公开(公告)号：US20200096175A1

公开(公告)日：2020-03-26

申请号：US16696494

申请日：2019-11-26

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Takeshi TAMURA ,  Hiroshi FUJIMORI

IPC: F21V7/22 ,  F21V13/08 ,  F21V7/00 ,  F21V9/30 ,  G02F1/1335

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources. The diffuse reflectors comprise a resin, and particles dispersed in the resin. Each of the diffuse reflectors is positioned in an area that, in the top view, is larger than and includes the emission face of each light source. A density of the particles in said area, in the top view, is higher in a first portion located immediately above the emission face of each light source than in a second portion located around a periphery of the first portion.

公开(公告)号：US20190309913A1

公开(公告)日：2019-10-10

申请号：US16375452

申请日：2019-04-04

Applicant: NICHIA CORPORATION

Inventor： Atsushi YAMAMOTO ,  Takeshi TAMURA

IPC: F21K9/66 ,  H01L25/075 ,  H01L21/66 ,  H01L33/46 ,  F21K9/64 ,  H01L33/50 ,  F21K9/68 ,  F21K9/90 ,  F21K9/69

Abstract: A method of manufacturing a light source device includes: providing a substrate having a plurality of light sources disposed thereon; causing the plurality of light sources to emit light; measuring a first light-intensity distribution of an entire surface that is in parallel to the substrate and located above the plurality of light sources; and based on a measured value of the first light-intensity distribution, forming a light-reflecting pattern above the plurality of light sources to obtain a second light-intensity distribution that is different from the first light-intensity distribution.

公开(公告)号：US20190211996A1

公开(公告)日：2019-07-11

申请号：US16352388

申请日：2019-03-13

Applicant: NICHIA CORPORATION

Inventor： Takeshi TAMURA ,  Hiroshi FUJIMORI ,  Motokazu YAMADA

IPC: F21V13/08 ,  G02F1/1335 ,  F21V3/02 ,  F21V7/00 ,  H01L25/075 ,  F21V9/08

CPC classification number: F21V13/08 ,  F21V3/02 ,  F21V7/0083 ,  F21V9/08 ,  F21Y2115/10 ,  G02F1/133602 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133608 ,  G02F1/133611 ,  G02F2001/133607 ,  H01L25/0753 ,  H01L33/60

Abstract: A light emitting device includes a mounting board on which a plurality of light sources are disposed; a partitioning member surrounding the light sources and including a plurality of walls that include top parts and form a plurality of areas; a diffuser sheet provided above the partitioning member and supported directly or indirectly by at least one of the top parts; a plurality of first reflectors provided directly above the light sources and positioned on one of an upper surface and a lower surface of the diffuser sheet; a second reflector provided directly above the top parts and positioned on one of the upper surface and the lower surface of the diffuser sheet; and a wavelength conversion sheet positioned above the diffuser sheet. The first reflectors contain a light absorbing material that absorbs at least part of a wavelength of light from the light sources.

公开(公告)号：US20180080625A1

公开(公告)日：2018-03-22

申请号：US15705057

申请日：2017-09-14

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Takeshi TAMURA ,  Hiroshi FUJIMORI

IPC: F21V7/22 ,  F21V7/00 ,  F21V9/16 ,  F21V13/08

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources.

公开(公告)号：US20240072220A1

公开(公告)日：2024-02-29

申请号：US18454066

申请日：2023-08-23

Applicant: NICHIA CORPORATION

Inventor： Takeshi TAMURA ,  Yuichi HIRAO

IPC: H01L33/50 ,  H01L27/15

CPC classification number: H01L33/507 ,  H01L27/156 ,  H01L33/504 ,  H01L33/505

Abstract: A planar light-emitting device includes a plurality of light-emitting elements arranged at same intervals in a planar configuration, and a wavelength conversion member located above the plurality of light-emitting elements. The plurality of light-emitting elements is configured to emit blue light. The wavelength conversion member contains a phosphor that emits light when being excited by light emitted from the light-emitting elements. The plurality of light-emitting elements includes a first light-emitting element located in an outer perimeter region in a plan view, and a second light-emitting element located in a central region in the plan view. The central region is positioned inward of the outer perimeter region in the plan view. A peak wavelength of light emitted from the first light-emitting element is less than a peak wavelength of light emitted from the second light-emitting element.

公开(公告)号：US20240047631A1

公开(公告)日：2024-02-08

申请号：US18490139

申请日：2023-10-19

Applicant: NICHIA CORPORATION

Inventor： Takeshi TAMURA

IPC: H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/60 ,  G02F1/133603 ,  G02F1/133611 ,  H01L33/46 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/50 ,  H01L2933/0091 ,  G02F1/133606

Abstract: A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

公开(公告)号：US20230151945A1

公开(公告)日：2023-05-18

申请号：US18157217

申请日：2023-01-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Takeshi TAMURA ,  Hiroshi FUJIMORI

IPC: F21V7/22 ,  G02F1/13357 ,  F21V9/30 ,  F21V7/00 ,  F21V13/08

CPC classification number: F21V7/22 ,  G02F1/133606 ,  G02F1/133605 ,  G02F1/133611 ,  G02F1/133603 ,  F21V9/30 ,  F21V7/0083 ,  F21V13/08 ,  G02F1/133557

Abstract: A light emitting device includes: a mounting board; a light source positioned on the mounting board; a light diffusion plate; a diffuse reflector positioned between the mounting board and the light diffusion plate, and above at least part of an emission face of the light source; and a wavelength conversion layer positioned on or above the diffuse reflector.

公开(公告)号：US20220102606A1

公开(公告)日：2022-03-31

申请号：US17545556

申请日：2021-12-08

Applicant: NICHIA CORPORATION

Inventor： Atsushi YAMAMOTO ,  Takeshi TAMURA ,  Shinya KONDO

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L33/58

Abstract: A light-emitting device includes: a light-emitting element having an upper surface, and including a plurality of semiconductor light-emitting structures; and a substrate supporting the light-emitting element. The semiconductor light-emitting structures include a first semiconductor light-emitting structure and a second semiconductor light-emitting structure. The substrate includes: an interconnection layer including: a first interconnection portion comprising a first land, a second interconnection portion comprising a second land and a third land, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer and having an opening. The light-emitting element is located inside the opening of the first reflective member as viewed from above. A portion of the first land, a portion of the second land, a portion of the third land, and a portion of the fourth land are exposed in the opening of the first reflective member.

公开(公告)号：US20210408347A1

公开(公告)日：2021-12-30

申请号：US17304938

申请日：2021-06-28

Applicant: NICHIA CORPORATION

Inventor： Takeshi TAMURA

IPC: H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

公开(公告)号：US20200312823A1

公开(公告)日：2020-10-01

申请号：US16830503

申请日：2020-03-26

Applicant: NICHIA CORPORATION

Inventor： Atsushi YAMAMOTO ,  Takeshi TAMURA ,  Shinya KONDO

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/58 ,  H01L33/60

Abstract: A light-emitting device has a light-emitting element including first and a second semiconductor light-emitting structures, each having a first and a second electrode, and a substrate supporting the light-emitting element. The substrate has an interconnection layer having a first interconnection portion comprising a first land, a second interconnection portion comprising second and third lands, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer. A portion of the first land is coupled to the first electrode of the first semiconductor light-emitting structure. A portion of the second land and a portion of the third land are coupled to the second electrode of the first semiconductor light-emitting structure and the first electrode of the second semiconductor light-emitting structure, respectively. A portion of the fourth land is coupled to the second electrode of the second semiconductor light-emitting structure.