摘要:
A composition for use as an assay reagent comprises a solid support comprising a member of a signal producing system and a coating of a synthetic copolymer. The synthetic copolymer comprises a first polymerized monomer comprising a pendant moiety comprising a reactive functionality or a derivative of a reactive functionality and a second polymerized monomer comprising a pendant moiety comprising at least 1 carbon atoms and at least 2 heteroatoms. In some embodiments the copolymer comprises a polyethylenic backbone comprising the pendant moiety comprising a reactive functionality or a derivative of a reactive functionality and the pendant moiety comprising at least 1 carbon atom and at least 2 heteroatoms.
摘要:
Methods and compositions are disclosed for reducing non-specific binding in a binding assay for the determination of an analyte in a sample wherein one of the reagents for conducting the binding assay is an antibody reagent. The methods comprise treating the antibody reagent at a pH of about 2.0 to about 3.5. The method may further comprise treating the antibody reagent with a reducing agent in an amount sufficient to reduce non-specific binding of the antibody reagent. In some embodiments the reducing agent may be a thiol-containing reducing agent or a combination of two or more thiol-containing reducing agents.
摘要:
Methods, compositions and kits are disclosed directed at haptens, immunogens and immunoassays for buprenorphine (BUP) and nor buprenorphine (norBUP). The method comprises providing in combination in a medium (i) a sample suspected of containing buprenorphine (BUP) or norbuprenorphine (norBUP) and (ii) an antibody raised against an immunogen of buprenorphine (BUP) or norbuprenorphine (norBUP). The medium is examined for the presence of a complex comprising a labeled hapten of buprenorphine (BUP) or norbuprenorphine (norBUP) where the presence of such as complex indicates the presence of the compound in the sample.
摘要:
A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.
摘要:
Methods of enhancing signal ratio between calibrators in an assay for an analyte include conducting an assay for the analyte with zero concentration of analyte in a first calibrator to determine a first signal level. The reagents employed in the assay comprise an antibody reagent comprising an antibody for the analyte wherein a hinge region of the antibody is conjugated to a moiety. The assay for the analyte is also conducted with a second concentration of analyte in a second calibrator to determine a second signal level wherein the second analyte concentration is greater than zero and wherein the reagents employed in the assay comprise the antibody reagent. A ratio of the first signal level to the second signal level is determined and evaluated.
摘要:
Methods, compositions and kits are disclosed directed at haptens, immunogens and immunoassays for buprenorphine (BUP) and nor buprenorphine (norBUP). The method comprises providing in combination in a medium (i) a sample suspected of containing buprenorphine (BUP) or norbuprenorphine (norBUP) and (ii) an antibody raised against an immunogen of buprenorphine (BUP) or norbuprenorphine (norBUP). The medium is examined for the presence of a complex comprising a labeled hapten of buprenorphine (BUP) or norbuprenorphine (norBUP) where the presence of such as complex indicates the presence of the compound in the sample.
摘要:
Methods for quantitatively or qualitatively detecting an analyte in a sample and suitable reagents for this purpose, in particular to a carrier molecule to which one or more analyte-specific binding partner(s) is/are bonded and which possesses additional binding sites for a specific binding partner X or Y which is associated with a component of a signal-generating system, and to the use of such a conjugate, in particular in homogeneous binding tests.
摘要:
The present application relates to a method of making liposomes having membrane proteins incorporated therein, the method comprising: providing the membrane protein in solution; providing a solution of preformed liposomes; and incubating the mixture. Prior to the step of providing a solution of preformed liposomes, the liposomes are formed by combining a mixture of phospholipids with a solution of at least one type of unsaturated fatty acid. The methods of the present invention further relate to the method of making a reagent comprising tissue factor reconstituted into preformed liposomes. The method of the present invention for making a tissue factor reagent comprises: providing tissue factor in solution; providing a solution of preformed liposomes comprising a mixture of phospholipids and at least one type of unsaturated fatty acid; and incubating the mixture.
摘要:
Methods, compositions and articles of manufacture are provided for conducting specific binding assays to determine the concentration or presence of at least one analyte in a sample. At least two dendrimer-reagent preparations with different analyte specificities may be immobilized on a solid phase. Alternatively, at least one dendrimer-reagent preparation having multiple specificities may be immobilized on a solid phase. Immobilization is facilitated by coupling specific binding assay reagents such as polypeptide receptors or analytes with water soluble polymers. Such water soluble polymers, for example star polymers such as dendrimers, provide production advantages of lot-to-lot uniformity and homogeneity, and can enhance sensitivity due to low non-specific binding to the solid phase.
摘要:
A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.