公开(公告)号：US10398030B2

公开(公告)日：2019-08-27

申请号：US15987360

申请日：2018-05-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Gu Won Ji ,  Se Hun Park

IPC: H05K1/11 ,  H05K1/18 ,  H01G4/248 ,  H01G4/30 ,  H01G4/232 ,  H01G4/224 ,  H01G4/008 ,  H01G4/12

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

公开(公告)号：US10192683B2

公开(公告)日：2019-01-29

申请号：US15644185

申请日：2017-07-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Se Hun Park

IPC: H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/005

Abstract: A multilayer capacitor includes a capacitor body, dielectric layers and a plurality of first internal electrodes and second internal electrodes forming a portion of the capacitor body, the plurality of first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, the capacitor body further having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other, and a fifth surface and a sixth surface opposing each other, the first internal electrodes and the second internal electrodes being exposed through at least the third surface and the fourth surface, respectively, an insulating layer disposed in the first surface of the capacitor body, a buffer layer at least partially covering the insulating layer, and a first terminal electrode and a second terminal electrode spaced apart from each other.

公开(公告)号：US12198862B2

公开(公告)日：2025-01-14

申请号：US17957017

申请日：2022-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yeong Lim Kwon ,  Soo Hwan Son ,  Jung Min Park ,  Se Hun Park

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

Abstract: A multilayer electronic component includes a plurality of capacitance forming portions including a first dielectric layer and an internal electrode disposed in a first direction, and an intermediate layer disposed between capacitance forming portions adjacent to each other and including a second dielectric layer, a body including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body and connected to the internal electrode. The second dielectric layer includes graphene. The first dielectric layer does not include graphene, or includes graphene in a content less than a content of graphene included in the second dielectric layer.

公开(公告)号：US11733315B2

公开(公告)日：2023-08-22

申请号：US17745207

申请日：2022-05-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan Son ,  Se Hun Park ,  Byeong Cheol Moon ,  Young Ghyu Ahn

IPC: G01R27/28 ,  G01R31/64 ,  G01R27/26 ,  H01G4/30

CPC classification number: G01R31/64 ,  G01R27/2611 ,  H01G4/30

Abstract: An apparatus for detecting a stacking direction of internal electrodes of a multilayer capacitor includes a capacitor moving unit having a supply unit in which a plurality of multilayer capacitors are continuously supplied ad moving the supplied multilayer capacitors in one direction, a sensor unit including a coil, installed on the capacitor moving unit, and detecting inductance of the coil when each of the multilayer capacitors approaches the coil to determine a stacking direction of internal electrodes of the multilayer capacitor based on the detected inductance of the coil, and a separating unit installed on the capacitor moving unit and separating a multilayer capacitor selected as an unsuitable multilayer capacitor by the sensor unit.

公开(公告)号：US11309133B2

公开(公告)日：2022-04-19

申请号：US16860704

申请日：2020-04-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Hun Gyu Park ,  Se Hun Park ,  Gu Won Ji

IPC: H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H05K1/11 ,  H05K1/18

Abstract: The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular. The third and fourth connection terminals include a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular.

公开(公告)号：US11133132B2

公开(公告)日：2021-09-28

申请号：US16854237

申请日：2020-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Se Hun Park ,  Hun Gyu Park ,  Tae Hoon Kim ,  Gu Won Ji

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/232 ,  H05K1/18 ,  H05K1/11

Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.

公开(公告)号：US20210076499A1

公开(公告)日：2021-03-11

申请号：US16846806

申请日：2020-04-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Se Hun Park ,  Hun Gyu Park ,  Woo Chul Shin ,  Ji Hong Jo

IPC: H05K1/18 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/11

Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

公开(公告)号：US10453616B2

公开(公告)日：2019-10-22

申请号：US16049174

申请日：2018-07-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Hun Park ,  Gu Won Ji ,  Heung Kil Park

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H01G4/01 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01G4/005 ,  H01G4/248 ,  H05K3/34

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

公开(公告)号：US09978523B1

公开(公告)日：2018-05-22

申请号：US15651703

申请日：2017-07-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Jong Hwan Park ,  Se Hun Park

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of first and second internal electrodes, the capacitor body having a first surface and a second surface opposing each other, the capacitor body having a third surface and a fourth surface connected to the first surface and the second surface and opposing each other, and first and second band portions extended from the first and second connection portions to portions of the first surface and the second surface of the capacitor body and portions of a fifth surface and a sixth surface of the capacitor body, respectively, an insulating layer covering the first and second band portions, and a first terminal electrode and a second terminal electrode covering the first and second external electrodes, and portions of the insulating layer disposed on the first surface of the capacitor body and spaced apart from each other.

公开(公告)号：US12033803B2

公开(公告)日：2024-07-09

申请号：US17706785

申请日：2022-03-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Man Su Byun ,  Se Hun Park ,  Soo Hwan Son ,  Taek Jung Lee

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/1218 ,  H05K1/111 ,  H05K2201/10015

Abstract: A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein AV indicates a total area of the at least one hole, AB indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and AV/AB is greater than 0.012 and less than 0.189.