Impedance detection circuit, impedance detection device, and impedance detection method
    12.
    发明授权
    Impedance detection circuit, impedance detection device, and impedance detection method 失效
    阻抗检测电路,阻抗检测装置和阻抗检测方法

    公开(公告)号:US06756790B2

    公开(公告)日:2004-06-29

    申请号:US09959759

    申请日:2001-12-03

    CPC classification number: G01R27/02

    Abstract: A second operational amplifier (11) of a core unit (1) shorts an inverting input terminal and an output terminal. A signal line (19) is connected to a non-inverting input terminal. A capacitive sensor (18) is connected to the signal line (19). A first operational amplifier (12) earths the non-inverting input terminal. One end of a first resistance (15) and one end of a second resistance (16) are respectively connected to the inverting input terminal. The other end of the first resistance (15) is connected to an alternate current voltage generator (14). The other end of the second resistance (16) is connected to the output terminal of the first operational amplifier (11). A signal output terminal (21) of the core unit (1) is connected to an inverting amplification device (2). An alternate output terminal (22) of the core unit (1) and an inverting output terminal (42) of the inverting amplification device (2) are connected to an addition device (3). The non-inverting input terminal of operational amplifiers (36) and (40).

    Abstract translation: 核心单元(1)的第二运算放大器(11)使反相输入端子和输出端子短路。 信号线(19)连接到非反相输入端子。 电容传感器(18)连接到信号线(19)。 第一运算放大器(12)接地非反相输入端。 第一电阻(15)的一端和第二电阻(16)的一端分别连接到反相输入端子。 第一电阻(15)的另一端连接到交流电压发生器(14)。 第二电阻(16)的另一端连接到第一运算放大器(11)的输出端。 核心单元(1)的信号输出端(21)连接到反相放大装置(2)。 核心单元(1)的替代输出端(22)和反相放大装置(2)的反相输出端(42)连接到加法装置(3)。 运算放大器(36)和(40)的非反相输入端。

    Switch array
    13.
    发明授权
    Switch array 失效
    开关阵列

    公开(公告)号:US07994443B2

    公开(公告)日:2011-08-09

    申请号:US11886856

    申请日:2006-03-20

    Abstract: A first wiring layer 16 is disposed on an insulating film 14 on the lower surface of an upper substrate 15, while a second wiring layer 13three-dimensionally crossing the first wiring layer 16 is provided on the insulating film 12 on a lower substrate 11. A cantilever 17 has one end connected to the first wiring layer 16 and the other end opposed to the second wiring layer 13 with a space therebetween. A thermoplastic sheet 19 is arranged on the upper substrate 15 so as to cover the through-hole 18. The thermoplastic sheet 19 is pressed by a heated pin 20 against the cantilever 17 and deformed so as to maintain the connection between the cantilever 17and the second wiring layer 13, and therefore close the switch 10.

    Abstract translation: 第一布线层16设置在上基板15的下表面上的绝缘膜14上,而在下基板11上的绝缘膜12上设置与第一布线层16三维交叉的第二布线层13。 悬臂17的一端与第一配线层16连接,另一端与第二配线层13相对置,而其间具有间隔。 热塑片19布置在上基板15上以覆盖通孔18.热塑片19被加热的销20压靠在悬臂17上并变形,从而保持悬臂17和第二个之间的连接 布线层13,因此闭合开关10。

    PRESSURE WAVE GENERATOR AND TEMPERATURE CONTROLLING METHOD THEREOF
    15.
    发明申请
    PRESSURE WAVE GENERATOR AND TEMPERATURE CONTROLLING METHOD THEREOF 失效
    压力波发生器及其温度控制方法

    公开(公告)号:US20100025145A1

    公开(公告)日:2010-02-04

    申请号:US12521120

    申请日:2007-12-17

    CPC classification number: G10K15/04

    Abstract: A pressure wave generator (1) includes a thermally conductive substrate (2), a heat insulating layer (3) formed on one main surface of the substrate (2), an insulator layer (5) formed on the heat insulating layer (3), and a heat generator (4) formed on the insulator layer (5) to generate heat when a current containing an alternating component is applied thereto. The heat insulating layer (3) is formed containing at least one of silicon nitride (Si3N4), silicon dioxide (SiO2), aluminum oxide (Al2O3), magnesium oxide (MgO), diamond crystalline carbon (C), aluminum nitride (AlN), and silicon carbide (SiC). The heat generator (4) is formed containing, for example, gold (Au) or tungsten (W).

    Abstract translation: 压力波发生器(1)包括导热基板(2),形成在基板(2)的一个主表面上的绝热层(3),形成在绝热层(3)上的绝缘体层(5) 以及形成在所述绝缘体层(5)上的热发生器(4),以在施加包含交替分量的电流时产生热量。 该绝热层(3)形成为含有氮化硅(Si 3 N 4),二氧化硅(SiO 2),氧化铝(Al 2 O 3),氧化镁(MgO),金刚石结晶碳(C),氮化铝(AlN) ,和碳化硅(SiC)。 形成有例如金(Au)或钨(W)的发热体(4)。

    Displacement Measurement apparatus for microstructure and displcement measurement method thereof
    16.
    发明申请
    Displacement Measurement apparatus for microstructure and displcement measurement method thereof 有权
    位移测量装置的微结构和位移测量方法

    公开(公告)号:US20090145230A1

    公开(公告)日:2009-06-11

    申请号:US12315742

    申请日:2008-12-05

    CPC classification number: G01P15/125 G01C19/5719 G01P2015/0814

    Abstract: A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.

