公开(公告)号：US20190131689A1

公开(公告)日：2019-05-02

申请号：US15997748

申请日：2018-06-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook PARK ,  Tah Joon PARK ,  Jae Hyun JUNG ,  Hwa Sun LEE ,  Seong Hun NA

IPC: H01Q1/22 ,  H01Q1/44 ,  H01Q1/40 ,  H01L23/552 ,  H01L23/538 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  G06K19/077

CPC classification number: H01Q1/2283 ,  G06K19/07749 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01Q1/40 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q21/0075 ,  H01Q21/0087 ,  H01Q21/065 ,  H01Q21/30 ,  H01L2224/81

Abstract: A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.

公开(公告)号：US20190019939A1

公开(公告)日：2019-01-17

申请号：US15972499

申请日：2018-05-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Jae Hyun JUNG ,  Seong Hun NA

IPC: H01L41/09 ,  H01L41/053 ,  H03H9/64 ,  H01L41/23

Abstract: An acoustic wave device includes an acoustic wave generator, a support portion, a protective member, and at least one element embedded in the protective member. The acoustic wave generator is disposed on a surface of a substrate. The support portion is disposed on the substrate along a circumference of the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by an interval.

公开(公告)号：US20180159496A1

公开(公告)日：2018-06-07

申请号：US15674833

申请日：2017-08-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Hun NA ,  Jae Hyun JUNG ,  Seung Wook PARK

IPC: H03H9/02 ,  H03H3/08 ,  H01L41/09 ,  H01L41/18 ,  H03H9/145 ,  H01L41/332

CPC classification number: H03H9/02574 ,  H01L41/09 ,  H01L41/18 ,  H01L41/332 ,  H03H3/08 ,  H03H9/02614 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/145

Abstract: An acoustic wave filter device includes a substrate, a filter disposed on the substrate, a wall member disposed on the substrate and surrounding the filter, and a cap member disposed above the wall member and, with the wall member, forming an internal space. The cap member has a curved shape and comprises a first cap member comprising a first material and a second cap member comprising a second material.