METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20110117699A1

    公开(公告)日:2011-05-19

    申请号:US13014190

    申请日:2011-01-26

    IPC分类号: H01L21/336 H01L21/04

    摘要: A semiconductor substrate made of a semiconductor material is prepared, and a hetero semiconductor region is formed on the semiconductor substrate to form a heterojunction in an interface between the hetero semiconductor region and the semiconductor substrate. The hetero semiconductor region is made of a semiconductor material having a bandgap different from that of the semiconductor material, and a part of the hetero semiconductor region includes a film thickness control portion whose film thickness is thinner than that of the other part thereof. By oxidizing the hetero semiconductor region with a thickness equal to the film thickness of the film thickness control portion, a gate insulating film adjacent to the heterojunction is formed. A gate electrode is formed on the gate insulating film. This makes it possible to manufacture a semiconductor device including the gate insulating film with a lower ON resistance, and with a higher insulating characteristic and reliability.

    摘要翻译: 制备由半导体材料制成的半导体衬底,并且在半导体衬底上形成异质半导体区域,以在异质半导体区域和半导体衬底之间的界面中形成异质结。 异质半导体区域由具有与半导体材料的带隙不同的带隙的半导体材料制成,并且异质半导体区域的一部分包括膜厚度比其他部分薄的膜厚控制部分。 通过以等于膜厚控制部分的膜厚的厚度氧化杂半导体区域,形成与异质结相邻的栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 这使得可以制造包括具有较低导通电阻的栅极绝缘膜以及更高的绝缘特性和可靠性的半导体器件。

    Method of manufacturing semiconductor device
    4.
    发明授权
    Method of manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07902025B2

    公开(公告)日:2011-03-08

    申请号:US11773649

    申请日:2007-07-05

    IPC分类号: H01L21/336

    摘要: A semiconductor substrate made of a semiconductor material is prepared, and a hetero semiconductor region is formed on the semiconductor substrate to form a heterojunction in an interface between the hetero semiconductor region and the semiconductor substrate. The hetero semiconductor region is made of a semiconductor material having a bandgap different from that of the semiconductor material, and a part of the hetero semiconductor region includes a film thickness control portion whose film thickness is thinner than that of the other part thereof. By oxidizing the hetero semiconductor region with a thickness equal to the film thickness of the film thickness control portion, a gate insulating film adjacent to the heterojunction is formed. A gate electrode is formed on the gate insulating film. This makes it possible to manufacture a semiconductor device including the gate insulating film with a lower ON resistance, and with a higher insulating characteristic and reliability.

    摘要翻译: 制备由半导体材料制成的半导体衬底,并且在半导体衬底上形成异质半导体区域,以在异质半导体区域和半导体衬底之间的界面中形成异质结。 异质半导体区域由具有与半导体材料的带隙不同的带隙的半导体材料制成,并且异质半导体区域的一部分包括膜厚度比其他部分薄的膜厚控制部分。 通过以等于膜厚控制部分的膜厚的厚度氧化杂半导体区域,形成与异质结相邻的栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 这使得可以制造包括具有较低导通电阻的栅极绝缘膜以及更高的绝缘特性和可靠性的半导体器件。

    Semiconductor device and manufacturing method thereof
    5.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US07588961B2

    公开(公告)日:2009-09-15

    申请号:US11377909

    申请日:2006-03-16

    IPC分类号: H01L21/00

    摘要: In general, this disclosure describes a semiconductor device that exhibits an increased resistance and reduced leakage current in a reverse-biased state, and a method for manufacturing such a semiconductor device. For example, in one embodiment, the increased resistance in the reverse-biased state is obtained by introducing either a P+ or P− type impurity in a polycrystalline silicon layer formed on an N− type epitaxial layer. Additionally, the semiconductor device maintains a low resistance in a forward-biased state. To keep the forward-biased resistance low, the polycrystalline silicon layer in the vicinity of a gate electrode may be of an N+ type. Furthermore, an N+ type source extracting region is formed on the surface of the polycrystalline silicon layer to connect a source electrode to a drain electrode and maintain a low resistance when forward-biased.

    摘要翻译: 通常,本公开描述了在反向偏置状态下呈现增加的电阻和减小的漏电流的半导体器件,以及用于制造这种半导体器件的方法。 例如,在一个实施例中,通过在形成在N型外延层上的多晶硅层中引入P +或P-型杂质来获得反向偏置状态下的增加的电阻。 此外,半导体器件在正向偏置状态下保持低电阻。 为了使正向偏置电阻低,在栅电极附近的多晶硅层可以是N +型。 此外,在多晶硅层的表面上形成N +型源极提取区域,以将源电极连接到漏电极,并且当正向偏置时保持低电阻。

    Semiconductor device and method of producing the same
    7.
    发明申请
    Semiconductor device and method of producing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20070210330A1

    公开(公告)日:2007-09-13

    申请号:US11714214

    申请日:2007-03-06

    IPC分类号: H01L29/732 H01L21/8234

    摘要: A semiconductor device, includes: a first conductivity type semiconductor base having a main face; a hetero semiconductor region contacting the main face of the semiconductor base and forming a hetero junction in combination with the semiconductor base, the semiconductor base and the hetero semiconductor region in combination defining a junction end part; a gate insulating film defining a junction face in contact with the semiconductor base and having a thickness; and a gate electrode disposed adjacent to the junction end part via the gate insulating film and defining a shortest point in a position away from the junction end part by a shortest interval, a line extending from the shortest point to a contact point vertically relative to the junction face, forming such a distance between the contact point and the junction end part as to be smaller than the thickness of the gate insulating film contacting the semiconductor base.

    摘要翻译: 一种半导体器件,包括:具有主面的第一导电型半导体基底; 与半导体基板的主面接触并与半导体基底结合形成异质结的异质半导体区域,半导体基底和异质半导体区域组合形成连接端部; 限定与半导体基底接触并具有厚度的接合面的栅极绝缘膜; 以及栅电极,其经由所述栅极绝缘膜与所述接合端部相邻设置,并且在远离所述接合端部的位置中以最短间隔限定最短点,从所述最短点到接触点相对于所述接合端垂直延伸的线 接合面在接触点和接合端部之间形成的距离小于与半导体基底接触的栅极绝缘膜的厚度。

    Semiconductor device manufacturing method
    9.
    发明申请
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US20090233408A1

    公开(公告)日:2009-09-17

    申请号:US11988944

    申请日:2006-06-26

    IPC分类号: H01L21/336 H01L21/22

    摘要: A method of manufacturing a semiconductor device having a polycrystalline silicon layer (5) includes; a step of forming a mask layer (7) on the polycrystalline silicon layer (5); a step of forming a side wall (8) that is provided on a side face of the mask layer (7) and covers part of the polycrystalline silicon layer (6); a step of doping an impurity (52) into the polycrystalline silicon layer (5) by using at least one of the mask layer (7) and the side wall (8) as a mask; and a step of etching the polycrystalline silicon layer (5, 6) by using at least one of the mask layer (7) and the side wall (8) as a mask.

    摘要翻译: 一种制造具有多晶硅层(5)的半导体器件的方法包括: 在多晶硅层(5)上形成掩模层(7)的步骤; 形成设置在掩模层(7)的侧面并覆盖多晶硅层(6)的一部分的侧壁(8)的步骤; 通过使用掩模层(7)和侧壁(8)中的至少一个作为掩模将杂质(52)掺杂到多晶硅层(5)中的步骤; 以及通过使用掩模层(7)和侧壁(8)中的至少一个作为掩模来蚀刻多晶硅层(5,6)的步骤。