公开(公告)号：US10153403B2

公开(公告)日：2018-12-11

申请号：US14845270

申请日：2015-09-04

Applicant: NICHIA CORPORATION

Inventor： Ryoji Naka

IPC: H01L33/48

Abstract: A package includes a resin molded body, a first lead electrode, a second lead electrode, and a recess portion. The recess portion is provided on a first side of the resin molded body and a light-emitting element is to be provided in the recess portion. The recess portion includes a bottom portion, a top portion, and a side wall. The bottom portion includes an element mount region and a wire connection region. An upper surface of the first lead electrode is exposed from the resin molded body in the element mount region and the element mount region has an outer peripheral shape in accordance with an outer peripheral shape of the light-emitting element when viewed in a height direction. The wire connection region is provided adjacent to the element mount region and is smaller than the element mount region.

公开(公告)号：US09859480B2

公开(公告)日：2018-01-02

申请号：US15241075

申请日：2016-08-19

Applicant: NICHIA CORPORATION

Inventor： Ryoji Naka ,  Atsushi Bando ,  Tomohide Miki ,  Kimihiro Miyamoto

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/08

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.