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134 条记录 (耗时 0.032 秒)

    TECHNOLOGY REPLACEMENT COST ESTIMATION USING ENVIRONMENTAL COST CONSIDERATIONS
    11.
    发明申请
    TECHNOLOGY REPLACEMENT COST ESTIMATION USING ENVIRONMENTAL COST CONSIDERATIONS 有权
    技术替代使用环境成本考虑的成本估算

    公开(公告)号：US20110035243A1

    公开(公告)日：2011-02-10

    申请号：US12538454

    申请日：2009-08-10

    申请人： Amip J. Shah ,  Chandrakant Patel ,  Cullen E. Bash

    发明人： Amip J. Shah ,  Chandrakant Patel ,  Cullen E. Bash

    IPC分类号： G06Q10/00

    CPC分类号： G06Q10/00 ,  G06Q10/063 ,  G06Q30/0283

    摘要： In a method of estimating a replacement cost associated with an existing technology performed by a processor, one or more costs associated with implementing the existing technology are obtained, in which the one or more costs include an environmental cost and a utility cost associated with implementing the existing technology. In addition, an existing net benefit of continuing implementation of the existing technology based upon the obtained one or more costs are calculated.

    摘要翻译： 在估计与由处理器执行的现有技术相关联的重置成本的方法中，获得与实现现有技术相关联的一个或多个成本，其中一个或多个成本包括环境成本和实施 现有技术。 此外，计算了基于获得的一个或多个成本继续实施现有技术的现有净收益。

    Temperature control using a sensor network
    12.
    发明申请
    Temperature control using a sensor network 有权
    使用传感器网络进行温度控制

    公开(公告)号：US20060214014A1

    公开(公告)日：2006-09-28

    申请号：US11089608

    申请日：2005-03-25

    申请人： Cullen Bash ,  Chandrakant Patel ,  Ratnesh Sharma

    发明人： Cullen Bash ,  Chandrakant Patel ,  Ratnesh Sharma

    IPC分类号： F25B9/00 ,  F24F7/00 ,  G05D23/00

    CPC分类号： H05K7/20745 ,  F24F11/30 ,  F24F11/63 ,  F24F2110/10 ,  G05D23/1931 ,  H05K7/20836

    摘要： In a method for controlling temperature using a sensor network, the sensors of the sensor network are commissioned and one of a plurality of control schemes for operating a primary actuator configured to vary temperatures of the sensors based upon energy utilization requirements of the plurality of control schemes is selected. In addition, the selected one of the plurality of control schemes is implemented to vary the temperatures detected by the sensors.

    摘要翻译： 在使用传感器网络控制温度的方法中，传感器网络的传感器被调试，并且用于操作主致动器的多个控制方案中的一个被配置为基于多个控制方案的能量利用要求来改变传感器的温度 被选中。 此外，实现多个控制方案中的所选择的一个以改变由传感器检测到的温度。

    Two-fluid spray cooling system
    13.
    发明申请
    Two-fluid spray cooling system 有权
    双流体喷雾冷却系统

    公开(公告)号：US20060162363A1

    公开(公告)日：2006-07-27

    申请号：US11040403

    申请日：2005-01-21

    申请人： Ratnesh Sharma ,  Cullen Bash ,  Chandrakant Patel

    发明人： Ratnesh Sharma ,  Cullen Bash ,  Chandrakant Patel

    IPC分类号： F28D3/00 ,  F25D23/12 ,  F28D5/00

    CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A cooling system including a housing forming a cooling chamber containing the component submerged in a pool of alcohol, oil or glycerine, a sprayer configured to spray water at the component through the oil or glycerine, and a heat exchanger configured to cool the oil or glycerine. A control system receives heat-generation information from temperature sensors on water-impingement regions of the component, and controls the spraying in response to this information. A pump pumps the oil or glycerine from a lower portion of the cooling chamber to the heat exchanger. A sprayer inlet draws water from an upper portion of the cooling chamber, or from a lower portion of a reservoir connected to the heat exchanger. Oil or glycerine is passed from a portion of the heat exchanger reservoir back to the cooling chamber, and water passes from an upper portion of the reservoir to the sprayer. Alternatively, the oil or glycerine could be replaced with helium.

