Abstract:
Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.
Abstract:
A second operational amplifier (11) of a core unit (1) shorts an inverting input terminal and an output terminal. A signal line (19) is connected to a non-inverting input terminal. A capacitive sensor (18) is connected to the signal line (19). A first operational amplifier (12) earths the non-inverting input terminal. One end of a first resistance (15) and one end of a second resistance (16) are respectively connected to the inverting input terminal. The other end of the first resistance (15) is connected to an alternate current voltage generator (14). The other end of the second resistance (16) is connected to the output terminal of the first operational amplifier (11). A signal output terminal (21) of the core unit (1) is connected to an inverting amplification device (2). An alternate output terminal (22) of the core unit (1) and an inverting output terminal (42) of the inverting amplification device (2) are connected to an addition device (3). The non-inverting input terminal of operational amplifiers (36) and (40).
Abstract:
A first wiring layer 16 is disposed on an insulating film 14 on the lower surface of an upper substrate 15, while a second wiring layer 13three-dimensionally crossing the first wiring layer 16 is provided on the insulating film 12 on a lower substrate 11. A cantilever 17 has one end connected to the first wiring layer 16 and the other end opposed to the second wiring layer 13 with a space therebetween. A thermoplastic sheet 19 is arranged on the upper substrate 15 so as to cover the through-hole 18. The thermoplastic sheet 19 is pressed by a heated pin 20 against the cantilever 17 and deformed so as to maintain the connection between the cantilever 17and the second wiring layer 13, and therefore close the switch 10.
Abstract:
An interposer is disclosed. The interposer includes a substrate capable of being processed by dry etching. The substrate includes a plurality of conductive holes penetrating from one side to the other side of said substrate. Each of said plurality of conductive holes has one end provided with a contact element on at least one side of said conductive hole.
Abstract:
A pressure wave generator (1) includes a thermally conductive substrate (2), a heat insulating layer (3) formed on one main surface of the substrate (2), an insulator layer (5) formed on the heat insulating layer (3), and a heat generator (4) formed on the insulator layer (5) to generate heat when a current containing an alternating component is applied thereto. The heat insulating layer (3) is formed containing at least one of silicon nitride (Si3N4), silicon dioxide (SiO2), aluminum oxide (Al2O3), magnesium oxide (MgO), diamond crystalline carbon (C), aluminum nitride (AlN), and silicon carbide (SiC). The heat generator (4) is formed containing, for example, gold (Au) or tungsten (W).
Abstract translation:压力波发生器(1)包括导热基板(2),形成在基板(2)的一个主表面上的绝热层(3),形成在绝热层(3)上的绝缘体层(5) 以及形成在所述绝缘体层(5)上的热发生器(4),以在施加包含交替分量的电流时产生热量。 该绝热层(3)形成为含有氮化硅(Si 3 N 4),二氧化硅(SiO 2),氧化铝(Al 2 O 3),氧化镁(MgO),金刚石结晶碳(C),氮化铝(AlN) ,和碳化硅(SiC)。 形成有例如金(Au)或钨(W)的发热体(4)。
Abstract:
A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.
Abstract translation:根据本发明的用于微结构的位移测量装置测量具有包括第一电极和第二电极的固定部分电极和位于与固定部分电极相对的可动部电极的微结构的位移。 偏置产生电路将偏置信号施加到第一电极和可动部分电极之间,从而可以减少噪声信号对从第二电极和可动部分电极之间拾取的检测信号的影响。 C / V转换电路将从第二电极和可动部分电极之间拾取的电容变化转换为电压。 检测电路基于电压检测可动部分电极的位移。
Abstract:
There are provided an inspection device, an inspection method, and an inspection program for accurately inspecting a minute structure having a movable portion by using a simple method. A test sound wave is inputted and frequency characteristic of a sensor output voltage amplitude responding to the input of the test sound wave is analyzed. The maximum frequency and the minimum frequency of the device is calculated from estimated use conditions and it is judged whether it is possible to detect a desired characteristic in the frequency band. More specifically, the device is judged to be good or bad depending whether the response characteristic in a predetermined frequency band exceeds the minimum characteristic level as a threshold value.
Abstract:
Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.
Abstract:
In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.
Abstract:
An electrostatic capacitance detection circuit 10 comprises an AC voltage generator 11, an operational amplifier 14 of which non-inverting input terminal is connected to specific potential (a ground in this example), an impedance converter 16, a resistance (R1) 12 connected between the AC voltage generator 11 and an inverting input terminal of the operational amplifier 14, a resistance (R2) 13 connected between the inverting input terminal of the operational amplifier 14 and an output terminal of the impedance converter 16, and an impedance element (a capacitor) 15 connected between an output terminal of the operational amplifier 14 and an input terminal of the impedance converter 16, and a capacitor to be detected 17 is connected between the input terminal of the impedance converter 16 and specific potential. The electrostatic capacitance detection circuit 10 and the capacitor 17 are located adjacently.