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公开(公告)号：US12211959B2
公开(公告)日：2025-01-28
申请号：US17371943
申请日：2021-07-09
Applicant: NICHIA CORPORATION
Inventor： Hirofumi Ichikawa , Masaki Hayashi , Shimpei Sasaoka , Tomohide Miki
IPC: H01L33/48 , B29C45/00 , B29C45/14 , H01L23/00 , H01L23/495 , H01L33/00 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64
Abstract: A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.
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公开(公告)号：US11094854B2
公开(公告)日：2021-08-17
申请号：US16883714
申请日：2020-05-26
Applicant: NICHIA CORPORATION
Inventor： Hirofumi Ichikawa , Masaki Hayashi , Shimpei Sasaoka , Tomohide Miki
IPC: H01L33/00 , H01L23/00 , B29C45/14 , H01L33/48 , B29C45/00 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/50 , H01L33/56
Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
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公开(公告)号：US09034671B2
公开(公告)日：2015-05-19
申请号：US14321672
申请日：2014-07-01
Applicant: NICHIA CORPORATION
Inventor： Masafumi Kuramoto , Tomohide Miki , Tomoya Tsukioka , Tomohisa Kishimoto
CPC classification number: H01L33/36 , C08G59/3245 , C08K3/013 , C08K5/005 , H01L33/32 , H01L33/56 , H01L33/60 , H01L2224/0603 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.
Abstract translation: 公开了一种发光装置，其包括由发光峰值波长不小于430nm的氮化镓系化合物半导体构成的发光元件（10） 设置有具有安装有发光元件（10）的底面的凹部和侧面的成型体（40） 以及含有包含三嗪衍生物环氧树脂的环氧树脂或含硅树脂的密封构件（50）。 成型体（40）通过使用基本上含有包含三嗪衍生物环氧树脂的环氧树脂的热固性环氧树脂组合物的固化物得到，并且在不小于430nm的波长下具有不小于70％的反射率 。
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公开(公告)号：US08987853B2
公开(公告)日：2015-03-24
申请号：US14152712
申请日：2014-01-10
Applicant: Nichia Corporation
Inventor： Shinji Nishijima , Tomohide Miki , Hiroto Tamaki
IPC: H01L31/0203 , H01L23/495 , H05K5/00 , H01L33/48 , H01L33/52 , H01L33/60
CPC classification number: H05K5/0091 , H01L33/486 , H01L33/52 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01322 , H01L2924/181 , H01L2924/18301 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.
Abstract translation: 一种发光器件包括形成由底表面和侧壁限定的凹部的基体，其上表面露出在凹部中并且其下表面形成外表面的导电构件，设置在凹部中的突出部分， 安装在所述凹部中并电连接到所述导电构件的发光元件，以及设置在所述凹部中以覆盖所述发光元件的密封构件。 基体具有由树脂一体形成的底部部分和侧壁部分，侧壁部分的内表面是限定凹部的侧壁，并且具有弯曲部分，并且突出部分靠近 曲面。 通过这种布置，可以获得光提取效率和可靠性优异的薄型和小型发光装置。
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5.发明授权公开(公告)号：US08836210B2
公开(公告)日：2014-09-16
申请号：US14025684
申请日：2013-09-12
Applicant: Nichia Corporation
Inventor： Tomohide Miki , Kenji Takine , Ryohei Yamashita
CPC classification number: H01L33/507 , H01L25/0753 , H01L33/505 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode (8), a fluorescent material (16) that absorbs at least part of light emitted by the light emitting diode (8) and converts it to light of longer wavelength, and the lens that changes the direction of light emission from the light emitting diode (8) and/or the fluorescent material (16). The resin (12 and 14) includes the fluorescent material (16) and is formed so as to constitute the lens of substantially semi-cylindrical shape, and the fluorescent material (16) included in the resin (12 and 14) is distributed with a higher concentration in a region near the surface of the light emitting diode (8) than in a region near the surface of the portion that constitutes the lens.
Abstract translation: 发光装置包括：基板（2），形成在基板（2）上的正极（6）和负极（4）;与正极（6）连接的发光二极管（8） 电极（4），覆盖发光二极管（8）的透明树脂（12和14），吸收由发光二极管（8）发射的光的至少一部分并将其转换为光的荧光材料（16） 以及改变来自发光二极管（8）和/或荧光材料（16）的发光方向的透镜。 树脂（12和14）包括荧光材料（16）并且形成为构成大致半圆柱形状的透镜，并且包含在树脂（12和14）中的荧光材料（16）分布在 在发光二极管（8）的表面附近的区域中比在构成透镜的部分的表面附近的区域更高的浓度。
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Patent Agency Ranking
公开(公告)号：US11271144B2
公开(公告)日：2022-03-08
申请号：US16222581
申请日：2018-12-17
Applicant: NICHIA CORPORATION
Inventor： Masato Fujitomo , Hiroto Tamaki , Shinji Nishijima , Yuichiro Tanda , Tomohide Miki
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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公开(公告)号：US10573789B2
公开(公告)日：2020-02-25
申请号：US16150255
申请日：2018-10-02
Applicant: NICHIA CORPORATION
Inventor： Hirofumi Ichikawa , Masaki Hayashi , Shimpei Sasaoka , Tomohide Miki
IPC: H01L33/58 , H01L33/48 , B29C45/00 , B29C45/14 , H01L33/60 , H01L23/00 , H01L33/00 , H01L33/62 , H01L33/64 , H01L33/50 , H01L33/56
Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
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公开(公告)号：US10573788B2
公开(公告)日：2020-02-25
申请号：US16007954
申请日：2018-06-13
Applicant: NICHIA CORPORATION
Inventor： Hirofumi Ichikawa , Masaki Hayashi , Shimpei Sasaoka , Tomohide Miki
IPC: H01L33/00 , H01L33/62 , B29C45/00 , H01L33/48 , B29C45/14 , H01L33/60 , H01L23/00 , H01L33/64 , H01L33/50 , H01L33/56
Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
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公开(公告)号：US10164163B2
公开(公告)日：2018-12-25
申请号：US15692542
申请日：2017-08-31
Applicant: NICHIA CORPORATION
Inventor： Masato Fujitomo , Hiroto Tamaki , Shinji Nishijima , Yuichiro Tanda , Tomohide Miki
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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公开(公告)号：US09859480B2
公开(公告)日：2018-01-02
申请号：US15241075
申请日：2016-08-19
Applicant: NICHIA CORPORATION
Inventor： Ryoji Naka , Atsushi Bando , Tomohide Miki , Kimihiro Miyamoto
CPC classification number: H01L33/56 , H01L25/0753 , H01L33/08 , H01L33/48 , H01L33/486 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/8592 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.
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