公开(公告)号：US11990484B2

公开(公告)日：2024-05-21

申请号：US17874875

申请日：2022-07-27

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Richard Price ,  Brian Cobb ,  Neil Davies

IPC: H01L21/78 ,  H01L27/12

CPC classification number: H01L27/1262 ,  H01L21/78 ,  H01L27/1218 ,  H01L27/1266

Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

公开(公告)号：US11910533B2

公开(公告)日：2024-02-20

申请号：US17269626

申请日：2019-07-30

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Neil Davies ,  Stephen Devenport ,  Richard Price

IPC: B23K1/00 ,  H05K13/04 ,  H01L21/50 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  H01L21/60

CPC classification number: H05K13/0469 ,  B23K1/0016 ,  H01L21/50 ,  H01L24/32 ,  H01L24/83 ,  H05K1/118 ,  H05K3/323 ,  H01L2021/60277 ,  H01L2224/32148 ,  H01L2224/83203

Abstract: The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

公开(公告)号：US11637210B2

公开(公告)日：2023-04-25

申请号：US16771400

申请日：2018-12-11

Applicant: PRAGMATIC PRINTING LTD

Inventor： Feras Alkhalil ,  Richard Price ,  Brian Cobb

IPC: H01L29/872 ,  H01L27/06 ,  H01L29/417 ,  H01L29/47 ,  H01L29/66 ,  H01L29/786 ,  H01L51/05 ,  H01L29/16 ,  H01L29/20 ,  H01L29/22 ,  H01L29/24

Abstract: A Schottky diode comprises: a first electrode; a second electrode; and a body of semiconductive material connected to the first electrode at a first interface and connected to the second electrode at a second interface, wherein the first interface comprises a first planar region lying in a first plane and the first electrode has a first projection onto the first plane in a first direction normal to the first plane, the second interface comprises a second planar region lying in a second plane and the second electrode has a second projection onto the first plane in said first direction, at least a portion of the second projection lies outside the first projection, said second planar region is offset from the first planar region in said first direction, and one of the first interface and the second interface provides a Schottky contact.

公开(公告)号：US11462575B2

公开(公告)日：2022-10-04

申请号：US16964513

申请日：2019-01-30

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Richard Price ,  Brian Cobb ,  Neil Davies

IPC: H01L27/12 ,  H01L21/78

Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

公开(公告)号：US11406023B2

公开(公告)日：2022-08-02

申请号：US16643642

申请日：2018-08-16

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Richard Price ,  Stephen Devenport ,  Brian Cobb

IPC: H05K3/36 ,  H05K3/00 ,  H05K3/32

Abstract: The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising: providing (e.g. manufacturing) a flexible first structure comprising the plurality of first portions; providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs; dispensing an adhesive onto the first structure and/or onto the flexible ICs; transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on (brought into electrical contact with) a respective group of contact pads to form an electronic circuit, providing a heated surface and an opposing surface together having a gap therebetween, transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.

公开(公告)号：US11004875B2

公开(公告)日：2021-05-11

申请号：US16497636

申请日：2018-03-27

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Richard Price ,  Catherine Ramsdale ,  Brian Hardy Cobb ,  Feras Alkhalil

IPC: H01L27/12 ,  H01L21/02 ,  H01L21/027 ,  H01L21/285 ,  H01L21/306 ,  H01L21/3213 ,  H01L29/40 ,  H01L29/417

Abstract: A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.

公开(公告)号：US20170125249A1

公开(公告)日：2017-05-04

申请号：US15369159

申请日：2016-12-05

Applicant: Pragmatic Printing Ltd.

Inventor： Richard Price ,  Catherine Ramsdale

IPC: H01L21/268 ,  H01L51/00 ,  H01L21/428 ,  H01L29/786

CPC classification number: H01L21/268 ,  H01L21/428 ,  H01L29/6675 ,  H01L29/66757 ,  H01L29/66772 ,  H01L29/66969 ,  H01L29/78618 ,  H01L29/7869 ,  H01L29/78696 ,  H01L51/0027 ,  H01L51/105

Abstract: A method of manufacturing an electronic device comprises: providing a layer of semiconductor material comprising a first portion, a second portion, and a third portion, the third portion connecting the first portion to the second portion and providing a semiconductive channel for electrical current flow between the first and second portions; providing a gate terminal arranged with respect to said third portion such that a voltage may be applied to the gate terminal to control an electrical conductivity of said channel; and processing at least one of the first and second portions so as to have an electrical conductivity greater than an electrical conductivity of the channel when no voltage is applied to the gate terminal. In certain embodiments, the processing comprises exposing at least one of the first and second portions to electromagnetic radiation. The first and second portions may be laser annealed to increase their conductivities.