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35 条记录 (耗时 0.036 秒)

    Non-combustible molding material
    11.
    发明授权
    Non-combustible molding material 失效
    不燃成型材料

    公开(公告)号：US3988402A

    公开(公告)日：1976-10-26

    申请号：US510130

    申请日：1974-09-27

    申请人： Harutoshi Ueda ,  Naoyuki Suzuki ,  Masami Nagao

    发明人： Harutoshi Ueda ,  Naoyuki Suzuki ,  Masami Nagao

    IPC分类号： C04B28/18 ,  C04B43/02

    CPC分类号： C04B28/18

    摘要： A non-combustible molding material is produced from (a) a hydraulic inorganic mixture consisting of an inorganic substance composed predominantly of silica and an inorganic substance predominantly of calcium oxide, (b) mineral fibers, and (c) a substance selected from the group consisting bitumen, crystalline aluminum oxide, sulfur, metal sulfide and vanadum oxide. A non-combustible molded article having superior flexural strength and low water absorption can be prepared using said material.

    摘要翻译： 由（a）由主要由二氧化硅组成的无机物质和主要由氧化钙组成的无机物质的水硬性无机混合物，（b）矿物纤维，（c）选自下组的物质 包括沥青，结晶氧化铝，硫，金属硫化物和氧化钒。 可以使用所述材料制备具有优异的弯曲强度和低吸水性的不可燃模制品。

    Welding method using welding material having low transformation temperature
    13.
    发明申请
    Welding method using welding material having low transformation temperature 审中-公开
    焊接方法采用低转变温度的焊接材料

    公开(公告)号：US20070181538A1

    公开(公告)日：2007-08-09

    申请号：US11727104

    申请日：2007-03-23

    申请人： Akihiko Ohta ,  Naoyuki Suzuki ,  Yoshio Maeda

    发明人： Akihiko Ohta ,  Naoyuki Suzuki ,  Yoshio Maeda

    IPC分类号： B23K9/167

    CPC分类号： B23K9/164 ,  B23K9/028 ,  B23K9/044 ,  B23K9/167 ,  B23K35/3086 ,  B23K35/383

    摘要： An arc welding method using a welding material having a low transformation temperature, characterized in that it is carried out by the use of a shielding gas consisting of a rare gas alone or a mixed gas of a rare gas and a small amount of an oxygen gas; and an additional welding method using a welding material having a low transformation temperature, characterized in that it is carried out while moving a weld line in the form of a straight line. The former method allows the enhancement of a Charpy value in combination with improved fatigue strength, and the latter allows the experience of heat history of the material having a low transformation temperature to be suppressed, resulting in the prevention of weld crack in combination with an improved fatigue strength.

    摘要翻译： 一种使用具有低转变温度的焊接材料的电弧焊接方法，其特征在于，通过使用由单独的稀有气体或稀有气体和少量氧气的混合气体构成的保护气体 ; 以及使用具有低转变温度的焊接材料的附加焊接方法，其特征在于，以直线形式移动焊接线。 前一种方法可以将Charpy值与提高的疲劳强度相结合提高，而后者可以抑制具有低相变温度的材料的热历史经验，从而防止焊接裂缝与改进的 疲劳强度。

    Servo amplifier unit
    14.
    发明授权
    Servo amplifier unit 失效
    伺服放大器单元

    公开(公告)号：US06292363B1

    公开(公告)日：2001-09-18

    申请号：US09292920

    申请日：1999-04-16

    申请人： Tatsuo Shinohara ,  Hideyuki Nakamura ,  Naoyuki Suzuki ,  Kiichi Inaba ,  Makoto Takeshita

    发明人： Tatsuo Shinohara ,  Hideyuki Nakamura ,  Naoyuki Suzuki ,  Kiichi Inaba ,  Makoto Takeshita

