Semiconductor device and manufacturing method thereof
    11.
    发明申请
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US20070252173A1

    公开(公告)日:2007-11-01

    申请号:US11790791

    申请日:2007-04-27

    IPC分类号: H01L29/739

    摘要: A semiconductor device is provided with: a semiconductor substrate of a predetermined electroconduction type; a hetero semiconductor region contacted with a first main surface of the semiconductor substrate and comprising a semiconductor material having a bandgap different from that of the semiconductor substrate; a gate electrode formed through a gate insulator layer at a position adjacent to a junction region between the hetero semiconductor region and the semiconductor substrate; a source electrode connected to the hetero semiconductor region; and a drain electrode connected to the semiconductor substrate; wherein the hetero semiconductor region includes a contact portion contacted with the source electrode, at least a partial region of the contact portion is of the same electroconduction type as the electroconduction type of the semiconductor substrate, and the partial region has an impurity concentration higher than an impurity concentration of at least that partial region of a gate-electrode facing portion in the hetero semiconductor region which is positioned to face toward the gate electrode through the gate insulator layer.

    摘要翻译: 半导体器件具有:预定的导电型的半导体衬底; 与所述半导体衬底的第一主表面接触并且包括具有与所述半导体衬底的带隙不同的带隙的半导体材料的异质半导体区域; 在与所述异质半导体区域和所述半导体基板之间的接合区域相邻的位置处形成的栅极电极, 连接到所述异质半导体区的源电极; 和连接到半导体衬底的漏电极; 其中所述异质半导体区域包括与所述源电极接触的接触部分,所述接触部分的至少一部分区域具有与所述半导体衬底的导电型相同的导电类型,并且所述部分区域的杂质浓度高于 至少通过栅极绝缘体层位于面向栅电极的异质半导体区域中的栅电极面对部分的部分区域的杂质浓度。

    Semiconductor device and manufacturing method thereof
    12.
    发明申请
    Semiconductor device and manufacturing method thereof 有权
    半导体器件及其制造方法

    公开(公告)号:US20070252171A1

    公开(公告)日:2007-11-01

    申请号:US11790679

    申请日:2007-04-26

    IPC分类号: H01L29/732

    摘要: As semiconductor regions in contact with a first main surface of a semiconductor base composed by forming an N− silicon carbide epitaxial layer on an N+ silicon carbide substrate connected to a cathode electrode, there are provided both of an N+ polycrystalline silicon layer of a same conduction type as a conduction type of the semiconductor base and a P+ polycrystalline silicon layer of a conduction type different from the conduction type of the semiconductor base. Both of the N+ polycrystalline silicon layer and the P+ polycrystalline silicon layer are hetero-joined to the semiconductor base, and are ohmically connected to the anode electrode. Moreover, the N+ polycrystalline silicon layer of the same conduction type as the conduction type of the semiconductor base is formed so as to contact the first main surface of the semiconductor base, and the P+ polycrystalline silicon layer of the conduction type different from the conduction type of the semiconductor base is formed in trenches dug on the first main surface of the semiconductor base.

    摘要翻译: 作为与通过在与阴极连接的N +碳化硅衬底上形成N-碳化硅外延层而构成的半导体衬底的第一主表面接触的半导体区域,提供了具有相同导电性的N +多晶硅层 类型为半导体基底的导电类型和不同于半导体基底的导电类型的导电类型的P +多晶硅层。 N +多晶硅层和P +多晶硅层都与半导体基体异相接合,并与欧姆连接到阳极电极。 此外,形成与半导体基底的导电类型相同的导电类型的N +多晶硅层,以便与半导体基底的第一主表面接触,并且与导电类型不同的导电类型的P +多晶硅层 形成在半导体基底的第一主表面上的沟槽中。

    Semiconductor device and manufacturing method thereof
    13.
    发明申请
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US20070252168A1

