摘要:
A Group III nitride semiconductor crystal is grown according to a flux method. After completion of the crystal-growing process, Na is discharged from a crucible by a recovery device when the temperature of the crucible is 100° C. or higher, and is held in a holding vessel in a liquid state. The recovered Na can be drawn from the holding vessel via a faucet. Na remaining after completion of the crystal-growing process does not contain impurities of high vapor pressure, and is thus of high purity. Therefore, reuse, as flux, of the recovered Na enables manufacture of a Group III nitride semiconductor whose concentration of impurities is low.
摘要:
The invention provides a group III nitride semiconductor manufacturing system which is free from interruption to rotation of a rotational shaft. The group III nitride semiconductor manufacturing system has a reacting vessel having an opening, a crucible disposed in an interior of the reaction vessel and containing a melt including at least a group III metal and an alkali metal, a holding unit supporting the crucible and having a rotational shaft extending from the interior of the reaction vessel to an exterior of the reaction vessel through the opening, a rotational shaft cover covering a part of the rotational shaft positioned at the exterior of the reacting vessel and connected to the reacting vessel at the opening, a rotational driving unit disposed at an outside of the reacting vessel and regulating the rotational shaft and a supply pipe connected to the rotational shaft cover and supplying a gas including at least nitrogen into a gap between the rotational shaft and the rotational shaft cover, wherein the gas and the melt react to grow a group III nitride semiconductor crystal.
摘要:
The invention provides a group III nitride semiconductor manufacturing system which is free from interruption to rotation of a rotational shaft. The group III nitride semiconductor manufacturing system has a reacting vessel having an opening, a crucible disposed in an interior of the reaction vessel and containing a melt including at least a group III metal and an alkali metal, a holding unit supporting the crucible and having a rotational shaft extending from the interior of the reaction vessel to an exterior of the reaction vessel through the opening, a rotational shaft cover covering a part of the rotational shaft positioned at the exterior of the reacting vessel and connected to the reacting vessel at the opening, a rotational driving unit disposed at an outside of the reacting vessel and regulating the rotational shaft and a supply pipe connected to the rotational shaft cover and supplying a gas including at least nitrogen into a gap between the rotational shaft and the rotational shaft cover, wherein the gas and the melt react to grow a group III nitride semiconductor crystal.
摘要:
An apparatus for manufacturing a Group III nitride semiconductor is composed of a pressure vessel, a reaction vessel disposed within the pressure vessel, a heating device disposed within the pressure vessel so as to heat the reaction vessel, and a glove box filled with argon gas. The pressure vessel and the glove box are connected to each other via a gate valve. By virtue of this configuration, a large-sized reusable reaction vessel can be disposed within the pressure vessel without causing oxidation of Na.
摘要:
A field-effect transistor which comprises a buffer layer and a barrier layer each of which is made of a Group III nitride compound semiconductor and has a channel at the interface inside of the buffer layer to the barrier layer, wherein the barrier layer has multiple-layer structure comprising an abruct interface providing layer which composes the lowest semiconductor layer in said barrier layer and whose composition varies rapidly at the interface of said buffer layer, and an electrode connection plane providing layer which constructs the uppermost semiconductor layer and whose upper surface is formed flat.
摘要:
A method of forming a low temperature-grown buffer layer having the steps of: placing a Ga2O3 substrate in a MOCVD apparatus; providing a H2 atmosphere in the MOCVD apparatus and setting a buffer layer growth condition having an atmosphere temperature of 350° C. to 550° C.; and supplying a source gas having two or more of TMG, TMA and NH3 onto the Ga2O3 substrate in the buffer layer growth condition to form the low temperature-grown buffer layer on the Ga2O3 substrate.
摘要翻译:一种形成低温生长缓冲层的方法,具有以下步骤:将Ga 2 O 3衬底放置在MOCVD装置中; 在MOCVD装置中提供H 2气氛,并设定气氛温度为350℃至550℃的缓冲层生长条件。 并在缓冲层生长条件下将具有TMG,TMA和NH3两种以上的源气体供给到Ga 2 O 3衬底上,以在Ga 2 O 3衬底上形成低温生长缓冲层。
摘要:
A method of forming a low temperature-grown buffer layer having the steps of: placing a Ga2O3 substrate in a MOCVD apparatus; providing a H2 atmosphere in the MOCVD apparatus and setting a buffer layer growth condition having an atmosphere temperature of 350° C. to 550° C.; and supplying a source gas having two or more of TMG, TMA and NH3 onto the Ga2O3 substrate in the buffer layer growth condition to form the low temperature-grown buffer layer on the Ga2O3 substrate.
摘要翻译:一种形成低温生长缓冲层的方法,其具有以下步骤:将Ga 2 N 3 O 3衬底放置在MOCVD装置中; 在MOCVD装置中提供H 2 O 2气氛,并设定气氛温度为350℃至550℃的缓冲层生长条件。 并在缓冲层生长条件下将具有TMG,TMA和NH 3的两种或多种的源气体供应到Ga 2 O 3 N 3衬底上 以在Ga 2 N 3 O 3衬底上形成低温生长的缓冲层。
摘要:
A field-effect transistor which comprises a buffer layer and a barrier layer each of which is made of a Group III nitride compound semiconductor and has a channel at the interface inside of the buffer layer to the barrier layer, wherein the barrier layer has multiple-layer structure comprising an abruct interface providing layer which composes the lowest semiconductor layer in said barrier layer and whose composition varies rapidly at the interface of said buffer layer, and an electrode connection plane providing layer which constructs the uppermost semiconductor layer and whose upper surface is formed flat.
摘要:
Provided is a projection-type image display device which by means of a projection lens (2) magnifies and projects an optical image formed by a light source and an image display element, wherein an error indicator (5) for indicating anomalies in the device is disposed on the rear surface opposite the front surface of a device housing (1) to which the projection lens (2) is attached. The projection-type image display device further includes an AC voltage monitor unit (12) for monitoring voltage waveforms supplied form an external power source and retaining voltage waveform data during the latest prescribed period in a memory, and reads out the voltage waveform data from the external power source retained in the memory and displays the voltage waveform data on the error indicator (5) as said anomalies.
摘要:
A projection display system comprising a projection display unit including a light source, an image display element, a lighting optical system irradiating a beam of light on the image display element, and a projection optical system projecting an image light from the image display element toward a screen. The projection optical system including a lens group composed of a plurality of lens elements arranged in order toward the screen from the image display element and symmetrically with respect to an optical axis, and a reflecting mirror shaped to be axial-asymmetrical with respect to the optical axis. The projection display system further comprises a screen 5. The projection display unit projects the image light onto a projection plane of the screen to display an image.