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36 条记录 (耗时 0.024 秒)

    Switch array
    1.
    发明授权
    Switch array 失效
    开关阵列

    公开(公告)号：US07994443B2

    公开(公告)日：2011-08-09

    申请号：US11886856

    申请日：2006-03-20

    申请人： Masato Hayashi ,  Masami Yakabe ,  Tetsuya Hasebe ,  Muneo Harada ,  Katsuya Okumura

    发明人： Masato Hayashi ,  Masami Yakabe ,  Tetsuya Hasebe ,  Muneo Harada ,  Katsuya Okumura

    IPC分类号： H01H1/00 ,  H01H9/00

    CPC分类号： H01H1/0036 ,  B81B3/0054 ,  B81B2201/014 ,  B81B2203/053 ,  H01H1/24 ,  H01H37/46 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2037/008

    摘要： A first wiring layer 16 is disposed on an insulating film 14 on the lower surface of an upper substrate 15, while a second wiring layer 13three-dimensionally crossing the first wiring layer 16 is provided on the insulating film 12 on a lower substrate 11. A cantilever 17 has one end connected to the first wiring layer 16 and the other end opposed to the second wiring layer 13 with a space therebetween. A thermoplastic sheet 19 is arranged on the upper substrate 15 so as to cover the through-hole 18. The thermoplastic sheet 19 is pressed by a heated pin 20 against the cantilever 17 and deformed so as to maintain the connection between the cantilever 17and the second wiring layer 13, and therefore close the switch 10.

    摘要翻译： 第一布线层16设置在上基板15的下表面上的绝缘膜14上，而在下基板11上的绝缘膜12上设置与第一布线层16三维交叉的第二布线层13。 悬臂17的一端与第一配线层16连接，另一端与第二配线层13相对置，而其间具有间隔。 热塑片19布置在上基板15上以覆盖通孔18.热塑片19被加热的销20压靠在悬臂17上并变形，从而保持悬臂17和第二个之间的连接 布线层13，因此闭合开关10。

    Switch Array
    2.
    发明申请
    Switch Array 失效
    开关阵列

    公开(公告)号：US20090045039A1

    公开(公告)日：2009-02-19

    申请号：US11886856

    申请日：2006-03-20

    申请人： Masato Hayashi ,  Masami Yakabe ,  Tetsuya Hasebe ,  Muneo Harada ,  Katsuya Okumura

    发明人： Masato Hayashi ,  Masami Yakabe ,  Tetsuya Hasebe ,  Muneo Harada ,  Katsuya Okumura

    IPC分类号： H01H9/00

    CPC分类号： H01H1/0036 ,  B81B3/0054 ,  B81B2201/014 ,  B81B2203/053 ,  H01H1/24 ,  H01H37/46 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2037/008

    摘要： A first wiring layer 16 is disposed on an insulating film 14 on the lower surface of an upper substrate 15, while a second wiring layer 13 three-dimensionally crossing the first wiring layer 16 is provided on the insulating film 12 on a lower substrate 11. A cantilever 17 has one end connected to the first wiring layer 16 and the other end opposed to the second wiring layer 13 with a space therebetween. A thermoplastic sheet 19 is arranged on the upper substrate 15 so as to cover the through-hole 18. The thermoplastic sheet 19 is pressed by a heated pin 20 against the cantilever 17 and deformed so as to maintain the connection between the cantilever 17 and the second wiring layer 13, and therefore close the switch 10.

    摘要翻译： 第一布线层16设置在上基板15的下表面上的绝缘膜14上，而在下基板11上的绝缘膜12上设置三维交叉第一布线层16的第二布线层13。 悬臂17的一端与第一配线层16连接，另一端与第二配线层13相对设置，其间具有间隔。 热塑片19被布置在上基板15上以覆盖通孔18.热塑片19被加热的销20压靠在悬臂17上并变形，从而保持悬臂17和 第二布线层13，因此闭合开关10。

    CHROMATOGRAPHY COLUMN AND MANUFACTURING METHOD OF THE SAME
    6.
    发明申请
    CHROMATOGRAPHY COLUMN AND MANUFACTURING METHOD OF THE SAME 审中-公开
    色谱柱及其制造方法

