Connection and build-up technique for multichip modules
    14.
    发明授权
    Connection and build-up technique for multichip modules 失效
    多芯片模块的连接和建立技术

    公开(公告)号:US5556812A

    公开(公告)日:1996-09-17

    申请号:US495246

    申请日:1995-06-27

    摘要: A method for manufacturing multichip modules having layer sequences made of dielectric material with conducting tracks embedded therein is characterized by the following features: (1) a temperature-resistant, base-resistant polymer having a dielectric constant .ltoreq.3 is used as a dielectric material, which is applied to a non-conductive substrate and serves as an edge boundary for currentless, autocatalytic build-up of the conducting tracks; (2) the dielectric material is provided with a layer made of material which is soluble in organic solvents (lift-off layer); (3) the dielectric material and the lift-off layer are structured in a single lithographic step, either a direct or an indirect structuring taking place and grooves having an aspect ratio .gtoreq.1 being formed in the dielectric material; (4) a metallic seed layer is applied to the dielectric material or rather to the lift-off layer through vapor deposition in a directed manner; (5) the lift-off layer is removed using an organic solvent; and (6) conducting tracks are created in the grooves through currentless metal deposition.

    摘要翻译: 制造具有由介电材料制成的具有导电轨迹的层序列的多芯片模块的方法的特征在于具有以下特征:(1)具有介电常数<3的耐温耐碱聚合物用作电介质 材料,其被施加到非导电衬底并且用作导电轨道的无电流,自动催化积聚的边界; (2)介电材料设有可溶于有机溶剂(剥离层)的材料制成的层; (3)电介质材料和剥离层在单个光刻步骤中构成,直接或间接构造发生,并且在电介质材料中形成具有纵横比大于等于1的沟槽; (4)通过气相沉积以有向的方式将金属种子层施加到电介质材料上或者相对于剥离层; (5)使用有机溶剂除去剥离层; 并且通过无电流金属沉积在凹槽中产生(6)导电轨迹。

    Method for the production of poly-o-hydroxyamides
    16.
    发明授权
    Method for the production of poly-o-hydroxyamides 失效
    生产聚邻羟基酰胺的方法

    公开(公告)号:US5777066A

    公开(公告)日:1998-07-07

    申请号:US666182

    申请日:1996-06-19

    CPC分类号: C08G69/26 C08G69/04 C08G73/22

    摘要: A method for producing poly-o-hydroxy amides by conversion of an activated dicarboxylic acid derivative with a bis-o-aminophenol. A solution of the activated dicarboxylic acid derivative is added to a solution of the bis-o-aminophenol in a lactone, and a tertiary amine is added to the resulting mixture, wherein the lactone has the following structure: ##STR1## where A is--(CR.sup.1 R.sup.2).sub.m --or--(CR.sup.3 R.sup.4).sub.n --NR.sup.5 --, R.sup.1 to R.sup.5 are independent of one another R.sup.1 and R.sup.2 are hydrogen, alkyl with 1 to 7 carbon atoms (linear or branched), --CO(CH.sub.2).sub.p CH.sub.3, or --COO(CH.sub.2).sub.p CH.sub.3, with p=0 or 1, R.sup.3 and R.sup.4 are hydrogen or alkyl with 1 to 3 carbon atoms (linear or branched), R.sup.5 is hydrogen or methyl, m is a whole number from 2 to 11, and n is a whole number from 1 to 3.

    摘要翻译: 通过活性二羧酸衍生物与双邻氨基苯酚的转化制备聚邻羟基酰胺的方法。 将活化的二羧酸衍生物的溶液加入到内酯中的双邻氨基苯酚的溶液中,向所得混合物中加入叔胺,其中内酯具有以下结构:其中 A是 - (CR 1 R 2)m - 或 - (CR 3 R 4)n -NR 5 - ,R 1至R 5彼此独立地R 1,R 2是氢,具有1至7个碳原子的直链或支链烷基, pCH 3或-COO(CH 2)p CH 3,其中p = 0或1,R 3和R 4是氢或具有1至3个碳原子的直链或支链的烷基,R 5是氢或甲基,m是从2到 11,n为1〜3的整数。

    Methods for producing polybenzoxazol precursors and corresponding resist
solutions
    17.
    发明授权
    Methods for producing polybenzoxazol precursors and corresponding resist solutions 失效
    聚苯并恶唑前体和相应抗蚀剂溶液的制备方法

    公开(公告)号:US5688631A

    公开(公告)日:1997-11-18

    申请号:US618488

    申请日:1996-03-19

    CPC分类号: C08G73/22 G03F7/0233

    摘要: Methods for producing solutions of polybenzoxazol precursors that are soluble in alkali and resist solutions based on such precursors. A dicarboxylic acid halogenide is reacted with a bis-(o-aminophenol) in an organic solvent and in the presence of a polymer with a tertiary N atom, which is insoluble in the solvent. Excess polymer and hydrohalogenide are separated from the reaction solution. The reaction solution is optionally mixed with a photoactive component.

    摘要翻译: 用于生产溶于碱的聚苯并恶唑前体溶液的方法和基于这些前体的抗溶液。 二羧酸卤化物与双 - (邻氨基苯酚)在有机溶剂中和在不溶于溶剂的叔N原子的存在下反应。 从反应溶液中分离出过量的聚合物和氢卤化物。 反应溶液任选地与光活性组分混合。