HIGH-FREQUENCY MODULE
    12.
    发明公开

    公开(公告)号:US20240014832A1

    公开(公告)日:2024-01-11

    申请号:US18474298

    申请日:2023-09-26

    CPC classification number: H04B1/0057 H04B1/0078

    Abstract: A high-frequency module that includes: a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component including a PA controller which controls the power amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

    FRONT-END MODULE AND COMMUNICATION DEVICE
    14.
    发明申请

    公开(公告)号:US20190140669A1

    公开(公告)日:2019-05-09

    申请号:US16142081

    申请日:2018-09-26

    Inventor: Kiyoshi AIKAWA

    CPC classification number: H04B1/006 H04B1/16

    Abstract: A front-end module includes a switch, a first filter including an input end connected to a first selection terminal, a second filter including input end connected to a second selection terminal, and an impedance matching circuit connected to a selection terminal, a pass band impedance when viewing the first filter side from a common terminal in a state in which the common terminal and only the first selection terminal are connected is different from a pass band impedance when viewing the second filter side from the common terminal in a state that the common terminal and only the second selection terminal are connected. When the common terminal and the first selection terminal are connected, the common terminal and the selection terminal are connected, and when the common terminal and the second selection terminal are connected, the common terminal and the selection terminal are not connected.

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20240178871A1

    公开(公告)日:2024-05-30

    申请号:US18437360

    申请日:2024-02-09

    CPC classification number: H04B1/38 H03H7/38

    Abstract: A radio-frequency module including a module substrate, a plurality of electronic components, a plurality of external connection terminals, a resin member, and a plurality of electrodes. The module substrate has first and second major surfaces that are opposite to each other. The plurality of electronic components are disposed at the major surface and at the major surface. The external connection terminals are disposed at the major surface and include a first external connection terminal. The resin member is disposed at the major surface. The plurality of electrodes are disposed at the major surface and coupled to the plurality of external connection terminals. The plurality of electronic components include a passive component disposed at the major surface. At least a portion of the first external connection terminal overlaps at least a portion of the passive component in plan view of the module substrate.

    HIGH-FREQUENCY MODULE
    18.
    发明公开

    公开(公告)号:US20240023263A1

    公开(公告)日:2024-01-18

    申请号:US18473289

    申请日:2023-09-25

    CPC classification number: H05K7/026 H05K1/181 H05K1/144 H05K1/0237 H03F3/245

    Abstract: A high-frequency module includes a module substrate having major surfaces, and a module substrate having major surfaces. The major surface are disposed facing the major surface. A first electronic component includes a filter coupled to a power amplifier and a low-noise amplifier. A second electronic component includes a filter coupled to a low-noise amplifier. A third electronic component includes a switch coupled between filters and an antenna connection terminal. The first electronic component is disposed between the major surfaces, on the major surface, or on the major surface. The second electronic component is disposed between the major surfaces, on the major surface, or on the major surface where the first electronic component is not disposed. The third electronic component is disposed between the major surfaces, on the major surface, or on the major surface wherein neither of the first nor second electronic component is disposed.

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20240014841A1

    公开(公告)日:2024-01-11

    申请号:US18473329

    申请日:2023-09-25

    CPC classification number: H04B1/38 H04B1/006 H03F3/24

    Abstract: A radio-frequency module includes one or more first electronic components disposed on one main surface and one or more second electronic components disposed on another main surface. The one or more first electronic components include at least one of a filter whose passband includes a first band, a switch connected to the filter, a power amplifier connected to the filter, and a switch connected to the filter. The one or more second electronic components include at least one of a filter whose passband includes a second band in which the frequency of a harmonic wave of a signal in the first band is included, a switch connected to the filter, a low-noise amplifier connected to the filter, and an inductor connected to a path that forms a connection between the first low-noise amplifier and an antenna connection terminal.

Patent Agency Ranking