    公开(公告)号：US20100032357A1

    公开(公告)日：2010-02-11

    申请号：US12377274

    申请日：2007-08-14

    申请人： Tomofumi Kiyomoto ,  Muneo Harada ,  Hiroyuki Moriyama ,  Katsuya Okumura

    发明人： Tomofumi Kiyomoto ,  Muneo Harada ,  Hiroyuki Moriyama ,  Katsuya Okumura

    IPC分类号： B01D15/08 ,  B44C1/22

    CPC分类号： G01N30/6095 ,  G01N30/52 ,  G01N2030/525

    摘要： A high separation efficiency column 10 for chromatography and a manufacturing method thereof are provided. The column 10 for chromatography includes a first substrate 11 having a plurality of pillars 22 formed on one surface thereof and a second substrate 12 bonded to the one surface of the first substrate 11 and constituting a flow path 13 together with the plurality of pillars 22 formed on the first substrate. At least a surface of each pillar is formed in a porous shape.

    摘要翻译： 提供了用于色谱法的高分离效率柱10及其制造方法。 用于层析的柱10包括：第一基板11，其具有在其一个表面上形成的多个柱22;以及第二基板12，其与第一基板11的一个表面接合，并与形成的多个柱22一起构成流路13 在第一基板上。 每个柱的至少一个表面形成为多孔形状。

    Pattern forming apparatus and method of manufacturing pattern forming apparatus
    7.
    发明申请
    Pattern forming apparatus and method of manufacturing pattern forming apparatus 审中-公开
    图案形成装置和图案形成装置的制造方法

    公开(公告)号：US20060255182A1

    公开(公告)日：2006-11-16

    申请号：US11411983

    申请日：2006-04-27

    申请人： Katsuya Okumura ,  Manabu Yabe ,  Yasuyuki Koyagi ,  Muneo Harada ,  Tomofumi Kiyomoto

    发明人： Katsuya Okumura ,  Manabu Yabe ,  Yasuyuki Koyagi ,  Muneo Harada ,  Tomofumi Kiyomoto

    IPC分类号： B05B1/26 ,  B05B1/34

    CPC分类号： B41J2/1609 ,  B05C5/007 ,  B05C5/0212 ,  B05C5/027 ,  B41J2/1628 ,  B41J2/1631 ,  H01J9/242

    摘要： Using a silicon single crystal with (100) plane orientation as a base material, a pectinate portion having a slope portion and a patterning material guiding groove is formed through photolithography process. A liquid reservoir for keeping a patterning material common to tooth portions of the pectinate portion is formed in the same step as a step for forming the guiding grooves. In forming slope portion, anisotropic wet etching allows easy and accurate formation of a slope portion with (111) plane orientation to (100) plane orientation, by taking advantage of differences in speed due to the plane orientations. In addition, by forming a groove portion using anisotropic dry etching, the patterning material guiding groove having a perpendicular sidewall reaching the slope portion may be formed at high accuracy. A pattern forming apparatus with high accuracy and low cost is provided.

    摘要翻译： 使用具有（100）面取向的硅单晶作为基材，通过光刻工艺形成具有倾斜部分和图案形成材料引导槽的果胶部分。 在与用于形成导向槽的步骤相同的步骤中形成用于保持图形材料的共同于图形部分的牙齿部分的图案材料的液体储存器。 在形成斜坡部分时，通过利用由于平面取向的速度差异，各向异性湿蚀刻允许容易且准确地形成具有（111）面取向到（100）面取向的斜面部分。 此外，通过使用各向异性干蚀刻形成槽部，可以高精度地形成具有到达斜面部的垂直侧壁的图案形成材料导向槽。 提供了一种高精度，低成本的图案形成装置。

    Capacitor and manufacturing method thereof
    8.
    发明申请
    Capacitor and manufacturing method thereof 审中-公开
    电容及其制造方法

    公开(公告)号：US20070181556A1

    公开(公告)日：2007-08-09

    申请号：US11508156

    申请日：2006-08-23

    申请人： Yoshiki Yamanishi ,  Muneo Harada ,  Takahiro Kitano ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Kenji Matsuda ,  Kinji Yamada ,  Tomotaka Shinoda ,  Daohai Wang ,  Katsuya Okumura

