公开(公告)号：US06887131B2

公开(公告)日：2005-05-03

申请号：US10228094

申请日：2002-08-27

申请人： Lei Jiang ,  Sadasivan Shankar ,  Paul Fischer

发明人： Lei Jiang ,  Sadasivan Shankar ,  Paul Fischer

IPC分类号： B24B37/26 ,  B24D13/14 ,  B24D18/00 ,  B24B9/00

CPC分类号： B24B37/26 ,  B24D18/00

摘要： A method is provided for creating a polish pad. This may involve determining a design layout of a wafer. The design layout may include a distribution of metal line features on the wafer. A polish pad design may be created/determined based on the determined layer. The polish pad may have asperities having a width greater than a width of metal line features of the wafer.

摘要翻译： 提供了一种用于创建抛光垫的方法。 这可能涉及确定晶片的设计布局。 设计布局可以包括晶片上的金属线特征的分布。 可以基于确定的层创建/确定抛光垫设计。 抛光垫可以具有宽度大于晶片的金属线特征的宽度的粗糙度。

公开(公告)号：US20050054143A1

公开(公告)日：2005-03-10

申请号：US10939226

申请日：2004-09-10

申请人： Sergei Skokov ,  Lei Jiang ,  Sadasivan Shankar

发明人： Sergei Skokov ,  Lei Jiang ,  Sadasivan Shankar

IPC分类号： C08G61/02 ,  H01L21/56 ,  H01L23/29 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02

CPC分类号： H01L21/563 ,  C08G61/02 ,  H01L23/293 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： A cyclotene chemical structure may be modified to reduce its curing temperature. With the reduced curing temperature, the material may be highly advantageous as an underfill material for surface nonpackaging.

摘要翻译： 旋光化学结构可以被修饰以降低其固化温度。 随着固化温度的降低，该材料作为表面非包装的底部填充材料可能是非常有利的。

公开(公告)号：US08154121B2

公开(公告)日：2012-04-10

申请号：US12037625

申请日：2008-02-26

申请人： Kunal Shah ,  Michael Haverty ,  Sadasivan Shankar ,  Doug Ingerly ,  Grant Kloster

发明人： Kunal Shah ,  Michael Haverty ,  Sadasivan Shankar ,  Doug Ingerly ,  Grant Kloster

IPC分类号： H01L23/48

CPC分类号： H01L21/312 ,  H01L21/02118 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： Polymer interlayer dielectric and passivation materials for a microelectronic device are generally described. In one example, an apparatus includes one or more interconnect structures of a microelectronic device and one or more polymeric dielectric layers coupled with the one or more interconnect structures, the polymeric dielectric layers including copolymer backbones having a first monomeric unit and a second monomeric unit wherein the first monomeric unit has a different chemical structure than the second monomeric unit and wherein the copolymer backbones are cross-linked by a first cross-linker or a second cross-linker, or combinations thereof.

摘要翻译： 通常描述用于微电子器件的聚合物层间电介质和钝化材料。 在一个示例中，装置包括微电子器件的一个或多个互连结构以及与一个或多个互连结构耦合的一个或多个聚合物电介质层，所述聚合物电介质层包括具有第一单体单元和第二单体单元的共聚物主链，其中 第一单体单元具有与第二单体单元不同的化学结构，并且其中共聚物主链通过第一交联剂或第二交联剂或其组合交联。

公开(公告)号：US20070224834A1

公开(公告)日：2007-09-27

申请号：US11582720

申请日：2006-10-17

申请人： Michael Haverty ,  Tim Chen ,  Sadasivan Shankar

发明人： Michael Haverty ,  Tim Chen ,  Sadasivan Shankar

IPC分类号： H01L21/31

CPC分类号： H01L21/7682 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/314 ,  H01L21/31695 ,  H01L2221/1047

摘要： Numerous embodiments of an apparatus and method of a dielectric material having a low dielectric constant and good mechanical strength are described. In one embodiment a dielectric material having multiple porous regions is disposed over a substrate. A caged structure is bridged within the plurality of pores. In one particular embodiment, the caged structure may be carborane or a carborane derivative.

摘要翻译： 描述具有低介电常数和良好机械强度的介电材料的装置和方法的许多实施例。 在一个实施例中，具有多个多孔区域的电介质材料设置在衬底上。 笼形结构桥接在多个孔内。 在一个具体实施方案中，笼状结构可以是碳硼烷或碳硼烷衍生物。

公开(公告)号：US20090001591A1

公开(公告)日：2009-01-01

申请号：US11771476

申请日：2007-06-29

申请人： Michael Haverty ,  Sadasivan Shankar ,  Kevin O'Brien ,  Seongjun Park

发明人： Michael Haverty ,  Sadasivan Shankar ,  Kevin O'Brien ,  Seongjun Park

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L23/485 ,  H01L21/76801 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： Techniques for reducing resistivity in metal interconnects by compressive straining are generally described. In one example, an apparatus includes a dielectric substrate, a thin film of metal coupled with the dielectric substrate, and an interconnect metal coupled to the thin film of metal, the thin film of metal having a lattice parameter that is smaller than the lattice parameter of the interconnect metal to compressively strain the interconnect metal.

