-
11.发明授权公开(公告)号：US10240350B2
公开(公告)日：2019-03-26
申请号：US15101603
申请日：2014-12-02
Inventor： Tadanari Anpo , Shiro Hara
IPC: E04F15/024 , H01L21/677 , B62B3/06
Abstract: A free access floor structure to install a manufacturing apparatus such as a semiconductor manufacturing apparatus, in a short time, and a manufacturing apparatus and a carrier apparatus adapted for the floor structure. An embodiment of the manufacturing apparatus includes an apparatus-side connector which is provided, facing downward, to a bottom plate of a manufacturing apparatus. A floor structure of an embodiment includes a floor plate to be worked into a floor surface. The floor structure includes a floor-side connector which is provided, facing upward, to the floor plate so as to be connected with the apparatus-side connector according to a lowering operation of the manufacturing apparatus. An installation step (mounting step, piping/wiring step) of the manufacturing apparatus may thereby be performed in one step. As a result, the labor and the time required to install the manufacturing apparatus may be saved.
-
公开(公告)号：US10163674B2
公开(公告)日：2018-12-25
申请号：US15529070
申请日：2015-11-24
Inventor： Shiro Hara , Sommawan Khumpuang , Fumito Imura , Michihiro Inoue , Arami Saruwatari
IPC: H01L23/544 , H01L21/683 , H01L21/02 , H01L21/56 , H01L23/31 , H01L23/00
Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.
-
公开(公告)号：US09777375B2
公开(公告)日：2017-10-03
申请号：US14362348
申请日：2012-11-30
Inventor： Shinichi Ikeda , Shiro Hara , Takanori Mikahara , Hitoshi Habuka , Sommawan Khumpuang
CPC classification number: C23C16/482 , C30B13/24 , F27B17/0025 , F27D2099/0026 , H01L21/67115 , Y10T117/108
Abstract: Provide a converging mirror-based furnace for heating a target by way of reflecting from a reflecting mirror unit the light emitted from a light source and then irradiating a target with the reflected light, wherein said target-heating converging-light furnace is such that: the reflecting mirror unit comprises a primary reflecting mirror and secondary reflecting mirror; the light emitted from the light source is reflected sequentially by the primary reflecting mirror and secondary reflecting mirror and then irradiated onto the target; and the light reflected by the secondary reflecting mirror and irradiated onto the target surface is not perpendicular to the target surface. Based on the above, a system that uses converged infrared light to provide heating can be made smaller while keeping its heating performance intact, even when the system uses a revolving ellipsoid.
-
公开(公告)号：US09017146B2
公开(公告)日：2015-04-28
申请号：US14096226
申请日：2013-12-04
Applicant: Fujikoshi Machinery Corp. , National Institute of Advanced Industrial Science and Technology
Inventor： Yoshio Nakamura , Yoshio Otsuka , Takashi Okubo , Kazutaka Shibuya , Takayuki Fuse , Shiro Hara , Sommawan Khumpuang , Shinichi Ikeda
CPC classification number: B24B7/228 , B24B37/105 , B24B37/16 , B24B37/26 , B24B37/30 , B24B37/345 , B24B53/017
Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.
Abstract translation: 晶片抛光装置包括抛光板，能够保持晶片的抛光头和浆料供应部分。 抛光板包括：多个同心抛光区，每个同心抛光区具有用于抛光晶片的规定宽度，并且其中每个抛光区附着有抛光布; 以及用于在抛光区之间形成的用于排出浆料的槽。 清洗抛光头的清洁部分或清洁抛光晶片的晶片清洁部分设置在抛光板的中心部分并位于最内侧抛光区的内侧。
-
公开(公告)号：US20140306124A1
公开(公告)日：2014-10-16
申请号：US14363376
申请日：2012-10-03
Inventor： Shiro Hara
CPC classification number: G03F7/7075 , G21F7/00 , H01L21/6719 , H01L21/67751 , H01L21/67772 , H01L21/67775
Abstract: Arranging an application apparatus, an exposure apparatus, a developing apparatus, and similar apparatus together within a large yellow room makes it difficult to change a layout in association with a change of a recipe and to streamline a layout area and similar parameter. A yellow room system includes: a plurality of portable unit process apparatuses 50 that each have the same standardized outer shape and include a yellow room configured to shield a exposure light to a photosensitive material formed on a workpiece; conveyance containers 11 and 25 that convey the workpiece between the unit process apparatuses and itself is formed as the yellow room; and a light-shielding coupling structure that couples the unit process apparatus, which is formed on a docking port 56 disposed in the upper portion of a front chamber 80 of the unit process apparatus 50, and the conveyance containers together.
Abstract translation: 在大的黄色房间内将应用设备，曝光设备，显影设备和类似设备一起布置使得难以改变与配方改变相关联的布局并且简化布局区域和类似的参数。 黄色房间系统包括：多个便携式单元处理设备50，每个便携式单元处理设备50具有相同的标准化外部形状，并且包括被配置为将曝光光屏蔽到形成在工件上的感光材料的黄色房间; 在单元处理装置和本身之间传送工件的输送容器11和25形成为黄色房间; 以及将形成在设置在单元处理装置50的前室80的上部的对接端口56上的单元处理装置与输送容器连接在一起的遮光联接结构。
-
Patent Agency Ranking
公开(公告)号：US10137570B2
公开(公告)日：2018-11-27
申请号：US14647366
申请日：2013-11-26
Inventor： Kenji Hirota , Shinichi Imai , Shiro Hara , Hitoshi Maekawa
IPC: B25J9/10 , B25J18/04 , H01L21/677 , B25J18/02
Abstract: The present invention provides a transfer robot which has a simple structure and a small occupied area in an operation.A transfer robot of the present invention includes a support member fixed to a side wall or the like, a transfer arm by which a hand member is held capable of linear movement, and first and second link members. One end portions of the first and second link members are rotatably linked to the support member, respectively. Another end portions of the first and second link members are rotatably linked to the transfer arm, respectively. The hand member holds/transfers a work. A rotational driving force applied to a linking portion between the support member and the first link member is transmitted to the transfer arm by a predetermined mechanism and linearly moves the hand member. The transfer arm moves by rotating the first link member or the second link member.
