METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELEMENT

    公开(公告)号:US20230219808A1

    公开(公告)日:2023-07-13

    申请号:US18151631

    申请日:2023-01-09

    Abstract: A method for producing a bonding pad for a micromechanical sensor element. The method includes: depositing a first metal layer onto a top face of the functional layer, and depositing a second metal layer onto the first metal layer, wherein only the first layer or only the second layer is formed in a border region extending around a bonding pad region; covering a protective layer over a top face of the second metal layer in the bonding pad region and over the first or second metal layer in an inner peripheral portion of the border region, which inner peripheral portion adjoins the bonding pad region; etching the first or second layer at least in an outer peripheral portion of the border region down to the top face of the functional layer; removing the protective layer; carrying out an etching process starting from the top face of the layered structure.

    Laser resealing with stress-reducing prestructuring

    公开(公告)号:US10556789B2

    公开(公告)日:2020-02-11

    申请号:US15297794

    申请日:2016-10-19

    Abstract: A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.

    Structures for reducing and avoiding stresses on the seal bottom side during laser reseal

    公开(公告)号:US10023460B2

    公开(公告)日:2018-07-17

    申请号:US15333381

    申请日:2016-10-25

    Abstract: A method for manufacturing a micromechanical component including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat via laser into an absorbing part of the substrate or the cap. During the step for forming the access opening, a first access opening section is formed generally perpendicularly to a surface of the substrate or the cap, and a second access opening section is formed generally perpendicularly to and in parallel to the surface.

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