公开(公告)号：US20050090188A1

公开(公告)日：2005-04-28

申请号：US10985940

申请日：2004-11-12

申请人： Noburu Shimizu ,  Norio Kimura

发明人： Noburu Shimizu ,  Norio Kimura

IPC分类号： B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  H01L21/00 ,  H01L21/306 ,  H01L21/687 ,  B24B1/00

CPC分类号： B24B37/26 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/042 ,  B24B37/105 ,  B24B37/12 ,  B24B37/16 ,  B24B37/245 ,  B24B37/345 ,  H01L21/30625 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68785 ,  H01L21/68792

摘要： A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

摘要翻译： 通过在预定压力下将工件压靠在抛光表面上来对诸如半导体晶片的工件进行抛光。 通过在预定压力下将工件压靠在处理表面上，同时处理表面沿着预定路径进行循环平移运动来处理工件的抛光表面。 处理表面包括抛光布的表面或研磨板的表面，并且进一步抛光或清洁工件的抛光表面。

公开(公告)号：US06413156B1

公开(公告)日：2002-07-02

申请号：US09301718

申请日：1999-04-29

申请人： Noburu Shimizu ,  Norio Kimura

发明人： Noburu Shimizu ,  Norio Kimura

IPC分类号： B24B2900

CPC分类号： B24B37/26 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/042 ,  B24B37/105 ,  B24B37/12 ,  B24B37/16 ,  B24B37/245 ,  B24B37/345 ,  H01L21/30625 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68785 ,  H01L21/68792

摘要： A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

公开(公告)号：US06343978B1

公开(公告)日：2002-02-05

申请号：US09566624

申请日：2000-05-08

申请人： Noburu Shimizu ,  Norio Kimura

发明人： Noburu Shimizu ,  Norio Kimura

IPC分类号： B24B100

CPC分类号： B08B1/04 ,  B24B37/042 ,  B24B37/105 ,  H01L21/67173 ,  H01L21/67219

摘要： A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

公开(公告)号：US20080251385A1

公开(公告)日：2008-10-16

申请号：US12116562

申请日：2008-05-07

申请人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

发明人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

IPC分类号： C25D21/12

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

摘要翻译： 用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。 该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。 密封材料90接触表面的周缘部分，以水密的方式密封该部分。 阴极电极88在与基板接触时通过电流。 阴极部38与基板保持部36一体旋转。 电极臂部分30在阴极部分38的上方并且可水平和垂直地移动，并且阳极98面向下。 将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。 因此，电镀处理和附带的处理可以通过单个单元进行。

公开(公告)号：US07291057B2

公开(公告)日：2007-11-06

申请号：US10601789

申请日：2003-06-24

申请人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

发明人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

IPC分类号： B24B49/00 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76807

摘要： A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

摘要翻译： 研磨基板的方法能够减小抛光台的尺寸。 将要抛光的基底的表面以与研磨台的抛光表面接触的方式使得基底表面的一部分从抛光表面的外周向外延伸。 衬底围绕其中心轴线旋转，同时保持其表面与抛光台的抛光表面接触。 控制基板载体的姿态，使得在抛光操作期间基板的表面与抛光台的抛光表面保持平行。

公开(公告)号：US20050260933A1

公开(公告)日：2005-11-24

申请号：US11187944

申请日：2005-07-25

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B9/06 ,  B24B37/12 ,  B24B37/34 ,  H01L21/00 ,  B24B49/00

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US06632335B2

公开(公告)日：2003-10-14

申请号：US09742110

申请日：2000-12-22

申请人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

发明人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

IPC分类号： C25D2112

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

摘要翻译： 用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。 该装置具有将待镀表面向上水平保持并旋转的衬底的衬底保持部分 36 。 密封材料 90 接触表面的外围边缘部分，以水密的方式密封该部分。 当与基板接触时，阴极电极 88 通过电流。 阴极部分 38 与衬底保持部分 36 整体旋转。 电极臂部分 30 在阴极部分 38 之上，水平和垂直移动并具有阳极 PDAT> 98 面朝下。 将电镀液倒入要被镀表面和靠近待镀表面的阳极 98 之间的空间中。 因此，电镀处理和附带的处理可以通过单个单元执行

公开(公告)号：US07387717B2

公开(公告)日：2008-06-17

申请号：US10631726

申请日：2003-08-01

申请人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

发明人： Junji Kunisawa ,  Mitsuko Odagaki ,  Natsuki Makino ,  Koji Mishima ,  Kenji Nakamura ,  Hiroaki Inoue ,  Norio Kimura ,  Tetsuo Matsuda ,  Hisashi Kaneko ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Manabu Tsujimura ,  Toshiyuki Morita

IPC分类号： C25D7/12

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/6723 ,  H01L21/76877 ,  H01L21/76879 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

摘要翻译： 用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。 该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。 密封材料90接触表面的周缘部分，以水密的方式密封该部分。 阴极电极88在与基板接触时通过电流。 阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。 将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。 因此，电镀处理和附带的处理可以通过单个单元进行。

公开(公告)号：US06722964B2

公开(公告)日：2004-04-20

申请号：US09824644

申请日：2001-04-04

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US5876273A

公开(公告)日：1999-03-02

申请号：US625291

申请日：1996-04-01

申请人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

发明人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Tomoyuki Yahiro ,  Hozumi Yasuda

IPC分类号： B24B37/30 ,  B24B29/02

CPC分类号： B24B37/30

摘要： A polishing apparatus is provided which improves uniformity across the surface of a polished wafer. The apparatus includes a wafer carrier, a guide ring coupled to a lower portion of the wafer carrier, a circular plate coupled to a first inner circumference portion of the guide ring distant from the wafer carrier, and a cavity, formed within an area bounded by the lower portion of the wafer carrier, an inner circumference of the circular plate, and a second inner circumference portion of the guide ring between the circular plate and the lower portion of the wafer carrier, the circular plate holding the wafer to be polished in the cavity.

摘要翻译： 提供了一种改善抛光晶片表面均匀性的抛光装置。 该装置包括晶片载体，联接到晶片载体的下部的引导环，耦合到远离晶片载体的引导环的第一内周部分的圆形板，以及形成在由 晶片载体的下部，圆形板的内圆周和导向环的第二内周部分在圆形板和晶片载体的下部之间，圆形板将待抛光的晶片保持在 腔。