Abstract:
An image sensor includes: a light reception unit; first transfer lines; a constant current source; second transfer lines; a reading unit; a control unit; a dielectric interposed between the first and second transfer lines formed in pairs; a first chip including at least the light reception unit, the plurality of first transfer lines, and the constant current source, each being mounted on the first chip; and a second chip including at least the second transfer lines mounted on the second chip. The first chip is configured such that the second chip is stacked on a back surface of a light receiving surface of the light reception unit, and each of the second transfer lines is arranged at a position facing one of the first transfer lines with the dielectric interposed between the first and second transfer lines.
Abstract:
An image sensor includes: unit pixels; first transfer lines; a constant current source; a reset noise removal unit; a second transfer line; and a control unit configured to drive output units of the unit pixels respectively positioned in different rows at a same time in at least a part of a period, to drive a charge transfer unit of the unit pixel positioned in one row and perform a reset noise removal operation, then to transfer the signal to the second transfer line while keeping an output unit of the unit pixel driven, and to drive a charge transfer unit of the unit pixel positioned in another row and perform the reset noise removal operation, in an operation period in which an output unit of the unit pixel positioned in the one row transfers the signal to the second transfer line.
Abstract:
An image sensor includes: a reference signal generation unit configured to generate and output a reference signal in accordance with a predetermined voltage; a plurality of pixels disposed in a two-dimensional matrix form and configured to receive light from outside, and to generate and output an imaging signal in accordance with an amount of the received light; a transfer unit configured to transfer the reference signal output from the reference signal generation unit and the imaging signal output from each of the plurality of pixels, during different periods; and an output unit configured to separately hold the reference signal and the imaging signal transferred from the transfer unit, sequentially switch between the reference signal and the imaging signal to output the switched signal.
Abstract:
An imaging system includes: an optical system configured to form a subject image; a driver configured to drive the optical system; an imaging element configured to capture the subject image and generate image data; and a processor configured to control the imaging element and the driver. The imaging element includes: a first imaging portion configured to capture an image of a first light beam that travels through a first optical path in the optical system; a second imaging portion configured to capture an image of a second light beam that travels through a second optical path shorter than the first optical path; and plural phase difference pixels for phase difference autofocus, the plural phase difference pixels being arranged in at least one of the first imaging portion and the second imaging portion, the plural phase difference pixels being configured to output phase difference signals.
Abstract:
A semiconductor device includes a semiconductor substrate, a trench capacitor arranged on the semiconductor substrate, a first wiring layer, a second wiring layer, a first TSV penetrating the semiconductor substrate outside the trench capacitor, a second TSV penetrating the semiconductor substrate outside the trench capacitor, a first connecting terminal connected to the first TSV, a second connecting terminal connected to the first TSV, a third connecting terminal connected to the second TSV, and a fourth connecting terminal connected to the second TSV. A plurality of connecting terminals including the first through fourth connecting terminals are arranged dispersively over an entire area of the first wiring layer and the second wiring layer of the semiconductor device, thereby stabilizing voltage supplied to an image unit and achieving a stable image signal.
Abstract:
An imaging apparatus includes an image sensor and a phase comparison circuit. The image sensor includes, a pixel configured to generate a video signal, a readout circuit configured to read out the video signal, an output circuit configured to output the video signal to a signal processor, a clock generation circuit configured to generate a first clock, and a first control circuit configured to cause the signal processor to output the video signal in accordance with the first clock and a synchronization signal generated by the signal processor. The phase comparison circuit makes a phase comparison between the video signal and a second clock generated by the signal processor. The clock generation circuit generates the first clock based on a power supply voltage in accordance with the phase difference signal.
Abstract:
An image sensor includes: light receiving units disposed two-dimensionally on a substrate; color filters disposed on the light receiving units and including at least one of: a blue color filter for passing both of blue light and blue-violet light; a cyan color filter for passing both of green light and the blue-violet light; and a magenta color filter for passing both of red light and the blue-violet light; a first film arranged on a light receiving unit on which the cyan color filter is disposed, among the light receiving units, the first film having a peak of reflectivity near 450 nm; and a second film arranged on a light receiving unit on which the magenta color filter is disposed, among the light receiving units, the second film having a peak of reflectivity between 450 nm and 500 nm.
Abstract:
An image sensor includes: a pixel chip provided with a plurality of pixels, a plurality of first transfer lines, and a plurality of capacitors; a circuit chip provided with a plurality of column reading circuits, a plurality of column scanning circuits, a second transfer line, and a constant current source; and a connection portion stacked and provided between the pixel chip and the circuit chip and configured to connect a capacitor, which is arranged in the pixel chip and has a trench structure, and a first transistor arranged in the circuit chip to each other via an electrode. The capacitor is configured to form a transfer capacity removing a noise included in an imaging signal and connect the pixel chip and the circuit chip to each other via the electrode and the connection portion.
Abstract:
An image sensor includes: unit pixels arranged in a two-dimensional matrix form, each unit pixel having photoelectric converters for converting received light into imaging signals; and filters having different transmission spectra and disposed on light receiving surfaces of the photoelectric converters. The image sensor is configured to: switch between signal processing units with respect to transfer destination of the imaging signals transferred from second transfer lines to a switching unit, based on types of the filters; and output the imaging signals from a single row of the unit pixels to the sample-and-hold units, in a predetermined number of times during one horizontal scanning period by dividing the unit pixels into pixel units each time the imaging signals are output so as to output the imaging signals from the photoelectric converters having the light receiving surfaces on which the filters of different types are disposed in each pixel unit.
Abstract:
An imaging element includes: a plurality of pixels where each pixel is configured to generate an imaging signal; a noise eliminating circuit configured to eliminate a noise component included in the imaging signal; a plurality of column source follower buffers where each column source follower buffer is configured to amplify the imaging signal from which the noise component has been eliminated by the noise eliminating circuit, and output the amplified signal; a horizontal scanning circuit configured to sequentially select the column source follower buffer and output the imaging signal; and a buffer circuit which is connected with the column source follower buffer sequentially selected by the horizontal scanning circuit to form a voltage follower circuit, the buffer circuit being configured to perform impedance conversion on a voltage of the imaging signal output from the column source follower buffer, and output the converted signal to an outside.