公开(公告)号：US09777897B2

公开(公告)日：2017-10-03

申请号：US13368217

申请日：2012-02-07

申请人： Paul Kenneth Pickard ,  Mark D. Edmond ,  Gerald Negley ,  Eric Tarsa

发明人： Paul Kenneth Pickard ,  Mark D. Edmond ,  Gerald Negley ,  Eric Tarsa

IPC分类号： F21V1/00 ,  F21V11/00 ,  F21S8/02 ,  F21V5/00 ,  F21V5/02 ,  F21V23/02 ,  F21Y103/10 ,  F21Y115/10 ,  F21Y105/16

CPC分类号： F21S8/026 ,  F21V5/002 ,  F21V5/02 ,  F21V23/02 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2115/10

摘要： Lighting fixtures are described utilizing a plurality of light sources, or light engines, which are mounted together in a modular fashion in the light fixture opening. In some embodiments, the plurality of light sources can comprise lighting panels that together form the overall fixture light source. The present invention is particularly applicable to troffer-style lighting fixtures that can be arranged with a plurality of lighting panels arranged in the troffer opening to illuminate the space below the troffer. Embodiments of the present invention can also utilize solid state light sources for the lighting panels, with some embodiments utilizing light emitting diodes (LEDs).

公开(公告)号：US09484329B2

公开(公告)日：2016-11-01

申请号：US12629735

申请日：2009-12-02

申请人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Theodore Lowes

发明人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Theodore Lowes

IPC分类号： H01L25/075 ,  H01L25/16 ,  H01L33/58

CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.

摘要翻译： 公开了具有多个分立光源的固态照明组件，其光组合以提供期望的发射特性。 根据本发明的LED部件的一个实施例包括矩形基座。 第一组蓝移LED（BSY）LED芯片，第二组BSY LED芯片和一组红色LED芯片安装在底座上。 多个触点沿着副安装座的边缘之一布置，并且可从组件的一侧接近以将电信号施加到LED芯片组。

公开(公告)号：US08882284B2

公开(公告)日：2014-11-11

申请号：US13018291

申请日：2011-01-31

申请人： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, Jr. ,  Antony Van De Ven ,  Gerald Negley

发明人： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, Jr. ,  Antony Van De Ven ,  Gerald Negley

IPC分类号： F21V9/16 ,  F21V5/00 ,  F21K99/00 ,  F21Y101/02 ,  F21V3/00 ,  F21V29/00 ,  F21V3/02 ,  F21V7/20

CPC分类号： F21V9/30 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V29/505 ,  F21V29/767 ,  F21V29/773 ,  F21Y2115/10

摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.

摘要翻译： 公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。 光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。 荧光体载体包括导热透明材料并且热耦合到散热器结构。 基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。 包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。 扩散器的性质，如几何形状，散射层的散射特性，表面粗糙度或平滑度以及散射层性质的空间分布可用于控制各种灯具性能，如颜色均匀性和光强度分布，作为 可视角度。

公开(公告)号：US20110216523A1

公开(公告)日：2011-09-08

申请号：US12901405

申请日：2010-10-08

申请人： TAO TONG ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, JR. ,  Antony Van De Ven ,  Gerald Negley ,  Peter Guschl ,  Zongjie Yuan

发明人： TAO TONG ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, JR. ,  Antony Van De Ven ,  Gerald Negley ,  Peter Guschl ,  Zongjie Yuan

IPC分类号： F21V9/16 ,  H01K1/30 ,  H01J1/62 ,  H01J61/52 ,  F21V9/00 ,  F21V11/00

CPC分类号： F21K9/135 ,  F21K9/232 ,  F21K9/60 ,  F21K9/64 ,  F21K9/65 ,  F21V3/12 ,  F21V5/002 ,  F21V29/505 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A lighting device comprising a light source and a diffuser spaced from the light source. The lighting device further comprises a wavelength conversion material disposed between the light source and the diffuser and spaced from the light source and the diffuser, wherein the diffuser is shaped such that there are different distances between the diffuser and said conversion material at different emission angles. In other embodiments the diffuser includes areas with different diffusing characteristics. Some lamps are arranged to meet A19 and Energy Star lighting standards.

摘要翻译： 一种照明装置，包括光源和与光源间隔开的扩散器。 照明装置还包括设置在光源和扩散器之间并与光源和漫射器隔开的波长转换材料，其中扩散器被成形为使得扩散器和所述转换材料之间在不同的发射角度处具有不同的距离。 在其它实施例中，扩散器包括具有不同扩散特性的区域。 一些灯具被安排满足A19和能源之星照明标准。

公开(公告)号：US07821023B2

公开(公告)日：2010-10-26

申请号：US12154691

申请日：2008-05-23

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20090283779A1

公开(公告)日：2009-11-19

申请号：US12475261

申请日：2009-05-29

申请人： Gerald Negley ,  Bernd Keller

发明人： Gerald Negley ,  Bernd Keller

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  F21K9/69 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) component comprising a submount with an array of LED chips and a lens over the array of LED chips. A diffuser is arranged so that at least some light from the LEDs passes through the diffuser to mix the LED light in the near field. The light passing through the diffuser appears as a mixture of LED chip light when directly viewed. A lighting device is also disclosed comprising an LED component comprising an array of LED chips and a near field diffuser to mix at least some of the light from the LED chips in the near field. A remote reflector is included to reflect at least some the light from the LED component so that is emits from the lighting device in the desired direction.