    IPC分类号： H05K720

    CPC分类号： H05K7/1432 ,  H02M7/003

    摘要： A semiconductor module is mounted on a printed circuit board so that a heat radiating surface of the module and surfaces of the printed circuit boards are parallel to inner wall surfaces of a unit case. The total thickness of the semiconductor module constituting an inverter essential to a servo amplifier, and the printed circuit boards on which the semiconductor module is mounted is made substantially equal to a distance between the inner walls of the unit case so that the width of the servo amplifier can be minimized. The other components having sizes smaller than the width of the unit case are selected, and an electrolytic capacitor and the like are divided into a plurality of parts so that the divided parts are separately accommodated. Further, air passages are defined by guide plates closing gaps between the components, so that air is impinge concentratedly on components which need to be cooled during forced air cooling by fans, whereby the cooling efficiency is enhanced, permitting dense arrangement of the components and making it possible to provide a servo amplifier reduced in thickness and in size.

    摘要翻译： 半导体模块安装在印刷电路板上，使得模块的散热表面和印刷电路板的表面平行于单元壳体的内壁表面。 构成伺服放大器所必需的逆变器的半导体模块的总厚度以及安装有半导体模块的印刷电路板的厚度基本上等于单元壳体的内壁之间的距离，使得伺服的宽度 放大器可以最小化。 选择尺寸小于单位壳体的宽度的其他部件，并且电解电容器等被分成多个部分，使得分开的部分被分开容纳。 此外，通过封闭部件之间的间隙的引导板限定空气通道，使得空气集中地冲击在由风扇强制空气冷却期间需要冷却的部件上，从而提高冷却效率，允许部件的紧密布置和制造 可以提供减小厚度和尺寸的伺服放大器。

    Process for producing water-soluble cationic polymers
    15.
    发明授权
    Process for producing water-soluble cationic polymers 失效
    生产水溶性阳离子聚合物的方法

    公开(公告)号：US4164612A

    公开(公告)日：1979-08-14

    申请号：US847025

    申请日：1977-10-31

    申请人： Naoyuki Suzuki ,  Yoji Wada ,  Akihisa Furuno

    发明人： Naoyuki Suzuki ,  Yoji Wada ,  Akihisa Furuno

    IPC分类号： B01D21/01 ,  C08F2/00 ,  C08F2/04 ,  C08F2/10 ,  C08F2/44 ,  C08F20/00 ,  C08F20/34 ,  C08F18/22 ,  C08F126/06

    CPC分类号： C08F20/34 ,  Y10S526/923

    摘要： In a process for producing a water-soluble polymer in an easily grindable glassy state by subjecting to aqueous solution polymerization a mixture comprising a monomer composed mainly of a vinyl monomer represented by the general formula (I): ##STR1## and water in an amount of 7 to 18% by weight based on the total weight of the monomer and water, a water-soluble salt in a powdery form is added to and dispersed in the polymerization system and the polymerization is carried out in the state that the powdery salt is dispersed, whereby a water-soluble polymer excellent in flocculating action and dissolving workability is obtained.

    摘要翻译： 在通过对水溶液聚合制备水溶性聚合物的方法中，将包含主要由通式（I）表示的乙烯基单体组成的单体：水和水 相对于单体和水的总重量为7〜18重量％，将粉末状的水溶性盐加入到聚合体系中并分散在聚合体系中，聚合反应在 粉状盐分散，得到絮凝作用和溶解作业性优异的水溶性聚合物。

    Non-combustible molding material
    16.
    发明授权
    Non-combustible molding material 失效
    不燃成型材料

    公开(公告)号：US4013476A

    公开(公告)日：1977-03-22

    申请号：US510869

    申请日：1974-09-30

    申请人： Harutoshi Ueda ,  Naoyuki Suzuki ,  Masami Nagao

    发明人： Harutoshi Ueda ,  Naoyuki Suzuki ,  Masami Nagao

    IPC分类号： C04B28/18 ,  C09D5/18 ,  C04B43/02

    CPC分类号： C04B28/18 ,  Y10S428/92

    摘要： A non-combustible molding material is produced from (a) a hydraulic inorganic mixture consisting of an inorganic substance composed predominantly of silica and an inorganic substance predominantly of calcium oxide, (b) mineral fibers, and (c) a substance selected from the group consisting bitumen, crystalline aluminum oxide, sulfur, metal sulfide and vanadum oxide. A non-combustible molded article having superior flexural strength and low water absorption can be prepared using said material.

