SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    14.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20130168669A1

    公开(公告)日:2013-07-04

    申请号:US13775777

    申请日:2013-02-25

    CPC classification number: H01L29/7869

    Abstract: An oxide or nitride semiconductor layer is formed over a substrate. A first conductive layer including a first element and a second element, and a second conductive layer including the second element are formed over the semiconductor layer. The first element is oxidized or nitrogenized near an interface region between the first conductive layer and the oxide or nitride semiconductor layer by heat treatment or laser irradiation. The Gibbs free energy of oxide formation of the first element is lower than those of the second element or any element in the oxide or nitride semiconductor layer.

    Abstract translation: 在衬底上形成氧化物或氮化物半导体层。 包括第一元件和第二元件的第一导电层和包括第二元件的第二导电层形成在半导体层上。 第一元件通过热处理或激光照射在第一导电层和氧化物或氮化物半导体层之间的界面区域附近被氧化或氮化。 第一元素的氧化物形成的吉布斯自由能低于第二元素或氧化物或氮化物半导体层中的任何元素的自由能。

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