公开(公告)号：US20190229038A1

公开(公告)日：2019-07-25

申请号：US16373569

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H05K7/20 ,  H01L21/48 ,  F28F13/06 ,  F28F3/12

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20180337110A1

公开(公告)日：2018-11-22

申请号：US15951481

申请日：2018-04-12

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  F28F13/06 ,  F28F3/12 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US10064644B2

公开(公告)日：2018-09-04

申请号：US14452376

申请日：2014-08-05

Applicant: Microfabrica Inc.

Inventor： Gregory P. Schmitz ,  Eric C. Miller ,  Richard T. Chen ,  Ming-Ting Wu

IPC: A61B17/32 ,  A61B17/3205 ,  A61B17/16 ,  A61B17/221 ,  A61M1/00 ,  A61B17/22 ,  A61B17/00 ,  A61B17/29 ,  A61B17/3207 ,  A61B90/00

Abstract: The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non-target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.

公开(公告)号：US20180078274A1

公开(公告)日：2018-03-22

申请号：US15718734

申请日：2017-09-28

Applicant: Microfabrica Inc.

Inventor： Michael S. Lockard ,  Uri Frodis ,  Adam L. Cohen ,  Richard T. Chen ,  Gregory P. Schmitz ,  Eric C. Miller ,  Ming Ting Wu ,  Arun S. Veeramani ,  Juan Diego Perea ,  Ronald Leguidleguid ,  Gregory B. Arcenio

IPC: A61B17/32 ,  A61B17/3207 ,  F16H55/18 ,  F16H55/06 ,  A61B17/14 ,  A61B17/16 ,  A61B17/221 ,  A61B17/00 ,  A61B10/02

CPC classification number: A61B17/32002 ,  A61B10/02 ,  A61B10/0266 ,  A61B17/14 ,  A61B17/1659 ,  A61B17/1671 ,  A61B17/221 ,  A61B17/320725 ,  A61B17/320758 ,  A61B90/361 ,  A61B2017/00261 ,  A61B2017/003 ,  A61B2017/00327 ,  A61B2017/00526 ,  A61B2017/00539 ,  A61B2017/00553 ,  A61B2017/2212 ,  A61B2017/2215 ,  A61B2017/2927 ,  A61B2017/320048 ,  A61B2017/32006 ,  A61B2017/320064 ,  A61B2017/320775 ,  A61B2090/3614 ,  A61B2217/005 ,  B33Y80/00 ,  F16H55/06 ,  F16H55/18 ,  F16H55/566 ,  Y10T74/19623

Abstract: The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non-target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.

公开(公告)号：US09907564B2

公开(公告)日：2018-03-06

申请号：US14634424

申请日：2015-02-27

Applicant: MICROFABRICA INC.

Inventor： Michael S. Lockard ,  Uri Frodis ,  Adam L. Cohen ,  Richard T. Chen

IPC: A61B17/32 ,  A61B17/14 ,  A61B17/16 ,  A61B17/221 ,  A61B17/3207 ,  F16H55/06 ,  F16H55/18 ,  B33Y80/00 ,  A61B10/02 ,  A61B17/00 ,  A61B90/00

CPC classification number: A61B17/32002 ,  A61B10/02 ,  A61B17/14 ,  A61B17/1659 ,  A61B17/1671 ,  A61B17/221 ,  A61B17/320725 ,  A61B17/320758 ,  A61B90/361 ,  A61B2017/00261 ,  A61B2017/003 ,  A61B2017/00327 ,  A61B2017/00526 ,  A61B2017/00539 ,  A61B2017/00553 ,  A61B2017/2212 ,  A61B2017/2215 ,  A61B2017/320048 ,  A61B2017/320064 ,  A61B2017/320775 ,  B33Y80/00 ,  F16H55/06 ,  F16H55/18 ,  Y10T74/19623

Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.

公开(公告)号：US20170092565A1

公开(公告)日：2017-03-30

申请号：US15283013

申请日：2016-09-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20140197145A1

公开(公告)日：2014-07-17

申请号：US14156437

申请日：2014-01-15

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

IPC: B23K26/38

CPC classification number: B23K26/38 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。

公开(公告)号：US11999016B2

公开(公告)日：2024-06-04

申请号：US17723348

申请日：2022-04-18

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

IPC: B23K26/38 ,  B23K26/382 ,  C25D5/02 ,  C25D5/48 ,  C25D7/00 ,  G01R1/067 ,  G01R3/00 ,  B23K103/00

CPC classification number: B23K26/38 ,  B23K26/382 ,  C25D5/028 ,  C25D5/48 ,  C25D7/00 ,  G01R1/06744 ,  G01R3/00 ,  B23K2103/56

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

公开(公告)号：US20230207426A1

公开(公告)日：2023-06-29

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  H01L21/4871 ,  H01L23/473 ,  H01L21/4882 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281 ,  F28F2260/02

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US20230204626A1

公开(公告)日：2023-06-29

申请号：US17124417

申请日：2020-12-16

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06738

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.