摘要:
A packaged GaN semiconductor device with improved heat dissipation is provided. A GaN device is packaged on a printed circuit board (PCB) with a vertical side of the device, and optionally the back side of the device, in thermal contact with the PCB. The packaging is compatible with surface mount technologies such as land grid array (LGA), ball grid array (BGA), and other formats. Thermal contact between the PCB and a vertical side of the device, and optionally the back side of the device, is made through solder. The solder used for the thermal contact may also connect a source terminal of the device, which also improves electrical stability of the device. The packaging is particularly suitable for GaN HEMT devices.
摘要:
Voltage stabilizing and voltage regulating circuits implemented in GaN HEMT technology provide stable output voltages suitable for use in applications such as GaN power transistor gate drivers and low voltage auxiliary power supplies for GaN integrated circuits. Gate driver and voltage regulator modules include at least one GaN D-mode HEMT (DHEMT) and at least two GaN E-mode HEMTs (EHEMTs) connected together in series, so that the at least one DHEMT operates as a variable resistor and the at least two EHEMTs operate as a Zener diode that limits the output voltage. The gate driver and voltage regulator modules may be implemented as a GaN integrated circuits, and may be monolithically integrated together with other components such as amplifiers and power HEMTs on a single die to provide a GaN HEMT power module IC.
摘要:
Voltage stabilizing and voltage regulating circuits implemented in GaN HEMT technology provide stable output voltages suitable for use in applications such as GaN power transistor gate drivers and low voltage auxiliary power supplies for GaN integrated circuits. Gate driver and voltage regulator modules include at least one GaN D-mode HEMT (DHEMT) and at least two GaN E-mode HEMTs (EHEMTs) connected together in series, so that the at least one DHEMT operates as a variable resistor and the at least two EHEMTs operate as a Zener diode that limits the output voltage. The gate driver and voltage regulator modules may be implemented as a GaN integrated circuits, and may be monolithically integrated together with other components such as amplifiers and power HEMTs on a single die to provide a GaN HEMT power module IC.
摘要:
A hybrid rectifier that works as either a hybrid full bridge or a voltage doubler. Under 220 V AC input condition, the hybrid rectifier operates in full bridge mode, while at 110 V AC input, it operates as voltage doubler rectifier. The hybrid rectifier may be used with a DC-DC converter, such as an LLC resonant converter, in a power supply. With this mode switching, the LLC converter resonant tank design only takes consideration of 220 V AC input case, such that the required operational input voltage range is reduced, and the efficiency of the LLC converter is optimized. Both the size and power loss are reduced by using a single stage structure instead of the conventional two-stage configuration.
摘要:
Described herein are semiconductor devices and structures with improved power handling and heat dissipation. Embodiments are suitable for implementation in gallium nitride. Devices may be provided as individual square or diamond-shaped dies having electrode terminals at the die corners, tapered electrode bases, and interdigitated electrode fingers. Device matrix structures include a plurality of device dies arranged on a substrate in a matrix configuration with interdigitated conductors. Device lattice structures are based on a unit cell comprising a plurality of individual devices, the unit cells disposed on a chip with geometric periodicity. Also described herein are methods for implementing the semiconductor devices and structures.
摘要:
Hybrid modulation strategies are provided for single phase and three phase inverter topologies. According to hybrid modulation strategy embodiments, one line frequency period is divided into two operation modes based on the polarities of output voltage and output current. When polarities of the output voltage and output current are the same, a nominal voltage level modulation is used to generate the output voltage. When polarities of the output voltage and output current are opposite, a lower voltage level modulation is used to generate the output voltage. In one embodiment, a nominal voltage level modulation is five voltage level modulation, and a lower voltage level modulation is three or two voltage level modulation. Embodiments allow inverters to be constructed with fewer switches, and improve performance of multilevel inverters. The hybrid modulation strategies may be implemented in multilevel inverters such as active neutral point clamped (ANPC) and neutral point clamped (NPC) inverters.
摘要:
Dual frequency control of first and second pairs of switches of a buck-boost regulator with pass through band is disclosed. In buck and boost modes respectively a first pair of the switches is operated at high frequency and a second pair of the switches is operated at low frequency. In pass through mode, both pairs of switches are operated at low frequency. Dual frequency control and operation of the pairs of switches enables current sharing between positive and negative power leads in buck, boost and pass-through modes.
摘要:
Methods and circuits are described herein which may be used to improve the unloading transient response of a DC-DC converter. In some embodiments the transient response may be improved by improving the way MOSFET switches in the buck converter are controlled at the point in time when a current transient is detected, and subsequently during the transient, in such a way that the impact of the current transient is mitigated. In other embodiments an auxiliary current source is used to provide rapid transient response required by the overall power converter, leaving the main portion of the DC-DC converter to provide long term stability.
摘要:
An isolating coupling arrangement couples signals in both directions via a transformer between first and second (or more) units each having differential signal transmit buffers and receivers. A diode bridge and capacitor produce an isolated power supply voltage for the second unit from signals coupled from the first unit via the transformer. The diode bridge can use intrinsic diodes of CMOS output circuits of the transmit buffers, which can be controlled synchronously using a phase locked loop responsive to signals coupled from the first unit via the transformer. A supply voltage for the first unit can be increased to compensate for voltage drops of the diode bridge on start-up prior to the synchronous operation. A resistor in parallel with a diode of the bridge provides an asymmetrical load to create a DC component of transformer magnetizing current to eliminate oscillations during signal gaps.
摘要:
Described herein are semiconductor devices and structures with improved power handling and heat dissipation. Embodiments are suitable for implementation in gallium nitride. Devices may be provided as individual square or diamond-shaped dies having electrode terminals at the die corners, tapered electrode bases, and interdigitated electrode fingers. Device matrix structures include a plurality of device dies arranged on a substrate in a matrix configuration with interdigitated conductors. Device lattice structures are based on a unit cell comprising a plurality of individual devices, the unit cells disposed on a chip with geometric periodicity. Also described herein are methods for implementing the semiconductor devices and structures.