公开(公告)号：US11145977B2

公开(公告)日：2021-10-12

申请号：US16441837

申请日：2019-06-14

Applicant: RAYTHEON COMPANY

Inventor： Kevin Wilder ,  Jonathan E. Nufio-Molina ,  Phillip W. Thiessen ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Erika Klek

IPC: H01Q1/12 ,  H01Q25/00 ,  H01Q21/00 ,  H01P1/04 ,  H01Q3/30 ,  H05K1/02

Abstract: An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.

公开(公告)号：US11145952B2

公开(公告)日：2021-10-12

申请号：US16683593

申请日：2019-11-14

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Kevin Wilder ,  James E. Benedict ,  Andrew R. Southworth ,  Mary K. Herndon

IPC: H01Q3/34 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q21/00 ,  H01Q21/06

Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

公开(公告)号：US11109489B2

公开(公告)日：2021-08-31

申请号：US16541789

申请日：2019-08-15

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US20210226343A1

公开(公告)日：2021-07-22

申请号：US16744774

申请日：2020-01-16

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Gregory M. Fagerlund ,  James Benedict ,  Andrew Southworth ,  Kevin Wilder

IPC: H01Q21/06 ,  H01Q9/04 ,  B33Y80/00 ,  H01Q1/38

Abstract: An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.

公开(公告)号：US20230121347A1

公开(公告)日：2023-04-20

申请号：US18068578

申请日：2022-12-20

Applicant: RAYTHEON COMPANY

Inventor： Andrew R. Southworth ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Kevin Wilder

IPC: H05K3/34 ,  H05K3/00 ,  H05K3/42 ,  H05K3/40 ,  H01P5/02 ,  H01P1/04 ,  H05K1/02

Abstract: Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.

公开(公告)号：US11632856B2

公开(公告)日：2023-04-18

申请号：US17366836

申请日：2021-07-02

Applicant: RAYTHEON COMPANY

Inventor： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/26 ,  H05K3/30 ,  H05K5/00 ,  H05K5/06 ,  H05K9/00 ,  H01L23/34 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/00

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US20210368629A1

公开(公告)日：2021-11-25

申请号：US17395977

申请日：2021-08-06

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US20210066830A1

公开(公告)日：2021-03-04

申请号：US16552694

申请日：2019-08-27

Applicant: RAYTHEON COMPANY

Inventor： Kevin Wilder ,  Alan C. Smith ,  James Benedict ,  Andrew Southworth ,  Thomas V. Sikina ,  Mary K. Herndon ,  John P. Haven

IPC: H01R12/71 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H01R12/70 ,  H01R43/20 ,  H01R43/26

Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (PCBs). The first PCB includes a first trace, ground planes at opposite sides of the first trace, dielectric material interposed between the first trace and the ground planes and a first end. The first end is formed as a first rabbet at which the first trace is exposed. The second PCB includes a second trace, ground planes at opposite sides of the second trace, dielectric material interposed between the second trace and the ground planes and a second end. The second end is formed as a second rabbet, which is substantially identical to the first rabbet, at which the second trace is exposed. The first and second ends are mated in a shiplap joint to electrically couple the first and second traces.