摘要翻译： 一种发光二极管（LED）组件，包括具有LED芯片阵列的底座和LED芯片阵列上的透镜。 扩散器被布置成使得来自LED的至少一些光通过漫射器以混合近场中的LED光。 当直接观察时，通过扩散器的光作为LED芯片的混合物出现。 还公开了一种照明装置，其包括LED组件，该LED组件包括LED芯片阵列和近场扩散器，用于混合来自近场中的LED芯片的至少一些光。 包括远程反射器以反射来自LED部件的至少一些光，从而在所需方向上从照明装置发射。

公开(公告)号：US20070228387A1

公开(公告)日：2007-10-04

申请号：US11398214

申请日：2006-04-04

申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

公开(公告)号：US20070085104A1

公开(公告)日：2007-04-19

申请号：US11539423

申请日：2006-10-06

申请人： John Edmond ,  Brian Thibeault ,  David Slater ,  Gerald Negley ,  Van Allen Mieczkowski

发明人： John Edmond ,  Brian Thibeault ,  David Slater ,  Gerald Negley ,  Van Allen Mieczkowski

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/44 ,  H01L33/32 ,  H01L33/40 ,  H01L33/42

摘要： A physically robust light emitting diode is disclosed that offers high-reliability in standard packaging and that will withstand high temperature and high humidity conditions. The diode comprises a Group III nitride heterojunction diode with a p-type Group III nitride contact layer, an ohmic contact to the p-type contact layer, and a sputter-deposited silicon nitride composition passivation layer on the ohmic contact. The contact layer, the ohmic contact and the passivation layer are made of materials that transmit light generated in the active heterojunction.

摘要翻译： 公开了一种物理上坚固的发光二极管，其在标准包装中提供高可靠性并且将承受高温和高湿度条件。 二极管包括具有p型III族氮化物接触层的III族氮化物异质结二极管，与p型接触层的欧姆接触，以及在欧姆接触上的溅射沉积的氮化硅组合物钝化层。 接触层，欧姆接触和钝化层由透射在活性异质结中产生的光的材料制成。

公开(公告)号：US20070034323A1

公开(公告)日：2007-02-15

申请号：US11585515

申请日：2006-10-24

申请人： Norbert Hiller ,  Peter Andrews ,  David Slater ,  Gerald Negley

发明人： Norbert Hiller ,  Peter Andrews ,  David Slater ,  Gerald Negley

IPC分类号： B32B37/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/1089 ,  Y10T156/1097 ,  Y10T156/1707 ,  Y10T156/1712 ,  Y10T156/1734 ,  Y10T156/1744 ,  Y10T156/1911 ,  Y10T156/1978

摘要： A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

摘要翻译： 提供了一种部件组装系统，其包括纵向细长的带状载体，纵向细长的底座载体和组装机。 多个部件可以附接到带载体。 组装机适于接收带载体的带状载体，并接收底座载体。 装配机还适于使带载体紧靠于底座托架，并将部件附接到副安装架托架上的底座上。

公开(公告)号：US20060278883A1

公开(公告)日：2006-12-14

申请号：US11478873

申请日：2006-06-30

申请人： Gerald Negley

发明人： Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/44

摘要： A light-emitting device includes a substrate that is at least partially transparent to optical radiation and has a first index of refraction. A diode region is disposed on a first surface of the substrate and is configured to emit light responsive to a voltage applied thereto. An encapsulation layer is disposed on a second surface of the substrate and has a second index of refraction. An antireflective layer is disposed between a second surface of the substrate and the encapsulation layer. The antireflective layer has a graded index of refraction having values in a range between about the first index of refraction at a first surface of the antireflective layer and about the second index of refraction at a second surface of the antireflective layer. The encapsulation layer may also be omitted and the antireflective layer may separate the substrate, which has a first index of refraction, from air, which has a second index of refraction. Non “flip-chip” embodiments are also disclosed.

摘要翻译： 发光器件包括对光辐射至少部分透明并具有第一折射率的衬底。 二极管区域设置在基板的第一表面上，并且被配置为响应于施加到其上的电压而发光。 封装层设置在基板的第二表面上并具有第二折射率。 抗反射层设置在基板的第二表面和封装层之间。 抗反射层具有渐变折射率，其值在反射防止层的第一表面处的约第一折射率与抗反射层的第二表面处的第二折射率之间的范围内。 封装层也可以省略，并且抗反射层可以将具有第一折射率的衬底与具有第二折射率的空气分离。 还公开了非“倒装芯片”实施例。