Paramasivam , Martin Plihal
CPC classification number: G01N21/9501 , G01N21/8851 , G01N2021/8858 , G05B19/00 , G05B23/0227 , G05B23/0275 , G05B2219/45031 , H01L21/67253 , H01L22/12 , H01L22/20
Abstract: A method for production line monitoring during semiconductor device fabrication includes acquiring a plurality of inspection results from a plurality of reference samples with an inspection sub-system. The method includes storing the acquired inspection results and geometric pattern codes for each of the reference samples in a database. The method includes acquiring an additional inspection result from an additional sample, where the additional inspection result includes an additional set of geometric pattern codes for identifying each defect identified within the additional inspection result from the additional sample. The method also includes correlating the set of geometric pattern codes of the additional sample with the geometric pattern codes from the reference set of samples to identify at least one of one or more new patterns or one or more patterns displaying a frequency of occurrence above a selected threshold.
Abstract translation: 一种在半导体器件制造期间的生产线监测的方法包括从具有检查子系统的多个参考样本获取多个检查结果。 该方法包括将获取的检查结果和每个参考样本的几何图案代码存储在数据库中。 该方法包括从另外的样本获取额外的检查结果，其中附加检查结果包括用于识别来自附加样本的附加检查结果中识别的每个缺陷的附加组的几何图案代码。 该方法还包括将附加样本的几何模式代码集合与来自参考样本集的几何模式代码进行关联，以识别一个或多个新模式中的至少一个或者显示出所选出的上述发生频率的一个或多个模式 阈。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20200184628A1
公开(公告)日：2020-06-11
申请号：US16277769
申请日：2019-02-15
Applicant: KLA-Tencor Corporation
Inventor： Santosh Bhattacharyya , Jacob George , Saravanan Paramasivam , Martin Plihal
IPC: G06T7/00 , G06N3/08 , G06N3/04 , G06K9/62 , G01N23/2251
Abstract: A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.
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公开(公告)号：US10436720B2
公开(公告)日：2019-10-08
申请号：US14991901
申请日：2016-01-08
Applicant: KLA-Tencor Corporation
Inventor： Li He , Martin Plihal , Huajun Ying , Anadi Bhatia , Amitoz Singh Dandiana , Ramakanth Ramini
Abstract: Methods and systems for classifying defects detected on a specimen with an adaptive automatic defect classifier are provided. One method includes creating a defect classifier based on classifications received from a user for different groups of defects in first lot results and a training set of defects that includes all the defects in the first lot results. The first and additional lot results are combined to create cumulative lot results. Defects in the cumulative lot results are classified with the created defect classifier. If any of the defects are classified with a confidence below a threshold, the defect classifier is modified based on a modified training set that includes the low confidence classified defects and classifications for these defects received from a user. The modified defect classifier is then used to classify defects in additional cumulative lot results.
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公开(公告)号：US20190302031A1
公开(公告)日：2019-10-03
申请号：US16364098
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Saravanan Paramasivam , Ankit Jain , Prasanti Uppaluri , Raghavan Konuru
IPC: G01N21/88 , G01N21/956 , G01N21/95
Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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公开(公告)号：US20190287015A1
公开(公告)日：2019-09-19
申请号：US16277617
申请日：2019-02-15
Applicant: KLA-TENCOR CORPORATION
Inventor： Martin Plihal
Abstract: The present disclosure enables a semiconductor manufacturer to determine more accurately the presence of defects that would otherwise have gone unnoticed. It may be embodied as a system, method, or apparatus for novel defect discovery. The present disclosure may comprise providing a nuisance bin in a nuisance filter, partitioning the defect population into a defect population partition, segmenting the defect population partition into a defect population segment, selecting from the defect population segment a selected set of defects, computing one or more statistics of the signal attributes of the defects in the defect population segment, replicating the selected set of defects to yield generated defects, shifting the generated defects outside of the defect population segment, creating a training set, and training a binary classifier.
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公开(公告)号：US09984454B2
公开(公告)日：2018-05-29
申请号：US15373930
申请日：2016-12-09
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal
CPC classification number: G06T7/001 , G03F7/7065 , G06T7/174 , G06T2207/20224 , G06T2207/30148
Abstract: A system, method, and computer program product are provided for correcting a difference image generated from a comparison of target and reference dies. In use, an intra-die inspection of a target die image is performed to generate, for each pattern of interest, a first representative image. An intra-die inspection of a reference die image is performed to generate, for each of the patterns of interest, a second representative image. Further, the target die image and the reference die image are compared to generate at least one difference image, and the at least one difference image is corrected using each of the generated first representative images and each of the generated second representative images. Detection is then performed using the corrected difference image.
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