    公开(公告)日:2007-11-01

    申请号:US11790792

    申请日:2007-04-27

    IPC分类号: H01L29/74

    摘要: An electrostatic discharge protection element and a protection resistor, which are formed on an N-drain region with a field oxide film interposed therebetween for the purpose of preventing electrical breakdown of a field effect transistor, are composed as a stacked bidirectional Zener diode of one or a plurality of N+ polycrystalline silicon regions of a first layer and a P+ polycrystalline silicon region of a second layer, and a stacked resistor of one or a plurality of N+ resistor layers of the first layer and an N+ resistor layer of the second layer, respectively. One end of the plurality of N+ polycrystalline silicon regions of the first layer is connected to an external gate electrode terminal, and the other end is connected to a source electrode. One end of the plurality of N+ resistor layers of the first layer is connected to a gate electrode, and the other end is connected to the external gate electrode terminal. Semiconductor regions of the first layer and the second layer are formed by using semiconductor films, which form a hetero semiconductor region and the gate electrode, respectively.

    摘要翻译: 为了防止场效应晶体管的电击穿,形成在其间具有场氧化膜的N-drain区域上的静电放电保护元件和保护电阻器被构成为一个或多个的叠层双向齐纳二极管, 第一层的多个N +多晶硅区域和第二层的P +多晶硅区域,以及第一层的一个或多个N +电阻层和第二层的N +电阻层的层叠电阻器 。 第一层的多个N +多晶硅区域的一端连接到外部栅电极端子,另一端与源电极连接。 第一层的多个N +电阻层的一端连接到栅电极,另一端连接到外部栅电极端子。 通过使用分别形成杂半导体区域和栅电极的半导体膜来形成第一层和第二层的半导体区域。

    Bipolar battery control device for adjusting a voltage or capacitance in cells
    16.
    发明授权
    Bipolar battery control device for adjusting a voltage or capacitance in cells 有权
    用于调节电池电压或电容的双极电池控制装置

    公开(公告)号:US09236746B2

    公开(公告)日:2016-01-12

    申请号:US13812295

    申请日:2011-08-03

    摘要: A battery control device is provided that uses a discharge to adjust the capacitance of cells that form a bipolar battery and calculates the voltage increase value of the remaining cells that do not discharge to adjust capacitance if one or more cells, among all of the cells that form the bipolar battery, are discharged to adjust capacitance in a battery control device that controls voltage dispersion or volume dispersion between cells that form the bipolar battery; and setting the general discharge value when there is a discharge to adjust capacitance on the basis of the result of the voltage increase value calculation.

    摘要翻译: 提供一种电池控制装置,其使用放电来调节形成双极电池的电池的电容,并计算不放电的剩余电池的电压增加值,以便在所有电池中的一个或多个电池中调节电容 形成双极电池,放电以调节电池控制装置中的电容,其控制形成双极电池的电池之间的电压分散或体积分散; 并且根据电压增加值计算的结果,当放电进行调整电容时设定一般放电值。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    20.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20110117699A1

    公开(公告)日:2011-05-19

    申请号:US13014190

    申请日:2011-01-26

    IPC分类号: H01L21/336 H01L21/04

    摘要: A semiconductor substrate made of a semiconductor material is prepared, and a hetero semiconductor region is formed on the semiconductor substrate to form a heterojunction in an interface between the hetero semiconductor region and the semiconductor substrate. The hetero semiconductor region is made of a semiconductor material having a bandgap different from that of the semiconductor material, and a part of the hetero semiconductor region includes a film thickness control portion whose film thickness is thinner than that of the other part thereof. By oxidizing the hetero semiconductor region with a thickness equal to the film thickness of the film thickness control portion, a gate insulating film adjacent to the heterojunction is formed. A gate electrode is formed on the gate insulating film. This makes it possible to manufacture a semiconductor device including the gate insulating film with a lower ON resistance, and with a higher insulating characteristic and reliability.

    摘要翻译: 制备由半导体材料制成的半导体衬底,并且在半导体衬底上形成异质半导体区域,以在异质半导体区域和半导体衬底之间的界面中形成异质结。 异质半导体区域由具有与半导体材料的带隙不同的带隙的半导体材料制成,并且异质半导体区域的一部分包括膜厚度比其他部分薄的膜厚控制部分。 通过以等于膜厚控制部分的膜厚的厚度氧化杂半导体区域,形成与异质结相邻的栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 这使得可以制造包括具有较低导通电阻的栅极绝缘膜以及更高的绝缘特性和可靠性的半导体器件。