摘要翻译： 通常描述通过压缩应变来降低金属互连中的电阻率的技术。 在一个示例中，设备包括电介质基板，与电介质基板耦合的金属薄膜和耦合到金属薄膜的互连金属，金属薄膜具有小于晶格参数的晶格参数 的互连金属，以压缩互连金属。

公开(公告)号：US20060071300A1

公开(公告)日：2006-04-06

申请号：US10957231

申请日：2004-09-30

申请人： Michael Haverty ,  Tim Chen ,  Sadasivan Shankar

发明人： Michael Haverty ,  Tim Chen ,  Sadasivan Shankar

IPC分类号： H01L23/58

CPC分类号： H01L21/7682 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/314 ,  H01L21/31695 ,  H01L2221/1047

摘要： Numerous embodiments of an apparatus and method of a dielectric material having a low dielectric constant and good mechanical strength are described. In one embodiment a dielectric material having multiple porous regions is disposed over a substrate. A caged structure is bridged within the plurality of pores. In one particular embodiment, the caged structure may be carborane or a carborane derivative.

摘要翻译： 描述具有低介电常数和良好机械强度的介电材料的装置和方法的许多实施例。 在一个实施例中，具有多个多孔区域的电介质材料设置在衬底上。 笼形结构桥接在多个孔内。 在一个具体实施方案中，笼状结构可以是碳硼烷或碳硼烷衍生物。

公开(公告)号：US07021999B2

公开(公告)日：2006-04-04

申请号：US11099926

申请日：2005-04-05

申请人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

发明人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

IPC分类号： B24B1/00

CPC分类号： B24B53/017

摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

摘要翻译： 一种用于抛光晶片的装置，包括具有旋转中心的可旋转抛光垫和邻近抛光垫定位并基本上与中心径向对准的冲洗输送导管。 冲洗输送导管包括多个喷嘴以分配冲洗液体。 在一个实施例中，多个喷嘴被配置和定位成在漂洗输送导管的末端靠近中心产生较高流量的漂洗液体，而不是在远离中心的漂洗输送导管末端。 在另一个实施例中，冲洗输送导管具有基本上邻近中心的近端和与垫的外周近似近似的远端。

公开(公告)号：US20050181709A1

公开(公告)日：2005-08-18

申请号：US11099926

申请日：2005-04-05

申请人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

发明人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

IPC分类号： B24B37/04 ,  B24B53/007 ,  B24B1/00

CPC分类号： B24B53/017

摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

摘要翻译： 一种用于抛光晶片的装置，包括具有旋转中心的可旋转抛光垫和邻近抛光垫定位并基本上与中心径向对准的冲洗输送导管。 冲洗输送导管包括多个喷嘴以分配冲洗液体。 在一个实施例中，多个喷嘴被配置和定位成在漂洗输送导管的末端靠近中心产生较高流量的漂洗液体，而不是在远离中心的漂洗输送导管末端。 在另一个实施例中，冲洗输送导管具有基本上邻近中心的近端和与垫的外周近似近似的远端。

公开(公告)号：US06908370B1

公开(公告)日：2005-06-21

申请号：US10728550

申请日：2003-12-04

申请人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

发明人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

IPC分类号： B24B37/04 ,  B24B53/007 ,  B24B1/00

CPC分类号： B24B53/017

摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

公开(公告)号：US20050124267A1

公开(公告)日：2005-06-09

申请号：US10728550

申请日：2003-12-04

申请人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

发明人： Lei Jiang ,  Jin Liu ,  Sadasivan Shankar ,  Thomas Bramblett

IPC分类号： B24B37/04 ,  B24B53/007 ,  B24B1/00

CPC分类号： B24B53/017

摘要： An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

摘要翻译： 一种用于抛光晶片的装置，包括具有旋转中心的可旋转抛光垫和邻近抛光垫定位并基本上与中心径向对准的冲洗输送导管。 冲洗输送管道包括多个喷嘴以分配冲洗液体。 在一个实施例中，多个喷嘴被配置和定位成在漂洗输送导管的末端靠近中心产生较高流量的漂洗液体，而不是在远离中心的漂洗输送导管末端。 在另一个实施例中，冲洗输送导管具有基本上邻近中心的近端和与垫的外周近似近似的远端。