Abstract:
Embodiments of the present invention provide a thermoelectric element including a first element portion having a first cross-sectional area, a connection portion connected to the first element portion, and a second element portion connected to the connection portion and having a second cross-sectional area, wherein a cross-sectional area of the connection portion is smaller than at least one of the first cross-sectional area and the second cross-sectional area.
Abstract:
A thermoelectric module according to one embodiment of the present invention comprises: a heat exchange unit; and a thermoelectric element disposed on the heat exchange unit, wherein the heat exchange unit includes a case for accommodating a material for heat exchange and a cover covering the case, the thermoelectric element is disposed on the cover, and the thermal conductivity of the cover is higher than the thermal conductivity of the case.
Abstract:
The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
Abstract:
Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.
Abstract:
Embodiments of the present invention relate to a beverage keeping apparatus capable of cooling and warming, and a container accommodation apparatus that includes an accommodation unit including a container accommodation member configured to accommodate a container therein and a thermoelectric module which is disposed at an external surface of the container accommodation member and applies thermal conversion effect, an extension unit which is coupled to a lower portion of the accommodation unit, extends from an inside to an outside of a case member, and fixes and supports the accommodation unit, and a housing unit which includes a circulation control module which performs control of the thermoelectric module from an outside thereof.
Abstract:
Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.
Abstract:
The embodiment of the present invention relates to equipment for accommodating a beverage for a vehicle capable of performing cooling and heating operations and an apparatus for accommodating a beverage for a vehicle which provides a cup holder for a vehicle having an improved structure capable of being detachably attached to places at a cup holder provided in the vehicle so that the convenience of use can be improved, and at the same time may combine frames having various sizes to change an insertion diameter of the cup holder to allow the apparatus to be easily mounted in a conventional cup holder for a vehicle so that the apparatus can be applied to various kinds of vehicles.
Abstract:
The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.
Abstract:
Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.
Abstract:
Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.