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公开(公告)号：US11617892B2
公开(公告)日：2023-04-04
申请号：US16604383
申请日：2018-03-14
Applicant: Medtronic, Inc.
Inventor： Rajesh V. Iyer , Randy S. Roles , Erik R. Scott , Andrew J. Thom
Abstract: A lead connector assembly includes a lead receptacle, a sleeve, and a handle for coupling to a medical lead. The lead receptacle has an inner surface and an opening configured to receive the lead. The sleeve is deflectable by the inner surface of the lead receptacle. The sleeve has a distal end portion defining a first outer diameter to engage the lead in a locked position and a second outer diameter greater than the first diameter in an unlocked position. The handle is coupled to the lead receptacle and a proximal end portion of the sleeve to move the sleeve axially in both directions along the longitudinal axis relative to the lead receptacle. The lead connector assembly retains the lead in the locked position. The lead receptacle is couplable to a medical device housing.
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公开(公告)号：US20220314007A1
公开(公告)日：2022-10-06
申请号：US17694990
申请日：2022-03-15
Applicant: Medtronic, Inc.
Inventor： Rajesh V. Iyer , Paul B. Young , Andrew J. Thom , Randy S. Roles
Abstract: Various embodiments of an implantable medical device and a wireless energy transfer system that includes the implantable medical device are disclosed. The device includes a housing that has a first major surface and a second major surface, a sidewall that extends between the first major surface and the second major surface, and an opening disposed in the sidewall. The device further includes a window disposed on at least one of the first major surface or second major surface of the housing, and a nonconductive material disposed on the housing, wherein the opening is hermetically sealed by the nonconductive material. At least one of the window or the sealed opening is adapted to transmit electromagnetic energy.
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公开(公告)号：US20220080188A1
公开(公告)日：2022-03-17
申请号：US17536360
申请日：2021-11-29
Applicant: Medtronic, Inc.
Inventor： Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
IPC: A61N1/05 , H01R13/187 , H01R24/58 , A61N1/375 , B23K26/21 , B23K20/02 , C23C14/10 , C23C14/18 , C23C14/34 , H01R43/02
Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
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公开(公告)号：US20200261732A1
公开(公告)日：2020-08-20
申请号：US16786078
申请日：2020-02-10
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Andrew J. Thom
IPC: A61N1/375 , C03C3/064 , C03C3/068 , C03C3/066 , C03C8/02 , C03C8/24 , C03C8/04 , H01B3/08 , H01B17/22
Abstract: A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.
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公开(公告)号：US09950180B2
公开(公告)日：2018-04-24
申请号：US14394507
申请日：2013-03-12
Applicant: MEDTRONIC, INC.
Inventor： Darren A. Janzig , Gerald Lindner , Chris J. Paidosh , Andrew J. Thom , Brad C. Tischendorf
IPC: A61N1/375
CPC classification number: A61N1/3758 , A61N1/375 , A61N1/3752
Abstract: A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.
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Patent Agency Ranking
公开(公告)号：US20170072189A1
公开(公告)日：2017-03-16
申请号：US15363178
申请日：2016-11-29
Applicant: Medtronic, Inc.
Inventor： Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
IPC: A61N1/05 , H01R13/187 , H01R43/02 , C23C14/18 , B23K20/02 , C23C14/34 , C23C14/10 , H01R24/58 , B23K26/21
CPC classification number: A61N1/05 , A61B2562/227 , A61N1/3752 , B23K20/026 , B23K26/21 , B23K2101/38 , B23K2103/172 , B23K2103/52 , B23K2103/54 , C23C14/10 , C23C14/18 , C23C14/34 , H01R13/187 , H01R24/58 , H01R43/0221 , H01R2107/00 , H01R2201/12 , Y10T156/10
Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
Abstract translation: 医疗器件引线连接器包括由电绝缘环间隔开并且轴向对准的导电接触环。 导电接触环和绝缘环在原子水平上具有接合键。
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公开(公告)号：US20150306415A1
公开(公告)日：2015-10-29
申请号：US14694134
申请日：2015-04-23
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Gordon O. Munns , Christian S. Nielsen , John D. Norton , Markus W. Reiterer , Andrew J. Thom , Kunal J. Paralikar
IPC: A61N5/06
CPC classification number: A61N5/0601 , A61N1/05 , A61N1/36 , A61N2005/0626 , A61N2005/0651
Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
Abstract translation: 可植入有源医疗装置系统包括主动医疗装置和在电耦合到主动医疗装置的近端部分和配置成发光的远端部分之间延伸的引线。 前端部分包括设置在透光环形元件内的固态光源。 透光环元件形成远端部分的外部段。 透光环元件限定了密封腔的至少一部分。
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公开(公告)号：US11647600B2
公开(公告)日：2023-05-09
申请号：US17136242
申请日：2020-12-29
Applicant: Medtronic, Inc.
Inventor： Christian S. Nielsen , Rajesh V. Iyer , Gordon O. Munns , Andrew J. Ries , Andrew J. Thom
CPC classification number: H05K5/069 , A61N1/378 , A61N1/3758 , H05K5/0086 , H05K7/1417 , H01M50/543 , H01M2220/30
Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.
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公开(公告)号：US20210290964A1
公开(公告)日：2021-09-23
申请号：US17343467
申请日：2021-06-09
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Andrew J. Thom
IPC: A61N1/375 , C03C3/064 , C03C3/068 , C03C3/066 , C03C8/24 , C03C8/04 , H01B3/08 , H01B17/22 , C03C8/02
Abstract: A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.
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公开(公告)号：US11110290B2
公开(公告)日：2021-09-07
申请号：US16291170
申请日：2019-03-04
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Gordon O. Munns , Christian S. Nielsen , John D. Norton , Markus W. Reiterer , Andrew J. Thom , Kunal J. Paralikar
Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
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