公开(公告)号：US09609191B2

公开(公告)日：2017-03-28

申请号：US14289820

申请日：2014-05-29

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida

IPC: H04N5/225 ,  H01L27/146 ,  G02B7/02

CPC classification number: H04N5/2254 ,  G02B7/021 ,  G02B7/023 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00

Abstract: An image pickup unit according to the embodiment includes an image pickup device chip having a rectangular shape in plan view, a transparent substrate which is equal in plan view dimensions to the image pickup device chip and is joined to the image pickup device chip, and a lens unit joined to the transparent substrate with the center of a light receiving portion of the image pickup chip aligned with the optical axis, in which, two locking portions are formed in the transparent substrate and two locked portions of the lens unit which is equal to or smaller than the image pickup device chip in plan view dimensions are fitted into or abut on the corresponding locking portions respectively.

公开(公告)号：US09537023B2

公开(公告)日：2017-01-03

申请号：US13734086

申请日：2013-01-04

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida

IPC: H01L31/0232 ,  H01L31/18 ,  H04N5/33 ,  H01L23/31 ,  H01L27/146 ,  H04N5/225

CPC classification number: H01L31/02327 ,  H01L23/3114 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L31/18 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/33 ,  H01L2924/00

Abstract: An image pickup apparatus includes: an image pickup device disposed in a first principal surface of a silicon substrate, the image pickup device sensing infrared light; an electrode pad disposed on the first principal surface; a front-face wiring connecting the image pickup device and the electrode pad; an external connection terminal disposed on a second principal surface of the silicon substrate; a back-face wiring connecting the electrode pad and the external connection terminal via a substrate through-hole extending from the second principal surface side through the silicon substrate to a back face of the electrode pad; and a light blocking layer disposed on the second principal surface, the light blocking layer covering a trench portion surrounding the image pickup device and a region surrounded by the trench portion.

Abstract translation: 一种图像拾取装置包括：设置在硅衬底的第一主表面中的图像拾取装置，所述图像拾取装置感测红外光; 设置在所述第一主表面上的电极焊盘; 连接图像拾取装置和电极垫的正面布线; 设置在所述硅衬底的第二主表面上的外部连接端子; 经由从所述第二主面侧穿过所述硅衬底延伸到所述电极焊盘的背面的衬底通孔而将所述电极焊盘和所述外部连接端子连接的背面布线; 以及设置在所述第二主表面上的遮光层，所述遮光层覆盖围绕所述图像拾取装置的沟槽部分和由所述沟槽部分包围的区域。

公开(公告)号：US20160126286A1

公开(公告)日：2016-05-05

申请号：US14994581

申请日：2016-01-13

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Kazuhiro Yoshida

IPC: H01L27/146

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

公开(公告)号：US09282261B2

公开(公告)日：2016-03-08

申请号：US14557271

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Kazuhiro Yoshida

IPC: H01L21/00 ,  H04N5/335 ,  H01L25/04 ,  H01L27/146 ,  H04N5/225 ,  H01L23/31

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，其特征在于，包括以下步骤：切割摄像芯片基板，在每个所述光接收部分周围形成电极焊盘，制作摄像芯片; 将作为无缺陷产品确定的图像拾取芯片接合到玻璃晶片以制造接合晶片的工艺; 在接合晶片上的图像拾取芯片之间填充密封构件的过程; 一种加工工艺，其包括使连接的晶片的厚度变薄以使加工表面变平且形成通孔互连，每个连接到每个电极焊盘; 形成多个外部连接电极的过程，每个外部连接电极通过每个通孔互连连接到每个电极焊盘; 以及切割接合的晶片的过程。

公开(公告)号：US10123816B2

公开(公告)日：2018-11-13

申请号：US15082519

申请日：2016-03-28

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu Sakamoto ,  Chie Onuma ,  Kiichiro Sawada ,  Ken Fujisaki ,  Kazuhiro Yoshida ,  Satoshi Takekoshi ,  Sohei Ueda ,  Yasuo Tanigami

