摘要:
Apparatus and systems that use phase-change memory devices are provided. The phase-change memory devices may include multiple phase-change memory cells and a reset pulse generation circuit configured to output multiple sequential reset pulses. Each sequential reset pulse is output to a corresponding one of multiple reset lines. Multiple write driver circuits are coupled to corresponding phase change memory cells and to a corresponding one of the reset lines of the reset pulse generation circuit.
摘要:
A phase change memory device comprises a memory cell array and a write driver circuit, and a column selection circuit. The memory cell array comprises a plurality of block units each connected between a corresponding pair of word line drivers. The write driver circuit comprises a plurality of write driver units each comprising a plurality of write drivers adapted to provide respective programming currents to a corresponding block unit among the plurality of block units. The column selection circuit is connected between the memory cell array and the write driver circuit and is adapted to select at least one of the plurality of memory blocks in response to a column selection signal to provide corresponding programming currents to the at least one of the plurality of memory blocks.
摘要:
A phase change memory device comprises a memory cell array and a write driver circuit. The memory cell array comprises a plurality of memory cells, and the write driver circuit comprises a set current driver and a reset current driver. The set current driver is adapted to provide a set current to a selected memory cell among the plurality of memory cells and the reset current driver is adapted to provide a reset current to a selected memory cell among the plurality of memory cells.
摘要:
A magnetic memory device includes a common line; a first write-in diode, a readout diode and a second write-in diode being connected to the common line in parallel. The magnetic memory device further includes a magnetic tunnel junction structure connected to the readout diode, first and second write-in conductors disposed at both sides of the magnetic tunnel junction structure and connected to the first and second write-in diodes, respectively and a first write-in line, a readout line and a second write-in line, which are connected to the first write-in conductor, the magnetic tunnel injection structure, and the second write-in conductor, respectively.
摘要:
A nonvolatile memory device includes a bit line, a pair of data lines and a plurality of scalable two transistor memory (STTM) cells. The memory cells are arranged between a pair of datalines so as to share the bit line. The memory device further includes a data line selection circuit and a sense amplification circuit. The data line selection circuit selects one of a pair of data lines, and the sense amplification circuit senses and amplifies a voltage difference between the bit line and the selected data line. Operation speed is increased, while improving device cell array structure.
摘要:
Disclosed is a semiconductor memory device including a memory cell array having a plurality of variable resistance memory cells divided into first and second areas. An I/O circuit is configured to access the memory cell array under the control of control logic so as to access the first or second area in response to an external command. The I/O circuit accesses the first area using a memory cell unit and the second area using a page unit.
摘要翻译:公开了一种半导体存储器件,包括具有分成第一和第二区域的多个可变电阻存储器单元的存储单元阵列。 I / O电路被配置为在控制逻辑的控制下访问存储单元阵列,以响应于外部命令访问第一或第二区域。 I / O电路使用存储单元单元访问第一区域,并且使用页面单元访问第二区域。
摘要:
A method of writing data in a phase change memory includes receiving write data to be written to a selected phase change memory cell in the plurality of phase change memory cells, sensing data stored in the selected phase change memory cell, determining whether or not the sensed data is equal to the write data, and if the sensed data is not equal to the write data, iteratively applying a write current to the selected phase change memory cell, wherein a resistance state of the phase change memory cell is changed by heat corresponding to a level of the write current, and the level of the write current is changed between successive iterative applications.
摘要:
Phase change memory devices may include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate. The word lines may have a second conductivity type different from the first conductivity type and substantially flat top surfaces. First and second semiconductor patterns may be sequentially stacked on each word line, and an insulating layer may be provided to fill gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns. A plurality of phase change material patterns may be two-dimensionally arrayed on the insulating layer and electrically connected to the second semiconductor patterns.
摘要:
A phase change memory device may include a memory cell array, a write driver, and/or a control unit. The memory cell array may include a plurality of memory cells. The write driver may be configured to provide a program current to the memory cell array for setting a state of a phase change material to program a selected memory cell. The write driver may be configured to provide the program current such that the program current has a plurality of steps. The control unit may be configured to receive step information for adjusting a magnitude and a width of each step of the program current during a test operation and provide the step information to the write driver during a normal operation.
摘要:
A phase-change random access memory includes a memory block including a plurality of memory columns corresponding to the same column address and using different input/output paths; a redundancy memory block including a plurality of redundancy memory columns using different input/output paths; and an input/output controller repairing at least one of the plurality of memory columns using at least one of the plurality of redundancy memory columns, and controlling the number of memory columns simultaneously repaired using redundancy memory columns in response to an input/output repair mode control signal.