公开(公告)号：US10166747B2

公开(公告)日：2019-01-01

申请号：US15874021

申请日：2018-01-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keisuke Ikeno ,  Shigeru Tago ,  Hirohumi Shinagawa ,  Kuniaki Yosui ,  Yuki Ito

IPC: H05K3/46 ,  B32B37/06 ,  B32B37/10 ,  H01L23/538 ,  C09K19/38

Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.

公开(公告)号：US10741462B2

公开(公告)日：2020-08-11

申请号：US15904469

申请日：2018-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Hirofumi Shinagawa ,  Yuki Ito

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  H05K3/32 ,  H05K1/02 ,  H01L23/13 ,  H05K1/03 ,  H05K3/46

Abstract: A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.

公开(公告)号：US09854677B2

公开(公告)日：2017-12-26

申请号：US15214611

申请日：2016-07-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru Tago ,  Hirofumi Shinagawa ,  Masaki Kawata ,  Yuki Ito

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/111 ,  H05K1/118 ,  H05K3/32 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0285 ,  Y02P70/611

Abstract: A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

公开(公告)号：US20160050766A1

公开(公告)日：2016-02-18

申请号：US14926316

申请日：2015-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi Shinagawa ,  Shigeru Tago ,  Masaki Kawata ,  Yuki Ito

IPC: H05K3/32 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/32 ,  H01L2224/16225 ,  H01L2224/81 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0073 ,  H05K3/306 ,  H05K3/4611 ,  H05K3/4632 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2203/061 ,  H05K2203/063

Abstract: A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.

Abstract translation: 提供一种制造由热塑性树脂形成的树脂多层板的方法，该方法允许提高部件相对于树脂多层板的位置的精度。 一种树脂多层板的制造方法，其特征在于，具有：将表面粘合有粘合剂层的压敏粘合剂片的粘合剂层的工序; 将热塑性树脂片与所述粘合剂层相对的步骤，通过加热使与所述粘合片和所述热塑性树脂片接合的成分相互固定; 将粘合片从固定在热塑性树脂片上的部件剥离的工序; 并且堆叠并热熔接多个热塑性树脂片，所述多个热塑性树脂片包括已经转移了所述部件的热塑性树脂片。