IPC: A61B17/32 ,  A61B17/06

Abstract: In an arthroendoscopical surgical method, a resection target area, and a freshening treatment area which becomes repair surfaces with bleeding, are identified, and a resection line and a freshening line are drawn on a tear site in a meniscus, which is emphasized by fluorescence with use of a fluorescent medicine under excitation light. Using an ultrasonic treatment tool and an arthroscope, the resection target area is resected by a probe which generates ultrasonic vibrations, based on the resection line and freshening line under visible-light illumination. Thus, an inclined resection surface is formed, and planar repair surfaces with bleeding are joined and repaired.

公开(公告)号：US09698195B2

公开(公告)日：2017-07-04

申请号：US14994581

申请日：2016-01-13

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Kazuhiro Yoshida

IPC: H01L27/146 ,  H01L25/04 ,  H04N5/225 ,  H04N5/335 ,  H01L23/31

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

公开(公告)号：US20140078280A1

公开(公告)日：2014-03-20

申请号：US14088800

申请日：2013-11-25

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida

IPC: H04N5/369

CPC classification number: H04N5/369 ,  A61B1/00163 ,  A61B1/051

Abstract: An image pickup apparatus includes: a solid-state image pickup device partitioned into a light-receiving portion region that generates an image pickup signal of an optical image, a circuit portion region that processes the image pickup signal and generates a driving signal, and a terminal portion region having terminals for inputting/outputting signals with an external apparatus; and an objective optical portion having an objective lens unit including a unit main body having an objective lens group for forming an optical image and a holding barrel where the unit main body is fixed, and a prism that guides the optical image that passes through the objective lens unit to the light-receiving portion region. The prism of the objective optical portion is disposed on the light-receiving portion region of the substrate, and the holding barrel of the objective lens unit is disposed on the circuit portion region.

Abstract translation: 一种图像拾取装置包括：分割成产生光学图像的摄像信号的光接收部分区域的固态图像拾取装置，处理图像拾取信号并产生驱动信号的电路部分区域，以及 端子部区域，具有用外部装置输入/输出信号的端子; 以及具有物镜单元的对象光学部件，该物镜单元包括具有用于形成光学图像的物镜组的单元主体和固定有单元主体的保持筒，以及引导通过该物镜的光学图像的棱镜 透镜单元到光接收部分区域。 物镜光学部分的棱镜设置在基板的光接收部分区域上，并且物镜单元的保持镜筒设置在电路部分区域上。

公开(公告)号：US10098654B2

公开(公告)日：2018-10-16

申请号：US15082625

申请日：2016-03-28

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu Sakamoto ,  Chie Onuma ,  Ken Fujisaki ,  Kiichiro Sawada ,  Kazuhiro Yoshida ,  Satoshi Takekoshi ,  Sohei Ueda ,  Yasuo Tanigami

IPC: A61B17/16 ,  A61B17/32 ,  A61B1/00 ,  A61B1/317 ,  A61B1/04 ,  A61B1/06

Abstract: An arthroscopical surgical method using an ultrasonic treatment device for a joint includes: transmitting ultrasonic vibration to a treatment portion of the ultrasonic treatment device, removing an injured region of an articular cartilage so that a subchondral bone is exposed, and forming a cartilage edge which is nearly angled at 90° with the exposed surface of the subchondral bone to form a pool-shaped depression; forming a hole which pierces up to a cancellous bone of the subchondral bone through the depression, and scratching blood vessels in the cancellous bone; causing bleeding from the blood vessels so that blood is retained in the depression via the hole.

公开(公告)号：US09123618B2

公开(公告)日：2015-09-01

申请号：US14557021

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida ,  Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: H01L21/66 ,  H01L27/146 ,  H01L25/04 ,  H01L21/56 ,  H01L21/768 ,  H01L21/78

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 将多个图像拾取芯片之间的间隙填充到密封构件的处理; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。