-
公开(公告)号：US10115619B2
公开(公告)日：2018-10-30
申请号：US14625508
申请日：2015-02-18
Inventor： Shiro Hara , Hitoshi Maekawa
IPC: H01L21/677 , B65D51/28 , A47B47/00 , A47B81/00 , H01L21/673
Abstract: A transfer box has a sealing structure hermetically sealable by means of tight coupling of a transfer box body and a transfer box door. The transfer box is structured in such a way that magnets on the transfer box body face magnetic bodies on the transfer box door when the transfer box door is closed on the transfer box body, with these magnets and magnetic bodies forming a magnetic closed circuit.
-
公开(公告)号：US20170157735A1
公开(公告)日：2017-06-08
申请号：US15370670
申请日：2016-12-06
Applicant: Fujikoshi Machinery Corp. , National Institute of Advanced Industrial Science and Technology
Inventor： Masayuki TSUKADA , Kazutaka SHIBUYA , Takayuki FUSE , Yoshio NAKAMURA , Shiro Hara
IPC: B24B37/34 , H01L21/306 , B24B37/20 , H01L21/67
Abstract: The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.
-
19.发明申请FREE ACCESS FLOOR STRUCTURE, AND MANUFACTURING APPARATUS AND CARRIER APPARATUS ADAPTED FOR FLOOR STRUCTURE 审中-公开免费访问地板结构，适用于地板结构的制造设备和承载装置公开(公告)号：US20160318535A1
公开(公告)日：2016-11-03
申请号：US15101603
申请日：2014-12-02
Inventor： Tadanari Anpo , Shiro Hara
IPC: B62B3/06 , H01L21/677 , E04F15/024
CPC classification number: E04F15/02405 , B62B3/0625 , B62B3/0643 , B62B5/0433 , B62B5/049 , B62B2205/06 , E04F2290/02 , H01L21/67724 , H01L21/67775
Abstract: A free access floor structure to install a manufacturing apparatus such as a semiconductor manufacturing apparatus, in a short time, and a manufacturing apparatus and a carrier apparatus adapted for the floor structure An embodiment of the manufacturing apparatus includes an apparatus-side connector which is provided, facing downward, to a bottom plate of a manufacturing apparatus. A floor structure of an embodiment includes a floor plate to be worked into a floor surface. The floor structure includes a floor-side connector which is provided, facing upward, to the floor plate so as to be connected with the apparatus-side connector according to a lowering operation of the manufacturing apparatus. An installation step (mounting step, piping/wiring step) of the manufacturing apparatus may thereby be performed in one step. As a result, the labor and the time required to install the manufacturing apparatus may be saved.
Abstract translation: 一种用于在短时间内安装诸如半导体制造装置的制造装置的自由通道地板结构以及适用于地板结构的制造装置和载体装置。制造装置的实施例包括设置侧连接器，该装置侧连接器 面向下，到制造装置的底板。 实施例的地板结构包括要被加工成地板表面的地板。 地板结构包括：底板侧连接器，其被设置成朝向地板上方，以便根据制造装置的降低操作与设备侧连接器连接。 因此，可以在一个步骤中进行制造装置的安装步骤（安装步骤，配管/布线步骤）。 结果，可以节省安装制造装置所需的人力和时间。
-
公开(公告)号：US09123795B2
公开(公告)日：2015-09-01
申请号：US14087883
申请日：2013-11-22
Applicant: Fujikoshi Machinery Corp. , NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
Inventor： Yoshio Nakamura , Daizo Ichikawa , Haruo Sumizawa , Shiro Hara , Sommawan Khumpuang , Shinichi Ikeda
CPC classification number: H01L21/78 , H01L21/02005 , H01L21/02008
Abstract: A method of manufacturing semiconductor wafers which facilitates formation of orientation flat lines and allows beveling work without problems. The method of manufacturing semiconductor wafers includes steps wherein a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer, by a laser beam, after the marking step, in such a way that the orientation flat lines are located at required positions in the small-diameter wafers to be obtained.
Abstract translation: 一种制造半导体晶片的方法，其有利于形成取向扁平线，并且可以毫无问题地进行斜切加工。 制造半导体晶片的方法包括从大直径半导体晶片切出多个小直径晶片的步骤，该方法包括：标记步骤，通过激光束形成直槽状定向扁平线，以便 跨越大直径半导体晶片中的每行中的各个小直径晶片，其中小直径晶片的切割位置对于每个行共同沿特定方向排成一行; 以及切割步骤，在所述标记步骤之后，通过激光束与所述大直径半导体晶片分开地切割所述小直径晶片，使得所述取向扁平线位于所述小直径的所需位置 要获得的晶圆。
-
-
-
-
-
-
-
-
-
Search Results
28
records
(took 0.034 seconds)
