公开(公告)号：US10009994B2

公开(公告)日：2018-06-26

申请号：US14405541

申请日：2014-03-07

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomoaki Sawada ,  Takatoshi Abe ,  Shingo Yoshioka

IPC: H05K1/02 ,  C08J5/18 ,  C08K7/02 ,  C08L101/00 ,  G06F3/041 ,  H01B1/02 ,  H01L31/0224 ,  H05K1/03 ,  C08J7/04 ,  C09D105/16 ,  B32B5/02 ,  H01B1/24 ,  C09D163/00 ,  B32B15/092 ,  B32B15/08 ,  B32B3/12 ,  B32B3/26

CPC classification number: H05K1/0271 ,  B32B3/12 ,  B32B3/266 ,  B32B5/02 ,  B32B15/08 ,  B32B15/092 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2363/00 ,  C08J5/18 ,  C08J7/047 ,  C08J2300/21 ,  C08J2367/02 ,  C08J2400/21 ,  C08J2463/00 ,  C08K7/02 ,  C08L101/00 ,  C09D105/16 ,  C09D163/00 ,  G06F3/041 ,  H01B1/02 ,  H01B1/24 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0213 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/012 ,  H05K2201/0323 ,  H05K2201/0326 ,  Y10T428/24331 ,  Y10T428/24917 ,  C08L63/00

Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate α, as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.