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公开(公告)号:US20240014840A1
公开(公告)日:2024-01-11
申请号:US18473279
申请日:2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kiyoshi AIKAWA , Takanori UEJIMA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON
CPC classification number: H04B1/38 , H03F3/245 , H03F1/565 , H03F2200/222 , H03F2200/387
Abstract: A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components are disposed between the second main surface and the third main surface, on the first main surface, and on the fourth main surface. A first inductor is disposed in the first module substrate. The multiple electronic components include a first filter, and a switch that connects and disconnects an antenna connection terminal and the first filter. The first inductor is connected between the switch and the first filter. The first module substrate is thicker than the second module substrate.
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公开(公告)号:US20240014832A1
公开(公告)日:2024-01-11
申请号:US18474298
申请日:2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kiyoshi AIKAWA , Takanori UEJIMA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON
IPC: H04B1/00
CPC classification number: H04B1/0057 , H04B1/0078
Abstract: A high-frequency module that includes: a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component including a PA controller which controls the power amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.
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公开(公告)号:US20230318642A1
公开(公告)日:2023-10-05
申请号:US18331954
申请日:2023-06-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takanori UEJIMA , Kiyoshi AIKAWA , Masanari MIURA , Hiroyuki NAGAMORI
CPC classification number: H04B1/0483 , H03F3/245 , H03F1/56 , H03F2200/171 , H03F2200/451
Abstract: A radio frequency circuit includes a transmit filter for B66-Tx connected to a power amplifier, a transmit filter for B25-Tx connected to a power amplifier, a switch circuit having terminals, a switch circuit having a common terminal and terminals, and a switch circuit having a common terminal and terminals. The terminal is connected to the common terminal, the terminal is connected to the common terminal, the terminal is connected to the transmit filter, and the terminal is connected to the transmit filter. The switch circuit has a smaller stack number than the switch circuit, and the switch circuit has a smaller stack number than the switch circuit.
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公开(公告)号:US20190140669A1
公开(公告)日:2019-05-09
申请号:US16142081
申请日:2018-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kiyoshi AIKAWA
Abstract: A front-end module includes a switch, a first filter including an input end connected to a first selection terminal, a second filter including input end connected to a second selection terminal, and an impedance matching circuit connected to a selection terminal, a pass band impedance when viewing the first filter side from a common terminal in a state in which the common terminal and only the first selection terminal are connected is different from a pass band impedance when viewing the second filter side from the common terminal in a state that the common terminal and only the second selection terminal are connected. When the common terminal and the first selection terminal are connected, the common terminal and the selection terminal are connected, and when the common terminal and the second selection terminal are connected, the common terminal and the selection terminal are not connected.
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公开(公告)号:US20240250013A1
公开(公告)日:2024-07-25
申请号:US18583970
申请日:2024-02-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Motoji TSUDA , Kiyoshi AIKAWA , Takashi YAMADA , Toshiki MATSUI
IPC: H01L23/498 , H01L23/538 , H01L23/552 , H01L25/00 , H01L25/10
CPC classification number: H01L23/49838 , H01L23/5386 , H01L25/105 , H01L25/50 , H01L23/552
Abstract: A radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The second electronic component and the first connection terminal are disposed on a second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal, and is disposed on a side of the first connection terminal opposite to the mounting substrate side. The first resin layer covers at least a part of the second electronic component, and covers at least a part of the first connection terminals. The second resin layer is disposed on the first resin layer, and covers at least a part of the second connection terminal. The second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.
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公开(公告)号:US20240178871A1
公开(公告)日:2024-05-30
申请号:US18437360
申请日:2024-02-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takashi YAMADA , Kiyoshi AIKAWA , Motoji TSUDA
Abstract: A radio-frequency module including a module substrate, a plurality of electronic components, a plurality of external connection terminals, a resin member, and a plurality of electrodes. The module substrate has first and second major surfaces that are opposite to each other. The plurality of electronic components are disposed at the major surface and at the major surface. The external connection terminals are disposed at the major surface and include a first external connection terminal. The resin member is disposed at the major surface. The plurality of electrodes are disposed at the major surface and coupled to the plurality of external connection terminals. The plurality of electronic components include a passive component disposed at the major surface. At least a portion of the first external connection terminal overlaps at least a portion of the passive component in plan view of the module substrate.
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公开(公告)号:US20240038692A1
公开(公告)日:2024-02-01
申请号:US18477589
申请日:2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takashi YAMADA , Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takanori UEJIMA , Yoshihiro DAIMON
IPC: H01L23/66 , H01L23/498 , H03F3/24 , H03F1/56 , H01L25/065
CPC classification number: H01L23/66 , H01L23/49822 , H01L23/49838 , H03F3/245 , H03F1/565 , H01L25/0652 , H01L2223/6655 , H01L2223/6677 , H01L2223/6616 , H03F2200/294 , H03F2200/451 , H01L2223/6672
Abstract: A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.
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公开(公告)号:US20240023263A1
公开(公告)日:2024-01-18
申请号:US18473289
申请日:2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yoshihiro DAIMON , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Takashi YAMADA , Takanori UEJIMA
CPC classification number: H05K7/026 , H05K1/181 , H05K1/144 , H05K1/0237 , H03F3/245
Abstract: A high-frequency module includes a module substrate having major surfaces, and a module substrate having major surfaces. The major surface are disposed facing the major surface. A first electronic component includes a filter coupled to a power amplifier and a low-noise amplifier. A second electronic component includes a filter coupled to a low-noise amplifier. A third electronic component includes a switch coupled between filters and an antenna connection terminal. The first electronic component is disposed between the major surfaces, on the major surface, or on the major surface. The second electronic component is disposed between the major surfaces, on the major surface, or on the major surface where the first electronic component is not disposed. The third electronic component is disposed between the major surfaces, on the major surface, or on the major surface wherein neither of the first nor second electronic component is disposed.
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公开(公告)号:US20240014841A1
公开(公告)日:2024-01-11
申请号:US18473329
申请日:2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hiromichi KITAJIMA , Takanori UEJIMA , Kiyoshi AIKAWA , Takashi YAMADA , Yoshihiro DAIMON
Abstract: A radio-frequency module includes one or more first electronic components disposed on one main surface and one or more second electronic components disposed on another main surface. The one or more first electronic components include at least one of a filter whose passband includes a first band, a switch connected to the filter, a power amplifier connected to the filter, and a switch connected to the filter. The one or more second electronic components include at least one of a filter whose passband includes a second band in which the frequency of a harmonic wave of a signal in the first band is included, a switch connected to the filter, a low-noise amplifier connected to the filter, and an inductor connected to a path that forms a connection between the first low-noise amplifier and an antenna connection terminal.
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公开(公告)号:US20230298959A1
公开(公告)日:2023-09-21
申请号:US18324314
申请日:2023-05-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hiroyuki KANI , Yoshihiro YOSHIMURA , Takahiro YAMASHITA , Ryo WAKABAYASHI , Takashi HIROSE , Kiyoshi AIKAWA
IPC: H01L23/367 , H04B1/036 , H01L23/552 , H01L23/66 , H01L23/00 , H01L23/498 , H04B1/04
CPC classification number: H01L23/367 , H04B1/036 , H01L23/552 , H01L23/66 , H01L24/09 , H01L24/16 , H01L23/49827 , H01L23/49816 , H04B1/04 , H04B2001/0408 , H01L2223/6611 , H01L2223/6661 , H01L2224/16227 , H01L2224/09515 , H01L2924/1421 , H01L2924/3025 , H01L2223/6616
Abstract: A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.
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