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公开(公告)号：US11477177B2
公开(公告)日：2022-10-18
申请号：US16646008
申请日：2018-09-11
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Brian Cobb , Scott White
Abstract: A method, apparatus and system for secure one-way RFID tag identifications provided. The method comprising generating, at an RFID tag, an auxiliary identifier; generating, at an RFID tag, a secure representation based on the auxiliary identifier; transmitting, from the RFID tag and receiving at an RFID reader, one or more representations of the auxiliary identifier and the tag identifier including the secure representation; and verifying the identity of the RFID tag based on the received representations.
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公开(公告)号：US11659669B2
公开(公告)日：2023-05-23
申请号：US16641720
申请日：2018-08-16
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Stephen Devenport , Brian Cobb
CPC classification number: H05K3/4632 , H05K3/361 , B29C65/1403 , B29L2031/3425
Abstract: One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.
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公开(公告)号：US11990484B2
公开(公告)日：2024-05-21
申请号：US17874875
申请日：2022-07-27
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Brian Cobb , Neil Davies
CPC classification number: H01L27/1262 , H01L21/78 , H01L27/1218 , H01L27/1266
Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.
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公开(公告)号：US11637210B2
公开(公告)日：2023-04-25
申请号：US16771400
申请日：2018-12-11
Applicant: PRAGMATIC PRINTING LTD
Inventor： Feras Alkhalil , Richard Price , Brian Cobb
IPC: H01L29/872 , H01L27/06 , H01L29/417 , H01L29/47 , H01L29/66 , H01L29/786 , H01L51/05 , H01L29/16 , H01L29/20 , H01L29/22 , H01L29/24
Abstract: A Schottky diode comprises: a first electrode; a second electrode; and a body of semiconductive material connected to the first electrode at a first interface and connected to the second electrode at a second interface, wherein the first interface comprises a first planar region lying in a first plane and the first electrode has a first projection onto the first plane in a first direction normal to the first plane, the second interface comprises a second planar region lying in a second plane and the second electrode has a second projection onto the first plane in said first direction, at least a portion of the second projection lies outside the first projection, said second planar region is offset from the first planar region in said first direction, and one of the first interface and the second interface provides a Schottky contact.
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Patent Agency Ranking
公开(公告)号：US11462575B2
公开(公告)日：2022-10-04
申请号：US16964513
申请日：2019-01-30
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Brian Cobb , Neil Davies
Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.
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公开(公告)号：US11406023B2
公开(公告)日：2022-08-02
申请号：US16643642
申请日：2018-08-16
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Stephen Devenport , Brian Cobb
Abstract: The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising: providing (e.g. manufacturing) a flexible first structure comprising the plurality of first portions; providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs; dispensing an adhesive onto the first structure and/or onto the flexible ICs; transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on (brought into electrical contact with) a respective group of contact pads to form an electronic circuit, providing a heated surface and an opposing surface together having a gap therebetween, transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.
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7.发明授权公开(公告)号：US11984640B2
公开(公告)日：2024-05-14
申请号：US17274237
申请日：2019-09-10
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Brian Cobb
IPC: H01L23/522 , H01L23/528 , H01L29/786 , H01Q1/22 , H05K3/36 , H05K3/46
CPC classification number: H01Q1/2208 , H01L23/5223 , H01L23/5286 , H01L29/786 , H05K3/36 , H05K3/46
Abstract: An electronic circuit is described, comprising: a first power rail; a second power rail; and a field effect transistor, FET, the FET comprising: a first terminal coupled directly or indirectly to the first power rail; a second terminal coupled directly or indirectly to the second power rail; a channel of semiconductive material connecting the first terminal to the second terminal; a gate terminal to which a voltage may be applied to control a conductivity of the channel, the channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric arranged to insulate the gate terminal from the channel. The circuit further comprises a layer or other body of dielectric material, the gate dielectric being a first portion of the layer or other body of dielectric material. The first power rail comprises a first rail portion arranged on a first side of a second portion of the layer or other body of dielectric material, and the second power rail comprises a second rail portion arranged on a second side of the second portion of the layer or other body of dielectric material, the second side being opposite the first side. The second portion of the layer or other body of dielectric material separates the first and second rail portions and with the first and second rail portions provides a capacitance to the circuit.
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公开(公告)号：US11805111B2
公开(公告)日：2023-10-31
申请号：US17870614
申请日：2022-07-21
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Brian Cobb , Scott White
CPC classification number: H04L63/0492 , H04L9/0863 , H04L9/0869 , H04L9/3236 , H04W12/47
Abstract: A method, apparatus and system for secure one-way RFID tag identification is provided. The method comprising generating, at an RFID tag, an auxiliary identifier; generating, at an RFID tag, a secure representation based on the auxiliary identifier; transmitting, from the RFID tag and receiving at an RFID reader, one or more representations of the auxiliary identifier and the tag identifier including the secure representation; and verifying the identity of the RFID tag based on the received representations.
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公开(公告)号：US11455478B2
公开(公告)日：2022-09-27
申请号：US17264645
申请日：2019-08-08
Applicant: PRAGMATIC PRINTING LTD
Inventor： Joao De Oliveira , Brian Cobb , Thomas Clark
Abstract: An RFID tag for capacitively coupled RFID communication with an RFID reader. The RFID tag comprising an integrated circuit (IC), the IC including a first RFID tag electrode arranged to capacitively couple with a first electrode of the RFID reader to form a first capacitor, and a second RFID tag electrode arranged to capacitively couple with a second electrode of the RFID reader to form a second capacitor when the RFID tag is in a first position relative to the RFID reader; power supply circuitry configured to extract power from a first time-varying signal received from the RFID reader via at least one of the first RFID tag electrode and the second RFID tag electrode, and supply the extracted power to circuitry of the RFID tag; and data transmission circuitry configured to receive the extracted power from the power supply circuitry, and transmit data to the RFID reader via at least one of the first RFID tag electrode and the second RFID tag electrode.
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