    Abstract translation: 根据本发明的用于微结构的位移测量装置测量具有包括第一电极和第二电极的固定部分电极和位于与固定部分电极相对的可动部电极的微结构的位移。 偏置产生电路将偏置信号施加到第一电极和可动部分电极之间,从而可以减少噪声信号对从第二电极和可动部分电极之间拾取的检测信号的影响。 C / V转换电路将从第二电极和可动部分电极之间拾取的电容变化转换为电压。 检测电路基于电压检测可动部分电极的位移。

    Minute structure inspection device, inspection method, and inspection program
    17.
    发明申请
    Minute structure inspection device, inspection method, and inspection program 审中-公开
    分体结构检查装置,检验方法和检验程序

    公开(公告)号:US20080223136A1

    公开(公告)日:2008-09-18

    申请号:US12012729

    申请日:2008-02-04

    CPC classification number: G01N29/4427 G01N29/12 G01N29/4445 G01N2291/2697

    Abstract: There are provided an inspection device, an inspection method, and an inspection program for accurately inspecting a minute structure having a movable portion by using a simple method. A test sound wave is inputted and frequency characteristic of a sensor output voltage amplitude responding to the input of the test sound wave is analyzed. The maximum frequency and the minimum frequency of the device is calculated from estimated use conditions and it is judged whether it is possible to detect a desired characteristic in the frequency band. More specifically, the device is judged to be good or bad depending whether the response characteristic in a predetermined frequency band exceeds the minimum characteristic level as a threshold value.

    Abstract translation: 提供了一种检查装置,检查方法和检查程序,用于通过简单的方法精确地检查具有可移动部分的微小结构。 输入测试声波,分析响应于测试声波的输入的传感器输出电压幅度的频率特性。 从估计使用条件计算设备的最大频率和最小频率,并且判断是否可以检测到频带中的期望特性。 更具体地,根据预定频带中的响应特性是否超过最小特征电平作为阈值,判断装置是好还是坏。

    Interposer And Manufacturing Method For The Same
    19.
    发明申请
    Interposer And Manufacturing Method For The Same 审中-公开
    内插和制造方法相同

    公开(公告)号:US20080067073A1

    公开(公告)日:2008-03-20

    申请号:US11631635

    申请日:2005-07-05

    CPC classification number: H01L23/49827 H01L21/486 H01L2924/0002 H01L2924/00

    Abstract: In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.

    Abstract translation: 在中介层的制造方法中,在基板的背面侧的通孔的开口部形成种子层,基于种子层形成电镀用电极层,形成电镀覆盖层 以将电镀层用电极层的贯通孔填充到前表面侧。 结果,提供了一种用于插入器的制造方法,其中制造工艺简单并且在通孔内部不产生空隙。

    Electrostatic capacitance detection circuit and microphone device
    20.
    发明授权
    Electrostatic capacitance detection circuit and microphone device 失效
    静电电容检测电路和麦克风装置

    公开(公告)号:US07019540B2

    公开(公告)日:2006-03-28

    申请号:US10488763

    申请日:2002-09-06

    CPC classification number: H04R29/004 G01R27/26

    Abstract: An electrostatic capacitance detection circuit 10 comprises an AC voltage generator 11, an operational amplifier 14 of which non-inverting input terminal is connected to specific potential (a ground in this example), an impedance converter 16, a resistance (R1) 12 connected between the AC voltage generator 11 and an inverting input terminal of the operational amplifier 14, a resistance (R2) 13 connected between the inverting input terminal of the operational amplifier 14 and an output terminal of the impedance converter 16, and an impedance element (a capacitor) 15 connected between an output terminal of the operational amplifier 14 and an input terminal of the impedance converter 16, and a capacitor to be detected 17 is connected between the input terminal of the impedance converter 16 and specific potential. The electrostatic capacitance detection circuit 10 and the capacitor 17 are located adjacently.

    Abstract translation: 静电电容检测电路10包括交流电压发生器11,其同相输入端子连接到特定电位的运算放大器14(在该示例中为地),阻抗转换器16,连接的电阻(R 1)12 在交流电压发生器11和运算放大器14的反相输入端之间,连接在运算放大器14的反相输入端和阻抗转换器16的输出端之间的电阻(R 2)13和阻抗元件 连接在运算放大器14的输出端子和阻抗转换器16的输入端子之间的电容器15以及待检测电容器17连接在阻抗转换器16的输入端子和特定电位之间。 静电电容检测电路10和电容器17相邻配置。

Patent Agency Ranking