公开(公告)号：US10957624B2

公开(公告)日：2021-03-23

申请号：US16840305

申请日：2020-04-03

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20180078276A1

公开(公告)日：2018-03-22

申请号：US15718780

申请日：2017-09-28

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ming Ting Wu ,  Arun S. Veeramani ,  Vacit Arat ,  Gregory P. Schmitz ,  Juan Diego Perea ,  Ronald Leguidleguid ,  Gregory B. Arcenio ,  Eric C. Miller

IPC: A61B17/3205

CPC classification number: A61B17/3205 ,  A61B10/0266 ,  A61B10/0283 ,  A61B17/32002 ,  A61B17/3203 ,  A61B17/320758 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/320064 ,  A61B2017/320775 ,  A61F2009/00887

Abstract: Various embodiments of a tissue cutting device and methods for using are described. In some variations devices include an elongate tube having a proximal end and a distal end and a central axis extending from the proximal end to the distal end; a first annular element at the distal end of the elongate tube, the first annular element having a cutting portion at its distal; and a second annular element at the distal end of the elongate tube and concentric with the first annular element, the second annular element having a cutting portion at its distal end, the first and second annular elements being rotatable relative to one another to cause the first annular element and the second annular element to pass each other to shear tissue.

公开(公告)号：US09533376B2

公开(公告)日：2017-01-03

申请号：US14156437

申请日：2014-01-15

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

IPC: B23K26/00 ,  B23K26/16 ,  B23K26/38 ,  B23K26/18 ,  B23K26/40 ,  G01R3/00 ,  G01R1/067

CPC classification number: B23K26/38 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。

公开(公告)号：US20140231264A1

公开(公告)日：2014-08-21

申请号：US14260072

申请日：2014-04-23

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: C25D5/02

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。

公开(公告)号：US20230201968A1

公开(公告)日：2023-06-29

申请号：US17723348

申请日：2022-04-18

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

IPC: B23K26/38 ,  C25D5/02 ,  B23K26/382

CPC classification number: B23K26/38 ,  C25D5/028 ,  B23K26/382

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

公开(公告)号：US20200335425A1

公开(公告)日：2020-10-22

申请号：US16840305

申请日：2020-04-03

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US10096537B1

公开(公告)日：2018-10-09

申请号：US15475074

申请日：2017-03-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/34 ,  H01L23/427 ,  F28D15/04

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins. Other embodiments of the invention are directed to heat spreaders (e.g. heat pipes or vapor chambers) that provide enhanced thermal management via enhanced wicking structures and/or vapor creation and flow structures. Other embodiments provide enhanced methods for making such arrays and spreaders.

公开(公告)号：US09953899B2

公开(公告)日：2018-04-24

申请号：US15283013

申请日：2016-09-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  H05K7/20 ,  F28F3/12 ,  F28F13/06

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20150307997A1

公开(公告)日：2015-10-29

申请号：US14675431

申请日：2015-03-31

Applicant: Microfabrica Inc.

Inventor： Michael S. Lockard ,  Adam L. Cohen ,  Dennis R. Smalley ,  Willa M. Larsen ,  Richard T. Chen

IPC: C23C28/00 ,  C25D5/02 ,  C23C18/16 ,  C23F17/00 ,  C25D5/48 ,  C25D5/10

CPC classification number: C25D5/022 ,  B81C1/00373 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/22 ,  C25D1/003 ,  C25D5/10 ,  C25D5/48

Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate dielectric material and/or wherein seed layer material used to allow deposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.

Abstract translation: 本发明的实施例提供中尺度或微尺寸的三维结构（例如部件，装置等）。 实施例涉及以下一个或多个（1）形成这种结合电介质材料的结构和/或其中用于允许在电介质材料上沉积的种子层材料通过平面化操作去除; （2）形成这样的结构，其中用于至少一些选择性图案化操作的掩模通过将掩模材料转移到衬底或先前形成的层的表面获得，和/或（3）形成这样的结构，其中掩模 用于形成至少部分一些层的图案直接来自表示掩模配置的数据在构建表面上图案化，例如 在一些实施例中，通过经由计算机控制的喷墨喷嘴或阵列或经由计算机控制的挤出装置选择性地分配材料来实现掩模图案化。

公开(公告)号：US11456235B1

公开(公告)日：2022-09-27

申请号：US17174218

申请日：2021-02-11

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.