MEMORY BUILT-IN SELF-TEST WITH ADJUSTABLE PAUSE TIME

    公开(公告)号:US20230069351A1

    公开(公告)日:2023-03-02

    申请号:US17411206

    申请日:2021-08-25

    Abstract: An apparatus with a memory array having a plurality of memory cells. The apparatus also including a memory built-in self-test circuit to test the memory array. The memory built-in self-test circuit includes one or more processing devices to write a data pattern to one or more memory cells to be tested in the memory array, pause for a time period corresponding to a predetermined pause time setting, and read the written data pattern from the one or more memory cells after the time period has elapsed. The predetermined pause time setting is automatically adjusted based on memory device conditions, which can include the temperature of the apparatus.

    SERIAL INTERFACES WITH SHADOW REGISTERS, AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS

    公开(公告)号:US20230063588A1

    公开(公告)日:2023-03-02

    申请号:US17464650

    申请日:2021-09-01

    Abstract: Serial interfaces with shadow registers, and associated systems, devices, and methods are described herein. In one embodiment, a serial interface is an IEEE 1500 interface, such as of an interface die of a high bandwidth memory (HBM) device. The IEEE 1500 interface includes (a) a primary wrapper data register (WDR) configured to store first information received in a first wrapper serial input (WSI) signal, (b) a shadow WDR configured to store second information received in a second WSI signal, and (c) a multiplexer. The multiplexer is configured to (i) receive the first information from the primary WDR, (ii) receive the second information from the shadow WDR, and (iii) output the first information or the second information based at least in part on a control signal input into the multiplexer.

    Identifying high impedance faults in a memory device

    公开(公告)号:US11170837B1

    公开(公告)日:2021-11-09

    申请号:US16860498

    申请日:2020-04-28

    Abstract: Methods, systems, and devices related to identifying high impedance faults in a memory device are described. A memory device may perform a first write operation to write a first logic state to a memory cell. During the first write operation, the memory device may establish a connection between a supply line and a control line associated with applying an output of a driver of a digit line coupled to the memory cell. After performing the first operation, the memory device may configure the supply line in a floating state. After the supply line is floated, the memory device may perform a second write operation to write a second logic state to the memory cell. The memory device may perform a third operation for reading the memory cell. The memory device may determine the condition of the supply line or control based on the result of the read operation.

    IDENTIFYING HIGH IMPEDANCE FAULTS IN A MEMORY DEVICE

    公开(公告)号:US20210335410A1

    公开(公告)日:2021-10-28

    申请号:US16860498

    申请日:2020-04-28

    Abstract: Methods, systems, and devices related to identifying high impedance faults in a memory device are described. A memory device may perform a first write operation to write a first logic state to a memory cell. During the first write operation, the memory device may establish a connection between a supply line and a control line associated with applying an output of a driver of a digit line coupled to the memory cell. After performing the first operation, the memory device may configure the supply line in a floating state. After the supply line is floated, the memory device may perform a second write operation to write a second logic state to the memory cell. The memory device may perform a third operation for reading the memory cell. The memory device may determine the condition of the supply line or control based on the result of the read operation.

    Memory device random option inversion

    公开(公告)号:US11081166B1

    公开(公告)日:2021-08-03

    申请号:US17000202

    申请日:2020-08-21

    Abstract: Methods, systems, and devices for memory device random option inversion are described. A memory device may use a second set of fuses to selectively invert options associated with a first set of fuses (e.g., blown fuses). The first set of fuses may output a first set of logic states. Option inversion logic circuitry may perform decoding based on a second set of logic states output by the second set of fuses to identify logic states of the second set of logic states that match the first set of logic states. Based on identifying the logic states, the option inversion logic circuitry may select either a logic state of the first set of logic states or an inverted logic state corresponding to the logic state, and store the selected logic state in a latch of the memory device.

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