    发明人： Yoshiki Yamanishi ,  Muneo Harada ,  Takahiro Kitano ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Kenji Matsuda ,  Kinji Yamada ,  Tomotaka Shinoda ,  Daohai Wang ,  Katsuya Okumura

    IPC分类号： F27B5/14

    CPC分类号： H01L28/55

    摘要： Atmosphere in processing apparatus is adjusted to, for example, oxygen atmosphere, by gas supply source and the like. Interior of thermal processing apparatus is set to oxygen atmosphere and raised to predetermined temperature. A wafer boat containing wafer W having dielectric precursor layer formed is loaded into thermal processing apparatus at speed at which no defects are produced in wafer W. Thereafter, reaction tube of thermal processing apparatus has its internal temperature raised to baking temperature, to perform baking for predetermined time. The wafer W is cooled to predetermined temperature in thermal processing apparatus and then to room temperature in processing apparatus, and carried out from processing apparatus. Before dielectric precursor layer is baked, it is maintained for predetermined time at temperature higher than temperature at which solvent in dielectric precursor layer is volatilized and lower than temperature at which dielectric precursor layer starts crystallization to vaporize residual solvent.

    摘要翻译： 处理装置中的气氛通过气体供给源等调节为例如氧气氛。 热处理装置的内部设定为氧气氛并升温至规定温度。 包含形成有电介质前体层的晶片W的晶片舟以晶片W中没有产生缺陷的速度装载到热处理装置中。之后，热处理装置的反应管的内部温度升高到烘烤温度，进行烘烤 预定时间 将晶片W在热处理装置中冷却至规定温度，然后在处理装置中冷却至室温，并从处理装置进行。 在电介质前体层被烘烤之前，在高于电介质前体层中的溶剂挥发并且低于电介质前体层开始结晶以蒸发残留溶剂的温度的温度下将其保持预定时间。

    PICKUP METHOD AND PICKUP DEVICE
    10.
    发明申请
    PICKUP METHOD AND PICKUP DEVICE 审中-公开
    撷取方法和撷取装置

    公开(公告)号：US20150214088A1

    公开(公告)日：2015-07-30

    申请号：US13819033

    申请日：2011-06-30

    申请人： Ken Nakao ,  Michikazu Nakamura ,  Itaru Iida ,  Muneo Harada

    发明人： Ken Nakao ,  Michikazu Nakamura ,  Itaru Iida ,  Muneo Harada

    IPC分类号： H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B25J15/06

    CPC分类号： H01L21/6835 ,  B25J15/0616 ,  B32B43/006 ,  H01L21/67011 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/68327 ,  Y10T156/1132 ,  Y10T156/1933

    摘要： Disclosed is a pickup method in which a first suction unit is caused to approach and come into contact with a chip adhered to an adhesive sheet, and a second suction unit which is formed with a concavity on a contact surface configured to come into contact with the adhesive sheet is caused to approach and come into contact with the adhesive sheet in such a manner as to be opposite to the first suction unit. The adhesive sheet is sucked by the second suction unit that is in contact with the adhesive sheet, and a fluid is injected between the adhesive sheet and the chip by an injection unit. As a result, the adhesive sheet is detached from a portion of the chip opposite to the concavity, and in the state where the chip is being sucked by the first suction unit, the first suction unit is caused to be spaced away from the adhesive sheet that is being sucked by the second suction unit. In this manner, the chip is detached and picked up from the adhesive sheet.

    摘要翻译： 公开了一种拾取方法，其中使第一吸引单元接近并与粘附到粘合片上的芯片接触;以及第二抽吸单元，其形成在接触表面上的与凹部接触的接触表面上的凹部 使粘合片以与第一抽吸单元相对的方式接近并与粘合片接触。 通过与粘合片接触的第二抽吸单元吸附粘合片，并且通过注射单元将流体注入粘合片和芯片之间。 结果，粘合片与芯片的与凹部相反的部分分离，并且在芯片被第一吸引单元吸附的状态下，使第一吸引单元与粘合片隔开 其被第二抽吸单元吸入。 以这种方式，将芯片从粘合片上分离并拾取。