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公开(公告)号：US20210272839A1
公开(公告)日：2021-09-02
申请号：US17183862
申请日：2021-02-24
Inventor： Manuel Sohn , Rolf Bremensdorfer , Silke Hamm , Alex Wansidler
IPC: H01L21/687 , C23C14/30 , C23C14/50
Abstract: Support plates and support structures for thermal processing systems to heat workpieces are provided. In one example, a thermal processing apparatus is provided that includes a plurality of heat sources, a rotatable support plate, and a support structure having a flexibility in the radial direction of the rotatable support plate that is greater than a flexibility in the azimuthal direction of the rotatable support plate. Also provided are support plates for supporting a workpiece in a thermal processing apparatus. The support plate can include a base defining a radial direction and an azimuthal direction and at least one support structure extending from the base having a flexibility in the radial direction of the base that is greater than a flexibility in the azimuthal direction of the base.
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公开(公告)号：US20170196046A1
公开(公告)日：2017-07-06
申请号：US15380139
申请日：2016-12-15
Applicant: Mattson Technology, Inc.
Inventor： Rolf Bremensdorfer , Dave Camm , Pete Lembesis , Joseph Cibere
CPC classification number: H05B3/0047 , H01J61/0732 , H01J61/526 , H01L21/67109 , H01L21/67115 , H01L21/6719 , H01L21/67248 , H05B31/0057
Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.
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公开(公告)号：US12183558B2
公开(公告)日：2024-12-31
申请号：US18494486
申请日：2023-10-25
Inventor： Dixit Desai , Alex Wansidler , Dieter Hezler , Joseph Cibere , Rolf Bremensdorfer , Pete Lembesis , Michael Yang
IPC: H01J37/32
Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.
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公开(公告)号：US20240387205A1
公开(公告)日：2024-11-21
申请号：US18787295
申请日：2024-07-29
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/324 , H01L21/687
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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公开(公告)号：US12080568B2
公开(公告)日：2024-09-03
申请号：US18074713
申请日：2022-12-05
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/324 , H01L21/687
CPC classification number: H01L21/67115 , H01L21/324 , H01L21/68742 , H01L21/6875 , H01L21/68757
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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Patent Agency Ranking
16.发明公开公开(公告)号：US20230230887A1
公开(公告)日：2023-07-20
申请号：US18185970
申请日：2023-03-17
Inventor： Michael Storek , Rolf Bremensdorfer , Markus Lieberer , Michael Yang
CPC classification number: H01L22/12 , G01J5/042 , H01L22/34 , H01L21/67115
Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.
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公开(公告)号：US20220165561A1
公开(公告)日：2022-05-26
申请号：US17533593
申请日：2021-11-23
Inventor： Michael X. Yang , Rolf Bremensdorfer , Dave Camm , Joseph Cibere , Dieter Hezler , Shawming Ma , Yun Yang
IPC: H01J61/86 , H01J61/28 , H05H1/48 , H01J61/073 , H01J61/52
Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.
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公开(公告)号：US20220090221A1
公开(公告)日：2022-03-24
申请号：US17541425
申请日：2021-12-03
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael Yang
Abstract: Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.
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公开(公告)号：US10966286B2
公开(公告)日：2021-03-30
申请号：US15380139
申请日：2016-12-15
Inventor： Rolf Bremensdorfer , Dave Camm , Pete Lembesis , Joseph Cibere
IPC: H05B3/00 , H01L21/67 , H01J61/52 , H01J61/073 , H05B31/00
Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.
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公开(公告)号：US20190127818A1
公开(公告)日：2019-05-02
申请号：US16059148
申请日：2018-08-09
Applicant: Mattson Technology, Inc.
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael Yang
Abstract: Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.
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