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    Revolving drum polishing apparatus
    4.
    发明授权
    Revolving drum polishing apparatus 失效
    滚筒抛光装置

    公开(公告)号：US5643056A

    公开(公告)日：1997-07-01

    申请号：US550117

    申请日：1995-10-30

    申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

    发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

    IPC分类号： B24B7/22 ,  B24B29/02 ,  B24B37/07 ,  B24B37/10 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B7/228 ,  B24B29/02 ,  B24B37/04

    摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.

    摘要翻译： 用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。 相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。 结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和 设备成本

    Method for polishing workpieces and apparatus therefor
    5.
    发明授权
    Method for polishing workpieces and apparatus therefor 失效
    抛光工件的方法及其设备

    公开(公告)号：US5989107A

    公开(公告)日：1999-11-23

    申请号：US857252

    申请日：1997-05-16

    申请人： Noburu Shimizu ,  Norio Kimura

    发明人： Noburu Shimizu ,  Norio Kimura

    IPC分类号： B24B27/00 ,  B24B37/04 ,  B24B37/07 ,  B24B37/10 ,  B24B37/11 ,  B24B1/00

    CPC分类号： B24B37/042 ,  B24B27/0023 ,  B24B37/07 ,  B24B37/10 ,  B24B37/11

    摘要： A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being moved in a planar translation motion relatively to the work surface.

    摘要翻译： 提出了用于该方法的抛光方法和紧凑的装置，用于有效地生产用于制造高技术装置的抛光工件。 抛光方法包括用于抛光工作表面的第一和第二步骤。 在第一抛光步骤中，将工作表面按压在正在旋转的第一抛光工具的研磨表面上。 在第二步骤中，工作表面被压在相对于工作表面平面移动运动的第二抛光工具的摩擦表面上。

    Method and apparatus for polishing workpiece
    6.
    发明授权
    Method and apparatus for polishing workpiece 失效

    公开(公告)号：US06343978B1

    公开(公告)日：2002-02-05

    申请号：US09566624

    申请日：2000-05-08

    申请人： Noburu Shimizu ,  Norio Kimura

    发明人： Noburu Shimizu ,  Norio Kimura

    IPC分类号： B24B100

    CPC分类号： B08B1/04 ,  B24B37/042 ,  B24B37/105 ,  H01L21/67173 ,  H01L21/67219

    摘要： A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

    Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method
    8.
    发明授权
    Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method 有权
    用于选择用于抛光端点检测的光的波长的图的制作方法，用于选择用于抛光端点检测的光的波长的选择方法和抛光终点检测方法

    公开(公告)号：US08388408B2

    公开(公告)日：2013-03-05

    申请号：US12461533

    申请日：2009-08-14

    申请人： Yoichi Kobayashi ,  Noburu Shimizu ,  Shinrou Ohta

    发明人： Yoichi Kobayashi ,  Noburu Shimizu ,  Shinrou Ohta

    IPC分类号： B24B49/00 ,  B24B51/00

    CPC分类号： B24B49/12 ,  B24B37/013

    摘要： A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.

    摘要翻译： 提供了一种制造用于选择光学抛光终点检测中的光的波长的图的方法。 该方法包括通过抛光垫抛光具有膜的基板的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 计算各波长的反射光的相对反射率; 确定反射光的波长，其指示随抛光时间变化的相对反射率的局部最大点和局部最小点; 识别指示表示局部最大点和局部最小点的波长的时间点; 并且将由波长相对应的波长和时间点指定的坐标绘制到具有指示光的波长和抛光时间的坐标轴的坐标系上。

    Polishing apparatus and polishing method
    9.
    发明授权
    Polishing apparatus and polishing method 有权
    抛光设备和抛光方法

    公开(公告)号：US08025759B2

    公开(公告)日：2011-09-27

    申请号：US10559815

    申请日：2004-07-01

    申请人： Tatsuya Sasaki ,  Naoshi Yamada ,  Yoshifumi Katsumata ,  Noburu Shimizu ,  Seiryo Tsuno ,  Takashi Mitsuya

    发明人： Tatsuya Sasaki ,  Naoshi Yamada ,  Yoshifumi Katsumata ,  Noburu Shimizu ,  Seiryo Tsuno ,  Takashi Mitsuya

    IPC分类号： H01L21/304 ,  B24B37/04

    CPC分类号： B24B49/03 ,  B24B37/042 ,  H01L21/3212

    摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.

    摘要翻译： 抛光装置具有：抛光部（302），被配置为对基板进行抛光;以及测量部（307），被配置为测量形成在基板上的膜的厚度。 抛光装置还具有被配置为输入形成在待抛光的基板上的膜的期望厚度的接口（310）和被配置为在其中至少一个过去的基板上存储抛光速率数据的存储装置（308a）。 抛光装置包括运算单元（308b），其通过使用加权平均法来计算抛光速率和基于抛光速率数据和期望厚度的最佳抛光时间，该加权平均法将抛光速率数据加权到最近抛光的基底上。

    Polishing method and polishing apparatus
    10.
    发明申请
    Polishing method and polishing apparatus 审中-公开
    抛光方法和抛光装置

    公开(公告)号：US20070243797A1

    公开(公告)日：2007-10-18

    申请号：US11785190

    申请日：2007-04-16

    申请人： Akira Fukunaga ,  Noburu Shimizu ,  Shintaro Kamioka ,  Manabu Tsujimura

    发明人： Akira Fukunaga ,  Noburu Shimizu ,  Shintaro Kamioka ,  Manabu Tsujimura

    IPC分类号： B24B49/00 ,  B24B1/00

    CPC分类号： B24B37/042 ,  B24B49/045 ,  H01L22/26

    摘要： A polishing method for polishing a workpiece using the chemical polishing process endpoint detecting technology is applicable to actual polishing processes and polishing apparatus. The polishing method including pressing the workpiece against a polishing surface of a polishing table, moving the workpiece and the polishing surface relatively to each other to polish the workpiece, and disposing a gas suction pipe having a gas inlet port, directly above the polishing surface, supplying an atmospheric gas from above the polishing surface through the gas inlet port to a gas detector via the gas suction pipe, and monitoring a particular gas contained in the atmospheric gas with the gas detector while the workpiece is being polished.

    摘要翻译： 使用化学抛光处理终点检测技术对工件进行抛光的抛光方法适用于实际的抛光工艺和抛光装置。 抛光方法包括将工件压靠在抛光台的研磨面上，相对移动工件和抛光表面以抛光工件，并且在抛光表面正上方设置具有气体入口的气体吸入管， 通过气体吸入管将来自抛光表面上方的大气气体通过气体入口供给到气体检测器，并且在抛光工件时，利用气体检测器监测包含在气体中的特定气体。