    摘要翻译： 一种冷却系统，包括形成包含浸没在醇，油或甘油池中的组分的冷却室的壳体，被配置为通过油或甘油喷射组分的水的喷雾器和被配置为冷却油或甘油的热交换器 。 控制系统从部件的水冲击区域的温度传感器接收发热信息，并根据该信息控制喷射。 泵将油或甘油从冷却室的下部泵送到热交换器。 喷雾器入口从冷却室的上部或从连接到热交换器的储存器的下部抽出水。 油或甘油从热交换器储存器的一部分返回到冷却室，并且水从贮存器的上部通过喷雾器。 或者，油或甘油可以用氦代替。

    Data connectivity with a robotic device
    16.
    发明申请
    Data connectivity with a robotic device 有权
    与机器人设备的数据连接

    公开(公告)号：US20050113978A1

    公开(公告)日：2005-05-26

    申请号：US10721264

    申请日：2003-11-26

    申请人： Ratnesh Sharma ,  Cullen Bash ,  Chandrakant Patel ,  Gopalakrishnan Janakiraman

    发明人： Ratnesh Sharma ,  Cullen Bash ,  Chandrakant Patel ,  Gopalakrishnan Janakiraman

    IPC分类号： G05D1/02 ,  G05D23/19 ,  G06F19/00

    CPC分类号： G05D1/0282 ,  G05D1/0225 ,  G05D1/0234 ,  G05D1/0246 ,  G05D1/0255 ,  G05D23/1932 ,  G05D2201/0207

    摘要： A method for data connectivity in a room with a robotic device. In the method, at least one condition is detected with a plurality of sensors and the detected at least one condition is communicated from the sensors to associated access points. One or more of the access points are selected and the robotic device is maneuvered to a location in a vicinity of one or more of the selected access points. The detected at least one condition is communicated from one or more of the selected access points to the robotic device. In addition, the robotic device is maneuvered to a location in a vicinity of a base station and the detected at least one condition is communicated from the robotic device to the base station.

    摘要翻译： 一种具有机器人装置的房间中数据连接的方法。 在该方法中，用多个传感器检测至少一个条件，并且将检测到的至少一个条件从传感器传送到相关联的接入点。 选择一个或多个接入点，并且将机器人设备操纵到所选择的接入点中的一个或多个附近的位置。 所检测到的至少一个条件从所选择的接入点中的一个或多个传送到机器人设备。 此外，机器人设备被操纵到基站附近的位置，并且将检测到的至少一个条件从机器人设备传送到基站。

    Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
    18.
    发明授权
    Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate 失效
    具有用于衬底上的多个集成电路的导热板的散热器组件

    公开(公告)号：US5396403A

    公开(公告)日：1995-03-07

    申请号：US88288

    申请日：1993-07-06

    申请人： Chandrakant Patel

    发明人： Chandrakant Patel

    IPC分类号： H01L23/34 ,  H01L23/433 ,  H05K7/20

    CPC分类号： H01L23/433 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/16152 ,  H01L2924/3011

    摘要： A heat sink assembly for a multichip module. A thermally conductive plate is bonded to integrated circuit chips on a multichip module by indium solder. The plate in turn is thermally coupled to a heat sink such as finned aluminum by thermal paste. The plate is made of a material such as silicon carbide or copper-tungsten alloy having a relatively low coefficient of expansion to minimize mechanical stress resulting from lateral motion of the chips due to thermal expansion. Relatively low-power chips may be thermally coupled to the plate by thermal paste instead of being bonded by solder.

    摘要翻译： 用于多芯片模块的散热器组件。 导热板通过铟焊料与多芯片组件上的集成电路芯片接合。 该板依次通过热粘贴热耦合到诸如翅片铝的散热器。 该板由诸如碳化硅或铜 - 钨合金的材料制成，具有相对较低的膨胀系数，以最小化由于热膨胀而导致芯片的横向运动引起的机械应力。 相对低功率的芯片可以通过热焊膏热耦合到板上，而不是通过焊料粘合。