    摘要翻译： 由（a）由主要由二氧化硅组成的无机物质和主要由氧化钙组成的无机物质的水硬性无机混合物，（b）矿物纤维，（c）选自下组的物质 包括沥青，结晶氧化铝，硫，金属硫化物和氧化钒。 可以使用所述材料制备具有优异的弯曲强度和低吸水性的不可燃模制品。

    Non-combustible molding material
    17.
    发明授权
    Non-combustible molding material 失效
    不燃成型材料

    公开(公告)号：US3945840A

    公开(公告)日：1976-03-23

    申请号：US406611

    申请日：1973-10-15

    申请人： Harutoshi Ueda ,  Naoyuki Suzuki ,  Masami Nagao

    发明人： Harutoshi Ueda ,  Naoyuki Suzuki ,  Masami Nagao

    IPC分类号： C04B28/18 ,  C04B7/32 ,  C04B7/34 ,  C04B21/02

    CPC分类号： C04B28/18

    摘要： A non-combustible molding material is produced from (a) a hydraulic inorganic mixture consisting of an inorganic substance composed predominantly of silica and an inorganic substance predominantly of a source of calcium oxide, (b) mineral fibers, and (c) a substance selected from the group consisting bitumen, crystalline aluminum oxide, sulfur, metal sulfide and vanadum oxide. A non-combustible molded article having superior flexural strength and low water absorption can be prepared using said material.

    摘要翻译： 由（a）由主要由二氧化硅组成的无机物质和主要由氧化钙来源的无机物质，（b）矿物纤维组成的水硬性无机混合物，（c）选自 来自由沥青，结晶氧化铝，硫，金属硫化物和氧化钒组成的组。 可以使用所述材料制备具有优异的弯曲强度和低吸水性的不可燃模制品。

    Free laying floor tile having pvc based backing material for preventing tile from slipping provided on back surface thereof
    20.
    发明申请
    Free laying floor tile having pvc based backing material for preventing tile from slipping provided on back surface thereof 审中-公开
    具有基于pvc的背衬材料的自由铺设地砖，用于防止在其后表面上的瓦片滑动

    公开(公告)号：US20060048464A1

    公开(公告)日：2006-03-09

    申请号：US10527534

    申请日：2003-09-19

    申请人： Naoyuki Suzuki ,  Qingyang Pan ,  Seishiro Ishiyama

    发明人： Naoyuki Suzuki ,  Qingyang Pan ,  Seishiro Ishiyama

    IPC分类号： E04F15/00

    CPC分类号： E04F15/10 ,  B60N3/046 ,  E04F15/02 ,  E04F15/02172

    摘要： A loose-lay floor tile which has on a back face a nonskid backing material obtained by solidifying a paste sol containing a plasticizer and one of polyvinyl chloride, copolymers of vinyl chloride and vinyl acetate and mixtures of polyvinyl chloride and polyvinyl acetate. Drawbacks of conventional acrylic mechanically foamed materials such as water absorption, resistance to water, resistance to alkali and strength of a foamed material are improved.

    摘要翻译： 一种松散地板砖，其背面具有通过固化含有增塑剂和聚氯乙烯之一，氯乙烯和乙酸乙烯酯的共聚物以及聚氯乙烯和聚乙酸乙烯酯的混合物的糊状溶胶而获得的非吸收性背衬材料。 常规丙烯酸类机械发泡材料如吸水性，耐水性，耐碱性和发泡材料强度的缺点得到改善。