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公开(公告)号：US20170017017A1
公开(公告)日：2017-01-19
申请号：US15183055
申请日：2016-06-15
发明人： Huifeng Duan , Yanming Shen , Ya Qun Liu , Hong Min Huang
CPC分类号： B05D3/0272 , B05D1/005 , C09D183/04 , C23C18/122 , C23C18/1245 , G02B1/111 , G02B1/14
摘要： A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500° C. to form an anti-reflective layer on the sapphire substrate.
摘要翻译： 涂覆的基材包括蓝宝石基底和包含硅基材料的抗反射涂层，其中抗反射涂层的折射率为1.23至1.45，莫氏硬度至少为4.一种用蓝宝石基底涂覆蓝宝石基底的方法， 防反射涂层包括将液体制剂施加到蓝宝石衬底以形成涂覆的基底，并且在至少500℃的温度下固化涂覆的基底，以在蓝宝石衬底上形成抗反射层。
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12.发明授权公开(公告)号：US11373921B2
公开(公告)日：2022-06-28
申请号：US16844916
申请日：2020-04-09
发明人： Kai Zhang , Liqiang Zhang , Ling Shen , Ya Qun Liu
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.
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公开(公告)号：US20190249007A1
公开(公告)日：2019-08-15
申请号：US16267056
申请日：2019-02-04
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Xin Zhang
IPC分类号： C08L83/04 , C09K5/08 , H01L23/373 , C08K3/22
CPC分类号： C08L83/04 , C08K3/22 , C08K2201/006 , C08L2201/56 , C08L2203/20 , C09K5/08 , H01L23/3737
摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers
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公开(公告)号：US20180358283A1
公开(公告)日：2018-12-13
申请号：US15554806
申请日：2016-10-12
申请人： Liqiang ZHANG , Yaqin MAO , Huifeng DUAN , Haigang KANG , Ya Qun LIU , Ling SHEN , Kai ZHANG , Honeywell International Inc.
发明人： Liqiang Zhang , Yaqin Mao , Huifeng Duan , Haigang Kang , Ya Qun Liu , Ling Shen , Kai Zhang
IPC分类号： H01L23/42 , H01L23/373 , C09K5/06 , C08L23/26
CPC分类号： H01L23/42 , C08L23/26 , C09K5/06 , C09K5/063 , H01L23/3737
摘要： The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.
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公开(公告)号：US10597346B2
公开(公告)日：2020-03-24
申请号：US16435877
申请日：2019-06-10
发明人： Ya Qun Liu , Hong Min Huang , Jun Liu , Rajiv R. Singh
IPC分类号： C07C41/01 , C11D7/50 , A62D1/00 , C07C41/06 , C09K5/04 , C09K3/30 , C07C41/24 , C09K3/00 , C09K13/00 , C09K21/06 , C10M131/10 , C11D3/43
摘要： The production of solvents for applications such as heat transfer, cleaning, and degreasing, for example. In particular, the production of solvents derived from 1-chloro-3,3,3-trifluoro-propene, such as chloro and/or fluoro substituted alkanes and chloro and/or fluoro substituted trifluoropropenyl ethers.
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公开(公告)号：US10567084B2
公开(公告)日：2020-02-18
申请号：US16134139
申请日：2018-09-18
发明人： Kai Zhang , Ling Shen , Liqiang Zhang , Ya Qun Liu , Limei Cui
摘要： A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.
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公开(公告)号：US10428257B2
公开(公告)日：2019-10-01
申请号：US16163255
申请日：2018-10-17
发明人： Ya Qun Liu , Liang Zeng , Hui Wang , Bright Zhang , Hong Min Huang
IPC分类号： H05K7/20 , C09K5/14 , H01L23/42 , C08K13/02 , C08L23/08 , C09K5/06 , C09K15/06 , C09K15/22 , C09K15/24 , C09K15/30 , H01L23/367 , H01L23/00 , H01L23/373 , G06F1/20
摘要： A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.
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公开(公告)号：US10428256B2
公开(公告)日：2019-10-01
申请号：US16160478
申请日：2018-10-15
发明人： Ling Shen , Kai Zhang , Liqiang Zhang , Ya Qun Liu , Huifeng Duan , Haigang Kang
IPC分类号： H05K7/20 , H01L23/34 , H01L23/373 , C08K3/00 , C08K3/08 , C08K3/22 , C08K3/28 , C09K5/10 , C09K5/14 , F28F13/00 , H05K1/02 , H01L23/00 , H01L23/42
摘要： The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.
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公开(公告)号：US20190190605A1
公开(公告)日：2019-06-20
申请号：US16134139
申请日：2018-09-18
发明人： Kai Zhang , Ling Shen , Liqiang Zhang , Ya Qun Liu , Limei Cui
摘要： A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.
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公开(公告)号：US10099247B2
公开(公告)日：2018-10-16
申请号：US15183055
申请日：2016-06-15
发明人： Huifeng Duan , Yanming Shen , Ya Qun Liu , Hong Min Huang
摘要： A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500° C. to form an anti-reflective layer on the sapphire substrate.
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